• Korean Journal of Veterinary Service
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• v.44 no.4
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• pp.185-194
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• 2021

Polyglutamine extension in the coding sequence of mutant huntingtin causes neuronal degeneration associated with the formation of insoluble polyglutamine aggregates in Huntington's disease (HD). Mutant huntingtin can form aggregates within the nucleus and processes of neurons possibly due to misfolding of the proteins. To better understand the mechanism by which an elongated polyglutamine causes aggregates, we have developed an in vitro binding assay system of polyglutamine tract from truncated huntingtin. We made GST-HD exon1 fusion proteins which have expanded polyglutamine epitopes (e.g., 17, 23, 32, 46, 60, 78, 81, and 94 CAG repeats). In the present emergence of new study adjusted nanotechnology on protein chip such as surface plasmon resonance strategy which used to determine the substance which protein binds in drug discovery platform is worth to understand better neurodegenerative diseases (i.e., Alzheimer disease, Parkinson disease and Huntington disease) and its pathogenesis along with development of therapeutic measures. Hence, we used strengths of surface plasmon resonance (SPR) technology which is enabled to examine binding specificity and explore targeted molecular epitope using its electron charged wave pattern in HD pathogenesis utilize conjugated mutant epitope of HD protein and its interaction whether wild type GST-HD interacts with mutant GST-HD with maximum binding affinity at pH 6.85. We found that the maximum binding affinity of GST-HD17 with GST-HD81 was higher than the binding affinities of GST-HD17 with other mutant GST-HD constructs. Furthermore, our finding illustrated that the mutant form of GST-HD60 showed a stronger binding to GST-HD23 or GST-HD17 than GST-HD60 or GST-HD81. These results indicate that the binding affinity of mutant huntingtin does not correlate with the length of polyglutamine. It suggests that the aggregation of an expanded polyglutamine might have easily occurred in the presence of wild type form of huntingtin.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.9
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• pp.68-73
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• 2013

In this paper, we proposed a readout circuit of pulse waveform and rate for a U-health system to monitor health condition. For long-time operation without replacing or charging a battery, either pulse waveform or pulse rate is selected as the output data of the proposed readout circuit according to health condition of a user. The proposed readout circuit consists of a simple digital logic discriminator and a dual-mode ADC which operates in the ADC mode or in the count mode. Firstly, the readout circuit counts pulse rate for 4 seconds in the count mode using the dual-mode ADC. Health condition is examined after the counted pulse rate is accumulated for 1 minute in the discriminator. If the pulse rate is out of the preset normal range, the dual-mode ADC operates in the ADC mode where pulse waveform is converted into 10-bit digital data with the sampling frequency of 1 kHz. These data are stored in a buffer and transmitted by 620 kbps to an external monitor through a RF transmitter. The data transmission period of the RF transmitter depends on the operation mode. It is generally 1 minute in the normal situation or 1 ms in the emergency situation. The proposed readout circuit was designed with $0.11{\mu}m$ process technology. The chip area is $460{\times}800{\mu}m^2$. According to measurement, the power consumption is $161.8{\mu}W$ in the count mode and $507.3{\mu}W$ in the ADC mode with the operating voltage of 1 V.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.93-93
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• 2016

Large scale integrated circuits (LSIs) has been improved by the shrinkage of the circuit dimensions. The smaller chip sizes and increase in circuit density require the miniaturization of the line-width and space between metal interconnections. Therefore, an extreme precise control of the critical dimension and pattern profile is necessary to fabricate next generation nano-electronics devices. The pattern profile control of plasma etching with an accuracy of sub-nanometer must be achieved. To realize the etching process which achieves the problem, understanding of the etching mechanism and precise control of the process based on the real-time monitoring of internal plasma parameters such as etching species density, surface temperature of substrate, etc. are very important. For instance, it is known that the etched profiles of organic low dielectric (low-k) films are sensitive to the substrate temperature and density ratio of H and N atoms in the H2/N2 plasma [1]. In this study, we introduced a feedback control of actual substrate temperature and radical density ratio monitored in real time. And then the dependence of etch rates and profiles of organic films have been evaluated based on the substrate temperatures. In this study, organic low-k films were etched by a dual frequency capacitively coupled plasma employing the mixture of H2/N2 gases. A 100-MHz power was supplied to an upper electrode for plasma generation. The Si substrate was electrostatically chucked to a lower electrode biased by supplying a 2-MHz power. To investigate the effects of H and N radical on the etching profile of organic low-k films, absolute H and N atom densities were measured by vacuum ultraviolet absorption spectroscopy [2]. Moreover, using the optical fiber-type low-coherence interferometer [3], substrate temperature has been measured in real time during etching process. From the measurement results, the temperature raised rapidly just after plasma ignition and was gradually saturated. The temporal change of substrate temperature is a crucial issue to control of surface reactions of reactive species. Therefore, by the intervals of on-off of the plasma discharge, the substrate temperature was maintained within ${\pm}1.5^{\circ}C$ from the set value. As a result, the temperatures were kept within $3^{\circ}C$ during the etching process. Then, we etched organic films with line-and-space pattern using this system. The cross-sections of the organic films etched for 50 s with the substrate temperatures at $20^{\circ}C$ and $100^{\circ}C$ were observed by SEM. From the results, they were different in the sidewall profile. It suggests that the reactions on the sidewalls changed according to the substrate temperature. The precise substrate temperature control method with real-time temperature monitoring and intermittent plasma generation was suggested to contribute on realization of fine pattern etching.

• The KIPS Transactions:PartD
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• v.11D no.1
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• pp.11-22
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• 2004

As random access memory chip gets cheaper, it becomes affordable to realize main memory-based database systems. Consequently, reducing cache misses emerges as the most important issue in current main memory databases, in which CPU speeds have been increasing at 60% per year, compared to the memory speeds at 10% per you. In this paper, we design and implement a main-memory database system for real-time mobile GIS. Our system is composed of 5 modules： the interface manager provides the interface for PDA users； the memory data manager controls spatial and non-spatial data in main-memory using virtual memory techniques； the query manager processes spatial and non-spatial query : the index manager manages the MR-tree index for spatial data and the T-tree index for non-spatial index : the GIS server interface provides the interface with disk-based GIS. The MR-tree proposed propagates node splits upward only if one of the internal nodes on the insertion path has empty space. Thus, the internal nodes of the MR-tree are almost 100% full. Our experimental study shows that the two-dimensional MR-tree performs search up to 2.4 times faster than the ordinary R-tree. To use virtual memory techniques, the memory data manager uses page tables for spatial data, non- spatial data, T-tree and MR-tree. And, it uses indirect addressing techniques for fast reloading from disk.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.7
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• pp.1218-1226
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• 2008

With the development of semiconductor integrated technology and with the increasing use of multimedia functions in computer, more functions have been implemented as hardware. Nowadays, most microprocessors beyond 32 bits generally implement an integer multiplier as hardware. However, as for a divider, only specific microprocessor implements traditional SRT algorithm as hardware due to complexity of implementation and slow speed. This paper suggested an algorithm that uses a multiplier, 'w bit $\times$ w bit = 2w bit', to process $\frac{N}{D}$ integer division. That is, the reciprocal number D is first calculated, and then multiply dividend N to process integer division. In this paper, when the divisor D is '$D=0.d{\times}2^L$, 0.5 < 0.d < 1.0', approximate value of ' $\frac{1}{D}$', '$1.g{\times}2^{-L}$', which satisfies ' $0.d{\times}1.g=1+e$, $e<2^{-w}$', is defined as over reciprocal number and then an algorithm for over reciprocal number is suggested. This algorithm multiplies over reciprocal number '$01.g{\times}2^{-L}$' by dividend N to process $\frac{N}{D}$ integer division. The algorithm suggested in this paper doesn't require additional revision, because it can calculate correct reciprocal number. In addition, this algorithm uses only multiplier, so additional hardware for division is not required to implement microprocessor. Also, it shows faster speed than the conventional SRT algorithm and performs operation by word unit, accordingly it is more suitable to make compiler than the existing division algorithm. In conclusion, results from this study could be used widely for implementation SOC(System on Chip) and etc. which has been restricted to microprocessor and size of the hardware.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.7
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• pp.122-130
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• 2013

This work proposes a 12b 100MS/s 45nm CMOS four-step pipeline ADC for high-speed digital communication systems requiring high resolution, low power, and small size. The input SHA employs a gate-bootstrapping circuit to sample wide-band input signals with an accuracy of 12 bits or more. The input SHA and MDACs adopt two-stage op-amps with a gain-boosting technique to achieve the required DC gain and high signal swing range. In addition, cascode and Miller frequency-compensation techniques are selectively used for wide bandwidth and stable signal settling. The cascode current mirror minimizes current mismatch by channel length modulation and supply variation. The finger width of current mirrors and amplifiers is laid out in the same size to reduce device mismatch. The proposed supply- and temperature-insensitive current and voltage references are implemented on chip with optional off-chip reference voltages for various system applications. The prototype ADC in a 45nm CMOS demonstrates the measured DNL and INL within 0.88LSB and 1.46LSB, respectively. The ADC shows a maximum SNDR of 61.0dB and a maximum SFDR of 74.9dB at 100MS/s, respectively. The ADC with an active die area of $0.43mm^2$ consumes 29.8mW at 100MS/s and a 1.1V supply.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.30 no.2
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• pp.147-151
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• 2004

This study aims at measuring electrical and rheological properties of cosmetic emulsions on the skin under shear flow. The effects of volume ratio and surfactants on structural changes of emulsions were examined by determining the changes of electrical resistance, viscosity, and morphology. As the ratio of the internal phase increased, the phase inversion occurred more quickly. The viscosity change was found to increase with increasing of the variation of electrical resistance of the emulsions. This phenomenon may be caused by decreased resistant force against the shear flow because of the breakdown of the internal phase. Surfactants a]so played a key ro]e on phase transition of emulsions. It is likely that polymeric surfactants anchoring on the emulsion surface reinforced the interfacial mechanical strength. As the concentration of surfactants increased, the phase transition occurred more slowly. It has been demonstrated that the phase changes of emulsions under shear flow can be monitored on the real-time basis by using a JELLI$\^$TM/ chip system, a combination of conductiometry and rheometry. Our approach is expected to a useful experimental tool for predicting the phase transition of the cosmetic products during skin application.

• Journal of the Korean Society of Marine Environment & Safety
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• v.21 no.1
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• pp.97-102
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• 2015

The long line fishing machine is combined with motor and two disc rollers has used on the small size fishing-boat under 1 ton located in near Jeollanam-do seaside. The long line fishing motor is controlled only one direction because the fishing line is loaded heavily at pulling up. On this paper we made the long line fishing 400W power motor controller which it was usually applied under 1 ton fishing boat, and designed the controller using PWM chip, Half bridge driver and MOSFET for one direction motor control. Furthermore some user convenience devices were added like battery indicator and safety protection circuit for battery overdischarge and battery source wire mismatch connection. So we protected the battery from overdicharging when the battery voltage was below 11.5V and fishermen didn't need to worry about source lines misconnection anymore. We confirmed the test version of controller was the good working condition at land and sea.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.11-18
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• 2011

The quantitative interfacial adhesion energy of the Cu-Cu direct bonding layers was evaluated in terms of the bonding temperature and Ar+$H_2$ plasma treatment on Cu surface by using a 4-point bending test. The interfacial adhesion energy and bonding quality depend on increased bonding temperature and post-annealing temperature. With increasing bonding temperature from $250^{\circ}C$ to $350^{\circ}C$, the interfacial adhesion energy increase from $1.38{\pm}1.06$ $J/m^2$ to $10.36{\pm}1.01$ $J/m^2$. The Ar+$H_2$ plasma treatment on Cu surface drastically increase the interfacial adhesion energy form $1.38{\pm}1.06$ $J/m^2$ to $6.59{\pm}0.03$ $J/m^2$. The plasma pre-treatment successfully reduces processing temperature of Cu to Cu direct bonding.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.14 no.6
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• pp.149-157
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• 2014

This paper is based on the fabrication of wireless control system for the building shading device. RF Module was controlled by UHF wireless CC1020 chip which has low electrical power and low electrical voltage. Also 447.8625~447.9875 frequency, 4800Baud data rate and 12.5 kHz channel spacing was controlled by the use of SPDT switch and with Microcontroller program. Furthermore, the helical antenna was used. The starting production of 447.8625~447.9875 kHz wireless electrical power was used. As the result, it did not exceed 10dBm which is the standard of low power wireless system. Shading efficiency was measured at 25%, 50%, 75% direction with controlling the interior temperature and the intensity of illumination at the rate of 1 hour. As the result, the intensity of illumination was lowered to 82~87% at 25% direction with $0.6{\sim}1.4^{\circ}C$ lowered temperature. At 50% direction, the intensity of illumination was lowered to 60~68% with $2.3{\sim}4.1^{\circ}C$ lowered temperature. And at 75% direction, the intensity of illumination was lowered to 41~47% with $3.4{\sim}5.1^{\circ}C$ lowered temperature.