• Journal of Power Electronics
• /
• v.17 no.6
• /
• pp.1563-1576
• /
• 2017

This paper presents a novel switching pattern current control (SP-CC) scheme, which is applied in three-phase voltage-source converters (VSCs). This scheme can select the optimal output switching pattern (SP) by referring the basic principle of space vector modulation (SVM). Moreover, SP-CC is a method without a carrier wave. Thus, the implementation process is concise and easy. When compared with the conventional hysteresis current control (C-HCC) and the space vector-based hysteresis current control (SV-HCC), the SP-CC has the performances of faster dynamic response of C-HCC and less switching number (SN) of SV-HCC. In addition, it has less harmonic contents in the three-phase current, along with a lower switching loss and a higher efficiency. Moreover, the hysteresis bandwidth and Clarke conversion are not required in the SP-CC. The effectiveness of the presented SP-CC is verified by simulation and experimental test results. In addition, the advantages of the SP-CC, when compared with the C-HCC and SV-HCC, are verified as well.

• The Transactions of the Korea Information Processing Society
• /
• v.7 no.7
• /
• pp.2179-2187
• /
• 2000

This paper provides a heuristic analysis technique which determines an optimal number of V\ulcorner/V\ulcorner pads meeting allowable Simultaneous Switching Noise(SN) budget, early in the design phase. Until now, in determining the number of V\ulcorner/V\ulcorner pads, designers had to simulate packaging models case by case in the design phase or roughly allocate the power/ground pins in an inaccurate way according to typical design rules. However, due to the high density and frequency trends of IC technologies, the V\ulcorner/V\ulcorner pads allocation method can affect an adverse effect on IC operations, which requires more accurate and efficient methods be devised. Thus, this paper proposes an analytic V\ulcorner/V\ulcorner pads calculation method that gives a practical help for packaging designs early in the design phase. The proposed method is applied to a design example of a 1/8x208 pin plastic quad flat package (PQFP) and the results are verified through simulation using HSPICE.