• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.6
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• pp.1211-1217
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• 2005

Current generation embedded systems are built around only a small number of SOCs, which are again based on general-purpose embedded micro-processors, such as ARM and MIPS. These RISC-based processors are not, however, designed for specific functions such as networking and multimedia processing, whose importances have increased dramatically in recent years. Network devices for small business and home networks, are especially dependent upon such SOCs based on general processors. Except for PHY and MAC layer functions, which are built with hardware, all the network functions are processed by the embedded micro-processor. Enabling technologies such as VDSL and FTTH promise Internet access with a much higher speed, while at the same time explore the limitations of general purpose microprocessors. In this paper we design a network processor, embed it into an SOC for Home gateway, evaluate the performance rigorously, and gauge a possibility for commercialization.

• Proceedings of the KIEE Conference
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• 2000.07b
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• pp.1071-1073
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• 2000

The use of HDL(Hardware Description Language) is now central to the ASIC(Application Specific Integrated Circuit). HDL-based ASIC can simplify the process of development and has a competition in market because it reduce the consuming time for the design of IC(Integrated circuit) in system level. Therefore, the development of power electronics system on chip (SOC), to design microcontroller and switching logic as one chip, is required extremely for the purpose of having reliability and low cost in power electronics which is based on switching elements. The major application of SOC is variable converter, active filter inverter for induction motor. UPS and power supply with a view to reducing electro-magnetic pollution.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.7
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• pp.1418-1423
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• 2009

This paper describes the design and implementation of a System-on-a-Chip (SoC) for image processing applications to use in wearable/mobile products. The target Soc consists of LEON 2 core, AMBA/APB bus-systems and custom-designed controllers. A new FPGA-based prototyping platform is implemented and used for design and verification of the target SoC. To ensure that the implemented SoC satisfies the required performances, an image processing application is performed.

• Proceedings of the IEEK Conference
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• 2002.07a
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• pp.228-230
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• 2002

We present a new low power scan testing and test data compression method for System-On-a-Chip (SOC). The don't cares in unspecified scan vectors are mapped to binary values for low power and encoded by adaptive encoding method for higher compression. Also, the scan-in direction of scan vectors is determined for low power. Experimental results for full-scanned versions of ISCAS 89 benchmark circuits show that the proposed method has both low power and higher compression.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.695-698
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• 1998

Today SOC(system on a chip) is a trend in VLSI design society. Especially MML(merged memory Logic) process provides designers with good chances to implement SOC which is consists of DRAM, SRAM, Logic and A/D mixed mode ciruit blocks. Designers need good circuit library which is reliable and easy to tune for specific design. For this need we present semi-automated analog compiler methodology. And we aplied this design methodology to resistor-string DAC design.

• Journal of information and communication convergence engineering
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• v.9 no.6
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• pp.729-732
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• 2011

Power consumption during testing System-On-Chip (SOC) is becoming increasingly important as the IP core increases in SOC. We present a new algorithm to reduce the scan-in power using the modified scan latch reordering and clock gating. We apply scan latch reordering technique for minimizing the hamming distance in scan vectors. Also, during scan latch reordering, the don't care inputs in scan vectors are assigned for low power. Also, we apply the clock gated scan cells. Experimental results for ISCAS 89 benchmark circuits show that reduced low power scan testing can be achieved in all cases.

• Journal of KIISE:Computer Systems and Theory
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• v.31 no.3_4
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• pp.160-169
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• 2004

With an emergence of SOC from developed IC technology, the VLSI design has required the core re-use technique and modular test development. To minimize the cost of testing SOC, an efficient method is required to optimize the test time and area overhead in conjunction for the core test wrapper, which is one of the important elements for SOC test architecture. In this paper, we propose an efficient design strategy of core test wrapper to achieve the minimum cost for SOC testing. The proposed strategy adopted advantages of traditional methods and more developed to be successfully used in practice.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.12
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• pp.83-90
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• 2004

This paper proposes an efficient scan testing method for compression of test input data and reduction of test power for SOC. The proposed method determines whether some parts of a test response can be reused as a part of next input test data on the analysis of deterministic test data and its response. Our experimental results show that benchmark circuits have a high similarity between un-compacted deterministic input test data and its response. The proposed testing method achieves the average of 29.4% reduction of power dissipation based on the number of test clock and 69.7% reduction of test data for ISCAS'89 benchmark circuits.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.37 no.5
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• pp.56-61
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• 2000

Silicon semiconductor technology agrees that the number of transistors on a chip will keep growing exponentially, and it is pushing technology toward the System-On-Chip. In SoC Design, Specification at system level is key of success. Executable Specification reduces verification time. This Paper describes the design of IMDCT for MPEG Audio Decoder employing system-level design methodology and Executable Specification Methodology in the VHDL simulator with FLI environment.