• Proceedings of the KIEE Conference
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• 2001.11c
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• pp.352-355
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• 2001

In this paper, we proposed measurement error reduction technique for the semiconductor device DC characteristic measurement system. Implemented system is composed of 4 SMUs, 2 VSUs, and 2 VMUs. Various efforts in hardware and software have been made to reduce the measurement errors due to the leakage current in measurement circuits. Internal and external sources of errors in measurement system especially in pA range measurement have been identified and removed. Experimental results show that the implemented system can be measure the DC characteristic of semiconductor devices in pA level.

• Journal of the Semiconductor & Display Technology
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• v.22 no.2
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• pp.11-16
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• 2023

EtherCAT is an Ethernet-based fieldbus system standardized in IEC 61158 and SEMI, and widely used in the fields of factory automation, semiconductor equipment and robotics. In this paper, without operating system, we have implemented an EtherCAT master with an open source EtherCAT master stack SOEM on STM32 Nucleo-144 board with an STM32F767 microcontroller. And its jitter performance has been evaluated at the output of the network port to include all the effects of the entire system in the results. The results show that the implemented EtherCAT master has precise control performance for control frequencies from 1KHz to 8KHz and relatively superior jitter performance compared to the EtherCAT masters with real-time patched Linux operating system.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.94-96
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• 2002

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.171-174
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• 1997

The great development of semiconductor industry demands the high efficiency and performance of related device, but the pick and place system of semiconductor packaging device can load a few units until nowdays. Although the system can load a lot of units, it can work multiple sort operation. The defect like that causes a low efficiency. Therefore, this paper represents the development of pick and place system which can work multiple sort operation.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.513-516
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• 2004

본 논문에서는 $20\%$ Ge 조성 비율을 갖는 SiGe 200nm 에 $1\%$-Nitrogen doping 된 Nickel 을 이용하여 새로운 Nickel Germanosilicide 방법을 제안하여 Ni-Germanosilicide 의 단점인 열 안정성 개선에 대해 연구하였다. Nitrogen atom 이 grain boundary 에 존재하여 Nickel의 diffusion을 억제시키는 역할을 하여 shallow한 실리사이드와 uniform 한 실리사이드 계면 특성을 얻게 되었다. 그리고 실리사이드 형성 후, 고온로 열처리 $600^{\circ}C$, 30min 후에도 낮고 안정한 면 저항 특성으로 열안정성 개선 할 수 있다.

• Korean Journal of Optics and Photonics
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• v.32 no.3
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• pp.101-107
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• 2021

In this paper, a study of the design of automotive communication lamps using microlens arrays (MLAs) was conducted. With the development of autonomous driving technology, automobiles need communication lamps to communicate with pedestrians. To reduce the size of the optical system and secure high light intensity, the communication lamp's optical system was designed using an MLA. In addition, to secure a clear image on inclined ground, the design was carried out considering the overlap method. After that, the improved performance was confirmed by comparing it to the MLA optical system before overlapping.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1323-1324
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• 2008

We developed the Hyper-thermal Neutral Beam (HNB) sputtering process as a plasma damage free process for ITO top anode deposition on inverted Top emission OLED (ITOLED). For examining the effect of the HNB sputtering system, Inverted Bottom emission OLEDs (IBOLED) with ITO top anode electrode were fabricated; the characteristics of IBOLED using HNB sputtering process shows significant suppression of plasma induced damage.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• Proceedings of the KIPE Conference
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• 2002.07a
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• pp.158-162
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• 2002

This paper presents a novel 3-phase IGBT module called the SPM (Smart Power Module). This is a new design developed to provide a very compact, low cost, high performance and reliable motor drive system. Several distinct design concepts were used to achieve the highly integrated functionality in a new cost-effective small package. An overall description to the SPM is given and actual application issues such as electrical characteristics, circuit configurations, thermal performance and power ratings are discussed

• Proceedings of the KIPE Conference
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• 2015.07a
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• pp.485-486
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• 2015

This paper introduces the new 1200V $SPM^{(R)}$ (Smart Power Module), which is fully optimized and intelligent integrated IGBT inverter modules for up to 6kW motor drive applications. It utilizes newly developed NPT trench IGBT with the advanced STEALTHTM freewheeling diode, and built-in bootstrap diode. HVICs, multi-function LVIC, and built-in thermistor provide good reliable characteristics for the entire system. This module also takes technical advantage of DBC(Direct Bonded Copper) substrate for the better thermal performance. This paper provides an overall description of the newly developed 1200V/35A $SPM^{(R)}$ 2 product.