• 한국초전도학회:학술대회논문집
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• v.9
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• pp.300-304
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• 1999

To tap the feasibility of exploiting the 2$^{nd}$ phases as flux-pinning centers in the (Bi,Pb)$_2Sr_2Ca_2CuO_{10}$ superconductor, the size and the distribution of the precipitates have been controlled by changing reaction temperature and time, oxygen partial pressure Po$_2$ and annealing condition. Various annealing heat treatments were also conducted on the as-received 61 filament Bi-2223 tapes with Bi$_{1.8}Pb_{0.4}Sr_2Ca_{2.2}Cu_3O_8$ starting composition and annealed specimen were analyzed with XRD, SEM, EDS and TEM.. The grain size of (Ca,Sr)$_2$(BiPb)O$_4$ or Bi$_{0.5}Pb_3Sr_2Ca_2CuO_{\delta}$ was controllable by optimizing the heat treatment condition and critical current density (J$_c$) showed dependence on the size of the 2$^{nd}$ phases.

• Korean Journal of Materials Research
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• v.14 no.11
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• pp.790-794
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• 2004

Ultra-fine Copper particles for a conductive paste in electric-electronic field were prepared using wet-reduction process with hydrazine hydrate ($N_{2}H_4{\cdot}H_{2}O$) as a reductor. The effect of reaction conditions such as the amount of dispersion ($Na_{4}O_{7}P_2{\cdot}10H_{2}O$) and reductor ($N_{2}H_4{\cdot}H_{2}O$) on the particle size and shape for the prepared Cu powders was investigated. The quantity of dispersion and reductor varied from 0 to 0.0025 M and from 5 to 40 ml at a reaction temperature of $70^{\circ}C$, respectively. The particle size, shape, and structure for the obtained Cu particles were characterized by means of XRD, SEM, TEM, EDS and TGA. The aggregation of Cu particles was reduced with relatively increasing of the amount of dispersion at fixed other reaction conditions. The smaller Cu particle with size of approximately 300nm was obtained from 0.032 M $CuSO_4$ with adding of 0.0025 M $Na_{4}O7P_2{\cdot}10H_{2}O$ and 40ml $N_{2}H_4{\cdot}H_{2}O$ at a reaction temperature of $70^{\circ}C$.

• Journal of Hydrogen and New Energy
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• v.26 no.3
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• pp.221-226
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• 2015

Ru catalysts supported on $CeO_2$ were synthesized by an impregnation method and characterized by numerous analytical techniques including X-ray diffraction (XRD), Brunauer-Emmett-Teller (BET), transmission electron microscopy (TEM), and scanning electron microscopy-energy dispersive X-ray spectroscopy (SEM-EDS). Upon utilization of these catalysts for methane dry reforming with a $CH_4/CO_2$ ratio of 1:1 at different temperatures ranging from 550 to $750^{\circ}C$, the $Ru/CeO_2$ catalysts have shown to be active. In particular, Ru(0.55wt%) supported on $CeO_2$ (1) prepared by a hydrothermal method exhibited excellent activity with the conversion of > 75% at $750^{\circ}C$. In addition, the catalyst also proved to be highly stable for at least 47 h without catalyst deactivation under the dry reforming conditions.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.412-412
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• 2008

ENIG(Electroless Nickel Immersion Gold)is a surface treatment method that is used most widely at fine pitch's SMT and BGA packaging process. ENIG has good diffusion barrier of Ni against solder and good wettability due to Au finish. But when the discoloration occurred on the Au finish of ENIG, some key characteristics related to the quality and reliability of PCB such as bondability, solderability and electrical flowing of packaging process could be deteriorated. In this paper, we have performed the water dip test ($88^{\circ}C$ purified water) which accelerates the galvanic corrosion of Ni diffused from the Ni-P layer. That is, the excessive oxidation of the Ni layer could result in non-wetting of the solder because the flux may not be able to remove excessive oxides. Though Au discoloration have been reported to be caused by Ni oxides in many literature, it is still open to verify and discuss The microstructures and chemical compositions have been investigated using FE-SEM, TEM, FIB, EDS and XPS. As a result, authors have found that the Au discoloration in ENIG type is severely caused by the oxidation of the Ni and the mechanism of Au discoloration can be confirmed through the experiment result of water dip test.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• Journal of Advanced Marine Engineering and Technology
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• v.22 no.5
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• pp.660-669
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• 1998

In this paper the Hardness and Electro-chemical corrosion of the Nimonic 80A superalloy were studied. It aging heat treatments was carried out at $650^{\circ}C$, $700^{\circ}C$, $750^{\circ}C$,$800^{\circ}C$ and $850^{\circ}C$ with different time of 20min , 30min 1hour, 2hours, 4hours, and 16hours additionally 64hours and 128hours at $650^{\circ}C$. The obtained results were as follows; 1. As aging temperature increased the time for the maximum hardness was reduced from 128hours at $650^{\circ}C$ to 30min at $850^{\circ}C$ whereas the highest hardness was reduced from Hv 381 at $650^{\circ}C$ to Hv 321 at $850^{\circ}C$. 2. In the Electro-chemical corrosion test as a function of aging heat treatment time and tem-perature the corrosion potential was reversely proportional to Hardness which indicated the effects of ${\gamma}/{\gamma}'$ coherency of base material and precipitate. 3. Initiation point of the pitting was observed at grain boundary twin boundary and near${\gamma}'$ pre-cipitates. The results of composition analysis by EDS at this point indicated that sulphur originat-ed from 1N $H_2SO_4$ solution was found in depletion at the grain boundaries and the pit which arouse in the near precipitates were lack of Al Ti and Ni which are the main element of ${\gamma}'$ The depletion of such element was cause breakdown of passive film.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.9
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• pp.1175-1182
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• 2001

Chemical compositions of polydisperse SiO$_2$/TiO$_2$multicomponent aggregates were measured for different heights from the burner surface and different mobility diameters of aggregates. SiO$_2$/TiO$_2$multicomponent particles were generated in a hydrogen/oxygen coflow diffusion flame from two sets of precursors: TTIP(titanium tetraisopropoxide), TEOS(tetraethylorthosilicate). To maintain 1:1 mole ratio of TTIP:TEOS vapor, flow rate of carrier gas $N_2$was fixed at 0.6lpm for TTIP, at 0.1lpm for TEOS. In-situ sampling probe was used to supply particles into DMA(differential mobility analyzer) which was calibrated with using commercial DMA(TSI, model 3071A) and classifying monodisperse multicomponent particles. Classified monodisperse particles were collected with electrophoretic collector. The distributions of composition from particles to particle were determined using EDS(energy dispersive spectrometry) coupled with TEM(transmission electron microscope). The chemical(atomic) compositions of classified monodisperse particle were obtained for different heights; z=40mm, 60mm, 80mm. The results suggested that the chemical(atomic) composition of SiO$_2$decreased with the height from burner surface and the composition of SiO$_2$and TiO$_2$approached to the value of 1 to 1 fat downstream. It is also found that the composition of SiO$_2$decreases as the mobility diameter of aggregate increases.

• Korean Journal of Materials Research
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• v.11 no.10
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• pp.879-888
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• 2001

The effects of final annealing temperature on the microstructure and creep characteristics were investigated for the Zr-lNb-0.2X (X=0, Mo, Cu) and Zr-lNb- 1Sn-0.3Fe-0.1X (X=0, Mo, Cu) alloys. The microstructures were observed by using TEM/EDS, and grain size and distributions of precipitates were analyzed using a image analyzer. The creep test was performed at $400^{\circ}C$ under applied stress of 150 MPa for 10 days. The $\beta$-Zr was observed at annealing temperature above $600^{\circ}C$. In the temperature above$ 600^{\circ}C$, the grain sizes of both alloy systems appeared to be increased with increasing the final annealing temperature. The creep strengths of Zr-1Nb-1Sn-0.3Fe-0.1X alloys were higher than those of Zr-1Nb-0.2X ones due to the effect of solid solution hardening by Sn in Zr-lNb-lSn-0.3Fe-0.1X alloy system. Also, Mo addition showed the strong effect of precipitate hardening in both alloy systems. The creep strength rapidly decreased with increasing the annealing temperature up to $600^{\circ}C$. However, a superior creep resistance was obtained in the sample that annealed to have a second phase of $\beta$-Zr. It was considered that the appearance of $\beta$-Zr would play an important role in the strengthening mechanism of creep deformation.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.139-139
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• 2017

최근 환경오염 문제로 인한 연비 규제 강화 속도가 빨라지고 있으며 이에 따른 연비 향상 기술이 크게 대두 되고 있다. 연비 향상 기술 중 경량화 방안소재로 알루미늄(Al), 마그네슘(Mg) 등의 비철금속을 주로 사용하고 있으며, 이중 알루미늄은 다른 경량화 금속소재보다 우수한 경쟁력을 가지고 있다. 하지만 경제적인 측면에서 철 대비 비용적인 어려움을 가지고 있고 용접성이 떨어지기 때문에, 자동차 부품의 일부만 알루미늄 소재를 선택하여 사용하고 있는 실정이며 알루미늄의 높은 이온화 경향으로 인해 기존 자동차 철강 소재와 접촉 시 쉽게 부식되는 단점을 가지고 있다. 이러한 문제점을 해결하기 위해서는 알루미늄의 금속원소를 첨가하는 연구가 지속적으로 개발 되고 있다. 알루미늄 합금에서 마그네슘의 첨가는 좋은 용접성과 내식성, 강도를 향상시킨다. 하지만 3%이상의 마그네슘 첨가는 입계에 ${\beta}(Al_xMg_y)$석출상이 석출되게 되며, 입계에 연속적으로 형성된 ${\beta}(Al_xMg_y)$석출상은 응력 부식 균열 (Stress corrsion cracking)과 입계 부식(Intergranular corrosion)을 야기하는 결과를 가져온다고 알려져 있다. 이 문제를 해결하기 위해 Al 5000계열 합금의 Zn의 첨가를 통해 ${\tau}(Al_xMg_yZn_z)$을 입계에 석출시켜서 입계에 ${\beta}(Al_xMg_y)$상의 석출을 방지함으로써 내식성을 향상시키거나 Al 5000계열 합금의 열처리를 통해 ${\beta}(Al_xMg_y)$석출상을 고용시킴으로써 응력부식균열의 발생을 억제하는 연구도 있다. 하지만 열처리 후 Polarization test를 이용한 내식성 연구는 잘 안 알려져 있다. 따라서 이번 연구에서는 Al5000계열의 주조한 합금을 DSC분석을 통하여 ${\beta}(Al_xMg_y)$석출상의 고용 온도가 약 $470^{\circ}C$라는 것을 확인한 후, 실온에서 $100^{\circ}C/hr$으로 가열하고 조건에 따라 $450^{\circ}C$에서 3시간, 6시간, 12시간, 24시간, 30시간 항온 유지시킨 후 공냉을 진행하였다. 열처리를 마친 시편은 에폭시를 이용하여 마운팅 하였으며, 시편표면을 2000#까지 연마 후 증류수로 세척한 다음 질소를 이용하여 건조 후 분극 시험을 진행하였다. 3.5wt% NaCl 용액에서 분극 곡선을 통해 부식거동을 확인한 결과 24시간까지 시간이 증가 할수록 내식성이 우수해지는 것을 확인하였으며, 추가적으로 조직사진, SEM & EDS 분석과 XRD, TEM 분석을 통해 내식성은 입계에 존재하는 Mg의 조성이 감소하게 되면 내식성이 향상되는 것을 관찰하였다.

• Journal of Sensor Science and Technology
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• v.24 no.1
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• pp.41-46
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• 2015

In this work, pure hierarchical ZnO structure was prepared using a simple hydrothermal method, and Ag nanoparticles doped hierarchical ZnO structure was synthesized uniformly through photochemical route. The reduced graphene oxide (rGO) has been synthesized by typical Hummer's method and reduced by hydrazine. Prepared Ag/ZnO nanostructures are uniformly dispersed on the surface of rGO sheets using ultrasonication process. The synthesized samples were characterized by SEM, TEM, EDS, XRD and PL spectra. The average size of prepared ZnO microspheres was around $2{\sim}3{\mu}m$ and showed highly uniform. The average size of doped-Ag nanoparticles was 50 nm and decorated into ZnO/rGO network. The $C_2H_2$ gas sensing properties of as-prepared products were investigated using resistivity-type gas sensor. Ag/ZnO-rGO based sensors exhibited good performances for $C_2H_2$ gas in comparison with the Ag/ZnO. The $C_2H_2$ sensor based on Ag/ZnO-rGO had linear response property from 3~1000 ppm of $C_2H_2$ concentration at working temperature of $200^{\circ}C$. The response values with 100 ppm $C_2H_2$ at $200^{\circ}C$ were 22% and 78% for Ag/ZnO and Ag/ZnO-rGO, respectively. In additions, the sensor still shows high sensitivity and quick response/recovery to $C_2H_2$ under high relative humidity conditions. Moreover, the device shows excellent selectivity towards to $C_2H_2$ gas at optimal working temperature of $200^{\circ}C$.