• 제목/요약/키워드: Surface uniformity

검색결과 684건 처리시간 0.029초

1 톤급 양산형 진공 침탄로에서 아세틸렌 유량과 로 내 위치에 따른 AISI 4115 강의 침탄 거동 (Carburizing Behavior of AISI 4115 Steel with a Flow Rate of Acetylene and Specimen Location in an 1 ton-class Mass Production-type Vacuum Carburizing Furnace)

  • 권기훈;문경일;박현준;이영국;정민수
    • 열처리공학회지
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    • 제34권6호
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    • pp.272-280
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    • 2021
  • The influence of acetylene flow rates on the carburizing behavior of an AISI 4115 steel in 1 ton-class mass production-type vacuum carburizing furnace has been studied through microstructure, carbon concentration, hardness analyses. The AISI 4115 steels were carburized with various flow rates (20, 32.7, 60 l/min) and locations in the furnace (top, center, bottom) at 950℃. The acetylene flow rate played an important role in controlling the carburizing properties of carburized samples, such as effective case depth and uniformity carburizing according to location in the furnace. At an acetylene flow rate of 20 l/min, the carburized samples had a shallow average hardened layer (0.645 mm) compared to the target hardening depth (1 mm) due to low carbon flux and spatial uniformity of carburization (17.8%) in the furnace. At a flow rate of 60 l/min, the carburized samples showed an average hardened layer (1.449 mm) deeper than the target hardening depth and had the spatial uniformity of carburization (98.8%). In particular, at a flow rate of 32.7 l/min, the carburized samples had an average hardened layer (1.13 mm) close to the target hardening depth and had the highest carburizing uniformity (99.1%). As a result, an appropriate flow rate of 32.7 l/min was derived to satisfy the target hardening depth and to have spatial uniform hardened layer in the furnace.

ESD 전극을 이용한 분무코팅 균일도 개선에 관한 연구 (Improvement of Spray Coating Uniformity using ESD Electrodes)

  • 당현우;양성욱;도양회;최경현
    • 한국기계가공학회지
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    • 제15권2호
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    • pp.118-124
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    • 2016
  • In this study, experiments are conducted to improve spray coating uniformity by using second and third electrodes based on the electrospray atomization mechanism. The uniformity of fabricated thin films can be improved by adjusting the design of the second electrode. The implementation of the second electrode with an elongated hole and a bending angle of $90^{\circ}$ results in highly uniform films. In addition, induced area to substrate is increased by lowering the applied voltage using the third electrode with a round rod shape. A linear correlation between applied voltage and induced area is confirmed. Thin film thickness and surface roughness are measured after the fabrication of thin films through the electrospray process. It is confirmed that a thin film is formed having an average thickness of 273.44 nm, a thickness uniformity of less than 10%, and a surface roughness of 3 nm.

유동 균일성 향상을 위한 열교환기 세정 시스템용 센서 콘덴서 설계 최적화 (Design Optimization on Sensor Condenser of Heat Exchanger Cleaning System for Improved Flow Uniformity)

  • 정순영;김성
    • 한국수소및신에너지학회논문집
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    • 제35권4호
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    • pp.377-383
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    • 2024
  • In this paper, the flow uniformity improvement and flow characteristic of the sensor condenser for a heat exchanger cleaning system were studied using response surface method and computational-fluid-dynamics. The design variable was defined as a shape for controllable sensor condenser area. The objective functions were defined as the improvement of flow uniformity in heat exchanger cleaning system tubes. The flow uniformity improvement and flow characteristic of optimum model was verified by numerical analysis and the reliability of the model was retained by comparison of numerical analysis and comparative analysis with the reference model.

The Fabrication of Megasonic Agitated Module(MAM) for the Improved Characteristics of Wet Etching

  • Park, Tae-Gyu;Yang, Sang-Sik;Han, Dong-Chul
    • Journal of Electrical Engineering and Technology
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    • 제3권2호
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    • pp.271-275
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    • 2008
  • The MAM(Megasonic Agitated Module) has been fabricated for improving the characteristics of wet etching. The characteristics of the MAM are investigated during the wet etching with and without megasonic agitation in this paper. The adoption of the MAM has improved the characteristics of wet etching, such as the etch rate, etch uniformity, and surface roughness. Especially, the etching uniformity on the entire wafer was less than ${\pm}1%$ in both cases of Si and glass. Generally, the initial root-mean-square roughness($R_{rms}$) of the single crystal silicon was 0.23nm. Roughnesses of 566nm and 66nm have been achieved with magnetic stirring and ultrasonic agitation, respectively, by some researchers. In this paper, the roughness of the etched Si surface is less than 60 nm. Wet etching of silicon with megasonic agitation can maintain nearly the original surface roughness during etching. The results verified that megasonic agitation is an effective way to improve etching characteristics of the etch rate, etch uniformity, and surface roughness and that the developed micromachining system is suitable for the fabrication of devices with complex structures.

회귀분석을 이용한 ITO 코팅유리기판의 표면균일도와 운전변수의 상관관계 분석 (Relationship between Working Parameter and Surface Nniformity of ITO coated Glass Substrate using Regression Analysis)

  • 김면희;이상룡;이태영;배준영
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.1353-1356
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    • 2004
  • In recent year, OLED(organic light emitted display) is used as the next generation device of FPD. OLED have been replacing the flat panel display device such as LCD, STN-LCD and TFT because this device is more efficient, economic and simple than those FPD devices, and this need not backlight system for visualization. The performance and efficiency of OLED is related with surface defect of ITO coated glass substrate. The typical surface defect of glass substrate is nonuniformity and bad surface roughness. ITO coated glass substrate is destroied for inspection about surface roughness and non-uniformity. Generally detection of the defects in the surface for ITO coated glass substrate is dependent on operator's experience. In this research, relationship between working parameter and surface non-uniformity is studied using regression analysis.

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Evaluation of Light Intensity and Uniformity of LEDs for Protected Crop Production

  • Kim, MunJung;Choo, YounKug;Kim, YongJoo;Chung, SunOk
    • Agribusiness and Information Management
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    • 제6권1호
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    • pp.37-44
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    • 2014
  • This study was conducted to evaluate light intensity and uniformity of two SMD (surface-mount device) type LEDs for protected crop production. A low-power (0.1 W) and a high-power (1 W) LEDs were selected and the intensity and uniformity was evaluated at different vertical (height) and horizontal (distance) intervals. When the horizontal interval of the LED bar was fixed, the light intensity increased and the uniformity decreased as the height decreased. At the 30~40 cm heights, 20~30% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. As the horizontal distance of the LED bars increased, while the uniformity increased as well, the light intensity decreased. At the distances of 6~10 cm, 17~23% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. When the LED bars were added to the sides, the light intensity and uniformity were generally improved. Results showed that the light intensity and uniformity depended on the height and interval of the LED bulbs; therefore, optimum arrangement for the crops interested should be determined through experiments.

화학 기계적 연마에서 패드표면 특성이 웨이퍼 불균일도에 미치는 영향 (Pad Surface Characteristics and their Effect on Within Wafer Non-Uniformity in Chemical Mechanical Polishing)

  • 정석훈;이현섭;정문기;신운기;이상직;박범영;김형재;정해도
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.58-58
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    • 2009
  • Uniformity related issues in chemical mechanical polishing (CMP) are within wafer non-uniformity (WIWNU), wafer to wafer non-uniformity (WTWNU), planarity and dishing/erosion. Here, the WIWNU that originates from spatial distribution of independent variables such as temperature, sliding distance, down force and material removal rate (MRR) during CMP, relies to spatial dependency. Among various sources of spatial irregularity, hardness and modulus of pad and surface roughness in sources for pad uniformity are great, especially. So, we investigated the spatial variation of pad surface characteristics using pad measuring system (PMS) and roughness measuring system. Reduced peak height ($R_{pk}$) of roughness parameter shows a strong correlation with the removal rate, and the distribution of relative sliding distance onwafer during polishing has an effect on the variation of $R_{pk}$ and WIWNU. Also, the results of pad wear profile thorough developed pad profiler well coincides with the kinematical simulation of conditioning, and it can contribute for the enhancement of WIWNU in CMP process.

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광경화형 글래스아이오노머 시멘트의 두께 및 시간경과에 따른 경도의 변화 (HARDNESS CHANGE OF LIGHT-ACTIVATED GLASS IONMER CEMENT WITH THICKNESS AND TIME)

  • 이경진;오원만;김선헌
    • Restorative Dentistry and Endodontics
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    • 제20권1호
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    • pp.303-315
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    • 1995
  • An adequate and homogeneous cure of light-activated restroative material is very important for improvement of marginal adaptation and prevention of marginal leakage, secondary caries and pulpal irritation as well as expressing natural physical property of that material. The purpose of this study was to evaluate the change of surface hardness and cure uniformity of light-activated glass ionomer cements. Restorative(Fuji II LC, Vitremer) and lining(Baseline VLC, Vitrebond) light-activated glass ionomer cements were investigated for this study. The surface hardness of the top and bottom surfaces and cure uniformity of each 1mm, 1.5mm, 2mm, 2.5mm & 3mm in the thickness of specimen were measured immediately, at 1 hour, 24 hours and 1 week after light activation. The surface hardness change and cure uniformity of all the specimens were measured by Knoop hardness tester. The results were as follows. 1. The surface hardness of top and bottom surfaces in all groups increased with time(p<0.01). 2. Both top and bottom surfaces hardness of Vitrebond group measured immediately after light-activation were significantly lower than those of the other groups(p<0.01). 3. The surface hardness of top and bottom surfaces of restorative light -activated glass ionomer cements was higher than those of lining materials at 1 week(p<0.10). 4. Surface hardness of Vitremer group decreased as the specimen thickness increased, except top and bottom surfaces hardness of the specimen at 1 week(p<0.01). There was no significant difference in the surface hardness of Fuji II LC with changes in the thickness except bottom surface hardness of specimen at 24 hours and 1 week (p>0.05). 5. Surface hardness of Vitrebond group significantly decreased as the specimen thickness increased(p<0.01). There was no significant difference in the surface hardness of Baseline VLC group with changes in the thickness except bottom surface hardness of specimen measured immediately after light -activation(p>0.05). 6. The hardness ratio of top against bottom surface in all groups decreased with time(p<0.05). 7. There was no significant difference in the hardness ratio of top against bottom surface with changes of the thickness except Vitrebond group, 24 hours and 1 week of Vitremer group and 1 week of Baseline VLC group (p>0.05). These results suggest that surface hardness of restorative ligh-activated glass ionomer cements were highter than those of lining light-activated materials. In all groups, the surface hardness and cure uniformity continuously increased with time.

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Characterization of via etch by enhanced reactive ion etching

  • Bae, Y.G.;Park, C.S.
    • 한국결정성장학회지
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    • 제14권6호
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    • pp.236-243
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    • 2004
  • The oxide etching process was characterized in a magnetically enhanced reactive ion etching (MERIE) reactor with a $CHF_3CF_4$ gas chemistry. A statistical experimental design plus one center point was used to characterize relationships between process factors and etch response. The etch response modeled are etch rate, etch selectivity to TiN and uniformity. Etching uniformity was improved with increasing $CF_4$ flow ratio, increasing source power, and increasing pressure depending on source power. Characterization of via etching in $CHF_3CF_4$ MERIE using neural networks was successfully executed giving to highly valuable information about etching mechanism and optimum etching condition. It was found that etching uniformity was closely related to surface polymerization, DC bias, TiN and uniformity.