• Journal of the Korean Society for Precision Engineering
• /
• v.26 no.7
• /
• pp.112-119
• /
• 2009

The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

• Journal of Korean Society of Water and Wastewater
• /
• v.37 no.4
• /
• pp.177-186
• /
• 2023

Perfluorooctanoic acid(PFOA) was one of widely used per- and poly substances(PFAS) in the industrial field and its concentration in the surface and groundwater was found with relatively high concentration compared to other PFAS. Since various processes have been introduced to remove the PFOA, adsorption using GAC is well known as a useful and effective process in water and wastewater treatment. Surface modification for GAC was carried out using Cu and Fe to enhance the adsorption capacity and four different adsorbents, such as GAC-Cu, GAC-Fe, GAC-Cu(OH)₂, GAC-Fe(OH)₃ were prepared and compared with GAC. According to SEM-EDS, the increase of Cu or Fe was confirmed after surface modification and higher weight was observed for Cu and Fe hydroxide(GAC-Cu(OH)₂ and GAC-Fe(OH)₃, respectively). BET analysis showed that the surface modification reduced specific surface area and total pore volumes. The highest removal efficiency(71.4%) was obtained in GAC-Cu which is improved by 17.9% whereas the use of Fe showed lower removal efficiency compared to GAC. PFOA removal was decreased with increase of solution pH indicating electrostatic interaction governs at low pH and its effect was decreased when the point of zero charges(pzc) was negatively increased with an increase of pH. The enhanced removal of PFOA was clearly observed in solution pH 7, confirming the Cu in the surface of GAC plays a role on the PFOA adsorption. The maximum uptake was calculated as 257 and 345 ㎍/g for GAC and GAC-Cu using Langmuir isotherm. 40% and 80% of removal were accomplished within 1 h and 48 h. According to R², only the linear pseudo-second-order(pso) kinetic model showed 0.98 whereas the others obtained less than 0.870.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2003.10a
• /
• pp.281-284
• /
• 2003

The microstructural changes of Al-Zn-Mg-Cu alloy containing Sc during hot extrusion and post heat treatment is investigated. Two kinds of Al-Sc alloys with different alloying elements (B1, B2) are hot extruded to make I-shape bars at 380$^{\circ}C$, then the bars are solution treated at 480$^{\circ}C$ for 2hrs followed by artificial aging at 120$^{\circ}C$ for 24hrs. The interior microstructure of as extruded bar consists of elongated grains, however, fine equiaxed grains are mainly observed around surface. The microstructural gradient suggests that different restoration process can proceed during the hot extrusion. For B1 and B2, different grain growth behaviors are found around the surface during the post heat treatment. Rapid grain growth behavior around the surface is discussed related with the crystallographic orientation of the grain.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.4
• /
• pp.109-114
• /
• 2021

We investigated the effects of atmospheric hydrogen plasma treatment on Cu-Cu direct bonding. Hydrogen plasma was effective in reducing the surface oxide layer of Cu thin film, which was confirmed by GIXRD analysis. It was observed that larger plasma input power and longer treatment time were effective in terms of reduction and surface roughness. The interfacial adhesion energy was measured by DCB test and it was observed to decrease as the bonding temperature decreased, resulting in bonding failure at bonding temperature of 200℃. In case of wet treatment, strong Cu-Cu bonding was observed above bonding temperature of 250℃.

• Journal of Conservation Science
• /
• v.28 no.1
• /
• pp.29-37
• /
• 2012

This study discusses a mercury amalgam gilding technique and examines how the color, surface and section of the gilt layer changes as the condition of heat treatment with mercury amalgam gilt object is changed. Some previous studies have mentioned reasons for various colors on gilt bronze artifacts depending on gilding manufacture and environment. However, reason for reddish color with gold on the artifacts' surface brought on high temperature corrosion has yet to be discussed and analyzed. A methodology was found in representing the mercury amalgam gilding technique and heat treatment test. According to the result of the heat treatment test, in the conditions of higher temperature and longer time, the oxidized layer on the gilt layer was distributed more widely and in the part when the oxide layer was eliminated, the gilt layer with a reddish color was observed. Moreover, in the surface observation of the specimen on which yellow and reddish colors were agitated, the changing aspects of its surface condition differed by colors. When investigated the section, it was observed that the void density and size became larger. After a test, the surface components changed; the temperature of heat treatment increased, component ratio of Hg and Au decreased gradually but component ratio of Cu increased. In regard to the gilt layer, as the time was longer and the temperature became higher for the heat treatment, the component ratio of Au and Cu by layers tended to change in inverse proportion. It is concluded that gilding techniques and the burial environment can make a difference in the surface color of the gilt layer on the gilt bronze artifacts, the high temperature corrosion that occurs by heat after they are manufactured is also one of the factors that affects their surface color.

• Journal of the Korean institute of surface engineering
• /
• v.54 no.1
• /
• pp.1-11
• /
• 2021

Porous dendrite structure AuCu alloy was formed using a hydrogen bubble template (HBT) technique by electroplating to improve the catalytic performance of gold, known as an excellent oxygen reduction reaction (ORR) catalyst in alkaline medium. The rich Au surface was maximized by selectively electrochemical etching Cu on the AuCu dendrite surface well formed in a leaf shape. The catalytic activity is mainly due to the synergistic effect of Au and Cu existing on the surface and inside of the particle. Au helps desorption of OH- and Cu contributes to the activation of O2 molecule. Therefore, the porous AuCu dendrite alloy catalyst showed markedly improved catalytic activity compared to the monometallic system. The porous structure AuCu formed by the hydrogen bubble template was able to control the size of the pores according to the formation time and applied current. In addition, the Au-rich surface area increased by selectively removing Cu through electrochemical etching was measured using an electrochemical calculation method (ECSA). The results of this study suggest that the alloying of porous AuCu dendrites and selective Cu dissolution treatment induces an internal alloying effect and a large specific surface area to improve catalyst performance.

• Journal of the Korean institute of surface engineering
• /
• v.28 no.6
• /
• pp.376-385
• /
• 1995

Copper-chromium multilayers with a nominal bilayer thickness of about 400 $\AA$ (200 $\AA$ each) were prepared by dc magnetron sputtering and the evolution of microstructure during heat treatment was investigated by using x-ray diffractometry(XRD), Auger electron spectroscopy(AES) and transmission electron microscopy(TEM). It was observed that an amorphous phase with a thickness of about 40 $\AA$ was formed at the interfaces of the as-deposited Cu/Cr multilayered film using cross-sectional TEM. At elevated temperatures, the Cu(111) reflection showed increasing intensity and decreasing line-width as a result of copper grain growth. The intermixed amorphous phase disappeared after annealing at $250^{\circ}C$ for 1 h and the multilayer structure was stable up to $400^{\circ}C$ for 1 h annealing. At $600^{\circ}C$ annealing, it was observed that the multilayer structure was completely destroyed and copper and chromium phases were fully intermixed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2002.07a
• /
• pp.478-481
• /
• 2002

We carried out the experiments for fabricating $Bi_{2}Sr_{2}Ca_{2}Cu_{3}O_{x}$(Bi2223) superconductor thick films on Cu tapes. Cu-free (Bi,Pb)-Sr-Ca-0 powder mixtures were screen- printed on Cu tapes and heat-treated at 840-$860^{\circ}C$ for several minutes in air. Surface microstructures and phases of films were analyzed by XRD and optical microscope. The electric properties of superconducting films were examined by the four probe method. At heat-treatment temperature, the printing layers were in a partially molten state by liquid reaction between CuO in the oxidized copper tape and the precursors which were printed on Cu tapes. During the heat-treatment procedure, it is thought that Bi2223 superconducting particles nucleate at interfaces between Bi2212 phase and liquid.

• Carbon letters
• /
• v.7 no.4
• /
• pp.249-258
• /
• 2006

Treatment of water hyacinth with sulphuric acid produces carbonaceous materials that have been used to remove Cu(II) and Cd (II) ions from aqueous solutions. Untreated water hyacinth was also used for the subject of comparison. The textural properties of the carbonaceous materials were determined from nitrogen adsorption at 77 K. The optimum pH for the sorption of Cu (II) and Cd (II) ions on the investigated sorbents was determined. Dynamic adsorption measurements have been taken at 298 K whereas equilibrium measurements were carried out at 298, 313 and 323 K. The adsorption of nitrogen at 77 K on the untreated sample was too low and the surface areas of the treated samples 2, 3 and 4 were found between $70-208\;m^2/g$. The total pore volumes of these samples which were determined for the carbonaceous materials investigated were found to be 0.076-0.140 ml/g. The kinetic adsorption data of Cu (II) and Cd(II) were applicable to both pseudo - first and pseudo-second order but fit more the latter order. The equilibrium adsorption data were found to fit Freundlich and Langmiur equations. The values of DG, DH and DS are all negative indicating the feasibility and the spontaneous nature of the sorption of Cu (II) and Cd (II) ions by the sorbents investigated.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.1
• /
• pp.45-50
• /
• 2014

Effects of wet chemical treatment and thermal cycle conditions on the quantitative interfacial adhesion energy of $Cu/SiN_x$ thin film interfaces were evaluated by 4-point bending test method. The test samples were cleaned by chemical treatment after Cu chemical-mechanical polishing (CMP). The thermal cycle test between Cu and $SiN_x$ capping layer was experimented at the temperature, -45 to $175^{\circ}C$ for 250 cycles. The measured interfacial adhesion energy increased from 10.57 to $14.87J/m^2$ after surface chemical treatment. After 250 thermal cycles, the interfacial adhesion energy decreased to $5.64J/m^2$ and $7.34J/m^2$ for without chemical treatment and with chemical treatment, respectively. The delaminated interfaces were confirmed as $Cu/SiN_x$ interface by using the scanning electron microscope and energy dispersive spectroscopy. From X-ray photoelectron spectroscopy analysis results, the relative Cu oxide amounts between $SiN_x$ and Cu decreased by chemical treatment and increased after thermal cycle. The thermal stress due to the mismatch of thermal expansion coefficient during thermal cycle seemed to weaken the $Cu/SiN_x$ interface adhesion, which led to increased CuO amounts at Cu film surface.