• Title/Summary/Keyword: System semiconductor

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Analyses of Spectral Behaviors of Semiconductor Lasers under Weak Optical Injection Locked to External Light Injected

  • Kim, Jung-Tae
    • Journal of information and communication convergence engineering
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    • v.7 no.4
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    • pp.556-560
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    • 2009
  • We have investigated the spectral characteristics of semiconductor lasers locked to the external light injected from a modulated laser. study on FM sideband injection locking has shown that when SLs are locked to the target sidebands of the directly modulated ML, the presence of the unselected sidebands influences the resulting microwave signals. The unselected signals can produce the unwanted beat signals around the desired beat signal, which degrade the overall system performance. This analysis way to generate Giga HZ signal generation.

OLED용 Al 음전극 제작 및 I-V 특성

  • Geum Min-Jong;Gwon Gyeong-Hwan
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2005.09a
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    • pp.102-105
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    • 2005
  • In this study Al electrode for OLED was deposited by FTS(Facing Targets Sputtering) system which can deposit thin films with low substrate damage. The Al thin films were deposited on the cell (LiF/EML/HTL/Bottom electrode) as a function of working gas such as Ar, Kr or mixed gas. Also Al thin films were prepared with working gas pressure (1, 6 mTorr ). The film thickness and I-V curve of Al/cell were evaluated by $\alpha$-step and semiconductor parameter (HP4156A) measurement.

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Design and Analysis of the Basic Components for the Semiconductor Wafer Cleaning Equipment Monitoring System (반도체 웨이퍼 세정 장비 모니터링 시스템을 위한 기본 요소의 분석 및 설계)

  • Kang, Ho-Seok;Rim, Seong-Rak
    • The Transactions of the Korea Information Processing Society
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    • v.7 no.1
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    • pp.115-125
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    • 2000
  • In this paper, we suggest the basic components of monitoring system for the semiconductor wafer cleaning equipment and a monitoring system model based on these components. Basic component is defined as a mandatory function which consists of communication with the control system, user interface, communication with the remote monitoring system, management of monitoring data and inter-task communication. We have defined the function of each component and the relation among them, and designed each component as a task. To evaluate the validity of the suggested model, we have implemented the basic components using the Visual C++ on Windows NT and applied them to the Monitoring System for the semiconductor wafer cleaning equipment.

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Development on the High Concentration Ozone Generator System for the Semiconductor Photoresist Strip Process (반도체 감광막 제거공정 적용을 위한 고농도 오존발생장치 개발)

  • Son, Young-Su;Ham, Sang-Yong
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.55 no.12
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    • pp.591-596
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    • 2006
  • we have been developed on the ultra high concentration ozone generator system which is the core technology in the realization of the semiconductor photoresist strip process using the ozone-vapor chemistry. The proposed ozone generator system has the structure of the surface discharge type which adopt the high purity ceramic dielectric tube. We investigate the performance of the proposed ozone generator system experimentally and the results show that the system has very high ozone concentration characteristics of $19.7[wt%/O_2]$ at the flow rate of $0.3[{\ell}/min]$ of each discharge cell. As a result of the silicon wafer photoresist strip test, we obtained the strip rate of about 400[nm/min] at the ozone concentration of $16[wt%/O_2]$ and flow rate of $8[{\ell}/min]$. So, we confirmed that it's possible to use the proposed high concentration ozone generator system for the ozone-vapor photoresist strip process in the semiconductor and FPD industry.

An Analysis of Vibration Characteristics in Ultrasonic Object Levitation Transport System (초음파를 이용한 물체 부상 이송시스템의 진동 특성 해석)

  • Jeong S.H.;Kim H.U.;Choi S.B.;Kim G.H.;Park J.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.415-418
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    • 2005
  • In the semiconductor and optical industry, a new transport system which can replace the conventional transport systems is required. The transport systems are driven by the magnetic field and conveyer belts. The magnetic field may damage semiconductor and the contact force may scratch the optical lens. The ultrasonic wave driven system can solve these problems. In this semiconductor and optical industry, the non-contact system is required fur reducing the damages. The ultrasonic transportation is the solution of the problem. In this paper, the ultrasonic levitation system fur levitating object are proposed. The 3D vibration profiles of the beam are measured by Laser scanning Vibrometer fur verifying the vibration characteristics of the system and the amplitudes of the beam and the levitation heights of object are measured for evaluating the performance.

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FPD 공정을 위한 램프하우스 열전달 특성 연구

  • Kim, Tae-An;Seo, Won-Ho;Kim, Jun-Hyeon;Kim, Yun-Je
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2006.10a
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    • pp.132-137
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    • 2006
  • With the help of the development of digital-multimedia in the middle of 1990's, FDP(Flat Panel Display) had attracted considerable attention. Collimation proximity exposure system that transfers the pattern on wafer or glass exactly using mask and light with appropriate wavelength is core process in semiconductor and liquid display element. The performances of resolution required in precision exposure system are evaluated by resolving power, depth of focus and storage area. Most of development has targeted on these three factors. The optical design including lamp house has played an important role on the performance of exposure process. In this study, we evaluate the cooling system, concerning on exposure device with mercury lamp among the kernel equipment for the production of LCD, to prevent the instability of lighting due to long term accumulation of excessive heating inside the lamp house. Numerical analysis is conducted on full-scale model. The characteristics of three-dimensional flow, pressure and temperature distribution on exposure system are graphically depicted to estimate the whole cooling system for lamp house and to establish the design criteria.

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Development of an Energy MonItorIng System for Gas Scrubber (반도체 공정장비 Gas Scrubber의 에너지 모니터링 시스템개발)

  • Kim, Sun-Man;Im, Ik-Tea;Ahn, Kang-Ho
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.2
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    • pp.13-17
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    • 2011
  • We have developed a new energy-consuming monitoring system that has made it possible to measure the energy consumption of a gas scrubber, one of semiconductor processing equipments, and installed this system to the gas scrubber under operating at a manufacture site. Using this system, we have measured consumptions of electric power and processing gas consumed at standby to operating mode. In case of the gas scrubber, processing gas flows continuously into it at standby and operating mode. Therefore, if the electric power has been supplied, the processing gas can flows into the device for 24 hours. Moreover, at operating of gas scrubber, the amount of electricity consumption is 5 kWh. At Standby of gas scrubber, it spends 3kwh. It is certain that the energy consumption is greater at operating mode than at standby mode. The carbon emission rates from 24 hour gas scrubber operation are 236 $kgCO_2$/day of $N_2$, 57 $kgCO_2$/day of electric power and 0.001 $kgCO_2$/day of cooling water. Most of carbon is emitted from $N_2$ gas and electric power consumption.

CCP and ICP Combination Impedance Matching Device for Uniformity Improvement of Semiconductor Plasma Etching System (반도체 플라즈마 식각 시스템의 균일도 향상을 위한 CCP와 ICP 결합 임피던스정합 장치)

  • Jung, Doo-Yong;Nam, Chang-Woo;Lee, Jong-Ho;Choi, Dae-Kyu;Won, Chung-Yuen
    • The Transactions of the Korean Institute of Power Electronics
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    • v.15 no.4
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    • pp.274-281
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    • 2010
  • This paper proposes a DFPS (Dual Frequency Power Source) impedance matching device for uniformity improvement of a semiconductor plasma etching system. The DFPS consists of two parts for safe plasma processing on large-area substrates. The first part is an ICP (Inductively Coupled Plasma) for high integration by using ferrite core. The second part is a CCP (Capacitive Coupled Plasma) to control uniformity of whole cells. Proposed DFPS can achieve high productivity improvement required for semiconductor equipment industry. The proposed plasma system is analyzed, simulated and experimentally verified with a matching equipment at 27.12MHz and 400kHz.

Airborne Fine Particle Measurement Data Analysis and Statistical Significance Analysis (공기중 미세입자 측정 데이터 분석 및 통계 유의차 분석)

  • Sung Jun An;Moon Suk Hwan
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.1
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    • pp.1-5
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    • 2023
  • Most of the production process is performed in a cleanroom in the case of facilities that produce semiconductor chips or display panels. Therefore, environmental management of cleanrooms is very important for product yield and quality control. Among them, airborne particles are a representative management item enough to be the standard for the actual cleanroom rating, and it is a part of the Fab or Facility monitoring system, and the sequential particle monitoring system is mainly used. However, this method has a problem in that measurement efficiency decreases as the length of the sampling tube increases. In addition, a statistically significant test of deterioration in efficiency has rarely been performed. Therefore, in this study, the statistically significant test between the number of particles measured by InSitu and the number of particles measured for each sampling tube ends(Remote). Through this, the efficiency degradation problem of the sequential particle monitoring system was confirmed by a statistical method.

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Establishing of Requirement and Design Development Process for Assuring Quality of Automotive Semiconductor (차량용 반도체의 품질 확보를 위한 사양 및 설계 개발 프로세스 수립)

  • Do, Sungryong;Han, Hyuksoo
    • Journal of KIISE
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    • v.41 no.9
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    • pp.625-632
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    • 2014
  • With the trend of increasing needs for high-technology from customer and tightening regulation on automotive fuel efficiency and safety, application of E/E system has been expanding consistently in automotive industry. Thus, demand for core elements of E/E system has been growing: micro controller, analog IC and ASIC. But, development process of automotive semiconductor hasn't been clearly established in domestic area. This research aims to present a guide and an example for construction of requirement and design development process on semiconductor based on ISO/TS 16949 that is requirement for quality management system, CMMI that has been proven in various area and ISO 26262 widely used methodology for functional safety. It is expected that the result of this research is used as guidance for construction of semiconductor development process.