• Journal of information and communication convergence engineering
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• 제6권2호
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• pp.122-128
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• 2008

Multiprocessor architectures and platforms, such as, a multiprocessor system on chip (MPSoC) recently introduced to extend the applicability of the Moore's law, depend upon concurrency and synchronization in both software and hardware to enhance design productivity and system performance. With the rapidly approaching billion transistors era, some of the main problem in deep sub-micron technologies characterized by gate lengths in the range of 60-90 nm will arise from non scalable wire delays, errors in signal integrity and non-synchronized communication. These problems may be addressed by the use of Network on Chip (NOC) architecture for future System-on-Chip (SoC). We have modeled a concurrent architecture for a customizable and scalable NOC in a system level modeling environment using MLDesigner (from MLD Inc.). Varying network loads under various traffic scenarios were applied to obtain realistic performance metrics. We provide the simulation results for latency as a function of the buffer size. We have abstracted the area results for NOC components from its FPGA implementation. Modeled NOC architecture supports three different levels of quality-of-service (QoS).

• 한국정밀공학회지
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• 제16권6호
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• pp.133-140
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• 1999

In this study, a monitoring method to detect chip disposal state in drilling system based on neural network was proposed and its performance was evaluated. If chip flow is bad during drilling, not only the static component but also the fluctuation of dynamic component of drilling. Drilling torque is indirectly measured by sensing spindle motor power through a AC spindle motor drive system. Spindle motor power being measured drilling, four quantities such as variance/mean, mean absolute deviation, gradient, event count were calculated as feature vectors and then presented to the neural network to make a decision on chip disposal state. The selected features are sensitive to the change of chip disposal state but comparatively insensitive to the change of drilling condition. The 3 layerd neural network with error back propagation algorithm has been used. Experimental results show that the proposed monitoring system can successfully recognize the chip disposal state over a wide range of drilling condition even though it is trained under a certain drilling condition.

• ETRI Journal
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• 제27권5호
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• pp.497-503
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• 2005

In this paper, we present a performance analysis for an MPEG-4 video codec based on the on-chip network communication architecture. The existing on-chip buses of system-on-a-chip (SoC) have some limitation on data traffic bandwidth since a large number of silicon IPs share the bus. An on-chip network is introduced to solve the problem of on-chip buses, in which the concept of a computer network is applied to the communication architecture of SoC. We compared the performance of the MPEG-4 video codec based on the on-chip network and Advanced Micro-controller Bus Architecture (AMBA) on-chip bus. Experimental results show that the performance of the MPEG-4 video codec based on the on-chip network is improved over 50% compared to the design based on a multi-layer AMBA bus.

• JSTS:Journal of Semiconductor Technology and Science
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• 제5권4호
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• pp.255-261
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• 2005

With the advent of sub-90nm technologies, the system-on-chip (SoC) and system-in-package (SiP) are becoming the trend in delivering low-cost, low-power, and small-form-factor consumer electronic systems running at multiple GHz. The shortened transistor channel length reduces the transistor switching cycles to the range of several picoseconds, yet the time-of-flights of the critical on-chip and off-chip interconnects are in the range of 10 picoseconds for 1.5mm-long wires and 100 picoseconds for 15mm-long wires. Designers realize the bottleneck today often lies at chip-to-chip interconnects and the industry needs a good model to compute the inductance in these parts of circuits. In this paper we propose a new method for extracting accurate equivalent inductance circuit models for SPICE-level circuit simulations of system-on-chip (SoC) and system-in-package (SiP) designs. In our method, geometrical meshes are created and numerical methods are used to find the solutions for the electromagnetic fields over the fine meshes. In this way, multiple-GHz SoC and SiP designers can use accurate inductance modeling and interconnect optimization to achieve high yields.

• 전기학회논문지
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• 제58권1호
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• pp.107-112
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• 2009

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

• 센서학회지
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• 제20권3호
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• pp.162-167
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• 2011

In this paper, we propose a vision system using a field programmable gate array(FPGA) and a smart vision chip. The output of the vision chip is varied by illumination conditions. This chip is suitable as a surveillance system in a dynamic environment. However, because the output swing of a smart vision chip is too small to definitely confirm the warning signal with the FPGA, a modification was needed for a reliable signal. The proposed system is based on a transmission control protocol/internet protocol(TCP/IP) that enables monitoring from a remote place. The warning signal indicates that some objects are too near.

• 전기학회논문지P
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• 제53권3호
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• pp.129-133
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• 2004

As In DS/CDMA(direct sequence code division multiple access) system, the system capacity is limited by multiple access interference(MAI), and self-interference(SI) resulting from the multi-path propagation of the desired user signal. This paper, which the approximated analytic chip waveforms are nearly the same as the computer generated chip waveforms are shown. And then, the BER(Bit Error Rate) performances in CDMA system using the approximated analytic chip waveforms are shown.

• 대한전자공학회논문지SD
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• 제39권12호
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• pp.1045-1054
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• 2002

System-On-a-Chip(SOC)에 대하여 테스트 데이터 압축 및 저전력 스캔테스팅에 대한 새로운 알고리즘을 제안하였다. 스캔벡터내의 don't care 입력들을 저전력이 되도록 적절하게 값을 할당하였고 높은 압축율을 갖도록 적응적 인코딩을 적용하였다. 또한 스캔체인에 입력되는 동안 소모되는 scan-in 전력소모를 최소화하도록 스캔벡터의 입력 방향을 결정하였다. ISCAS 89 벤치마크 회로에 대하여 실험한 결과는 평균전력 소모는 약 12% 감소되었고 압축율은 약 60%가 향상됨을 보였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.366-370
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• 2002

A kinematic ball bar measurement system can analyze the various errors of a machine tool easily and rapidly in a procedure and can measure many types of equipment such as chip mounter, PCB router, precision stage, etc. In this paper, the thermally induced errors are loused among various errors of a chip mounter because it affects the accuracy of the machine very much. Linear regression technique is adapted for the thermal error modeling. While the measurement and calibration of a chip mounter is difficult in general, this developed system is not only easy to apply for it but also improves the accuracy by 4 times or more.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권3호
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• pp.198-206
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• 2011

This paper presents a new programmable compensation circuit (PCC) for a System-on-Chip (SoC). The PCC is integrated with $0.18-{\mu}m$ BiCMOS SiGe technology. It consists of RF Design-for-Testability (DFT) circuit, Resistor Array Bank (RAB) and digital signal processor (DSP). To verify performance of the PCC we built a 5-GHz low noise amplifier (LNA) with an on-chip RAB using the same technology. Proposed circuit helps it to provide DC output voltages, hence, making the RF system chain automatic. It automatically adjusts performance of an LNA with the processor in the SoC when it goes out of the normal range of operation. The PCC also compensates abnormal operation due to the unusual PVT (Process, Voltage and Thermal) variations in RF circuits.