• Progress in Superconductivity
• /
• 제3권2호
• /
• pp.188-192
• /
• 2002

To introduce flux pinning center in HTS-BSCCO system, nano-size MgO particles were uniformly distributed within the Bi-2223 grain by partial hydration of MgO. The existing method MgO doped Bi-2223 used nato-size MgO powders, which resulted in agglomeration during mixing or grain growth during heat-treatment due to the high surface energy of the fine particles. By hydration of the MgO surface, the agglomeration of the MgO powders was avoided and the size of remaining MgO core was controlled by changing hydration medium and time. The thin film obtained by spin coating of (Bi_$1.8/Pb_{0.4}$)$Sr_2$$_{Ca}$$2.2/Cu_3$ $O_{y}$ nitrate solution mixed with hydrated MgO showed the even distribution of nano-size MgO particles in the Bi-2212 grains.s.s.

• 한국표면공학회지
• /
• 제36권1호
• /
• pp.1-8
• /
• 2003

In general, the microstructure in thin films was known to evolve in similar manner according to the energy striking the condensing film at similar homologous temperature, Th for the materials of the same crystal structure. The fundamental factors affecting particle energy are a function of processing parameters such as working pressure, bias voltage, target/sputtering gas mass ratio, cathode shape, and substrate orientation. In this study, Al, Cu, Pt films of the same crystal structure of face centered cubic (FCC) have been prepared under various processing parameters. The influence of processing variables on the microstructures and residual stress states in the films has been studied.

• 마이크로전자및패키징학회지
• /
• 제21권3호
• /
• pp.43-50
• /
• 2014

전자 제품의 경박 단소화 및 고집적화가 이루어 지면서 실리콘 집과 인쇄회로기판의 인터커넥션의 고신뢰도가 요구되고 있다. 본 연구는 Sn-4.0wt%Ag-0.5wt%Cu (SAC405) 솔더와 다양한 무전해 Ni-P 도금 두께에서의 high speed shear 에너지 및 파괴 모드를 연구하였다. 파괴 모드 분석을 위하여 집속이온빔(FIB) 분석이 이용되었다. 질산 기상 처리하지 않은 $1{\mu}m$ Ni-P 시편에서 낮은 shear 에너지가 나왔으며, 이는 솔더레지스트 선단에서 파단의 원인을 제공하는 것이 확인되었다. 질산 기상 처리한 시편에서 무전해 Ni-P 도금 두께가 커질수록 취성 파괴 모드는 감소한다. 또 Ni-P 도금 두께와 표면 거칠기(Ra)는 반비례 관계를 가진다. 이는 Ni-P 도금의 표면 거칠기를 낮추면 SAC405 솔더 조인트의 신뢰도를 향상시킨다는 사실을 나타낸다.

• 열처리공학회지
• /
• 제7권4호
• /
• pp.298-306
• /
• 1994

This study was performed to investigation the effect of austempering temperature on the mecanical properties and fracture Characteristic of the ductile cast iron with contains Cu and Mo. The obtained results of this study were as follows; Microstructure of austemped ductile cast iron obtained by austempering were low bainite with some martensite at $250^{\circ}C$, mixture of low and upper bainite at $300^{\circ}C$ and upper bainite at $350^{\circ}C$. With increasing austempering temperature, yield strength, tensile strength and hardness decreased, while the elongation and impact absorption energy increased. With increasing austempering temperature, fracture toughness value increased and mainly controlled by bolume fraction of retained austenite. The volume fraction of retained austenite increased and the fracture surface obtained fibrous and dimple with increasing austempering temperature.

• 한국주조공학회지
• /
• 제14권5호
• /
• pp.429-437
• /
• 1994

Influence of interfacial structure between matrix and particle in A356/coated SiC composite fabricated by squeeze casting method was studied. Experimental variables are types of coated metallic film on SiC particles such as Cu, Ni-P, and applied pressure for squeeze casting. It was found that coating treatment on SiC particles improves the wetting of liquid A356 alloy on SiC particles. SiC particle distribution is very homogeneous in A356 matrix alloy which is fabricated by squeeze casting. Analysing the surface morphology of fractured A356/coated SiC, it was concluded that metallic thin film by coating treatment on SiC particle improves the interfacial bonding between particle and matrix, and so does on mechanical properties such as tensile strength. However, there was on significant difference in hardness between those composite made of as-received SiC particle and coated SiC particle.

• 한국표면공학회지
• /
• 제48권6호
• /
• pp.260-268
• /
• 2015

The thermal barrier coating (TBC) for inner wall of liquid-fuel rocket combustor consists of NiCrAlY as bonding layer and $ZrO_2$ as a top layer. In most case, the plasma spray coating is used for TBC process and this process has inherent possibility of cracking due to large difference in thermal expansion coefficients among bonding layer, top layer and metal substrate. In this paper, we suggest crack-free TBC process by using a precise electrodeposition technique. Electrodeposited Ni-P/Cr double layer has similar thermal expansion coefficient to the Cu alloy substrate resulting in superior thermal barrier performance and high temperature oxidation resistance. We studied the effects of phosphorous concentrations (2.12 wt%, 6.97 wt%, and 10.53 wt%) on the annealing behavior ($750^{\circ}C$) of Ni-P samples and Cr double layered electrodeposits. Annealing temperature was simulated by combustion test condition. Also, we conducted SEM/EDS and XRD analysis for Ni-P/Cr samples. The results showed that the band layers between Ni-P and Cr are Ni and Cr, and has no formed with heat treatment. These band layers were solid solution of Cr and Ni which is formed by interdiffusion of both alloy elements. In addition, the P was not found in it. The thickness of band layer was increased with increasing annealing time. We expected that the band layer can improve the adhesion between Cr and Ni-P.

• 한국의류학회지
• /
• 제27권3_4호
• /
• pp.364-372
• /
• 2003

In this study, the characteristics of catechol tannin and pyrogallol tannin contained in Pteridium aquilinum were analysed by It spectrum. Silk fabrics were dyed with Pteridium aquilinum extracts using various mordants, and their dyeing properties were discussed. Additionally the fastness the water digestion, perspiration liquid digestion and light irradiation were investigated. IR spectrum of catechol tannin showed bands of O-H at $3417cm^{-1}$, C-H at $2930cm^{-1}$, C=0 at $1722cm^{-1}$, C=C at $1644cm^{-1},\;CH_2\;at\;1402cm^{-1}$. And IR spectrum of pyrogallol tannin showed bands of O-H at $3409cm^{-1}$, C-H at $3003cm^{-1}\;and\;2933cm^{-11}$, C=0 at $1701cm^{-1}$, C=C at $1582cm^{-11},\;CH_2\;at\;1410cm^{-1}$, CO at carboxylic acid and carboxylic acid ester at $1287cm^{-1}\;and\;1135cm^{-1}$. The maximum absorption wavelength of the extracts appeared at 270.0nm and 311.5nm. The optimum conditions for dyeing silk fabric with Pteridium aquilinum extracts were $80^{\circ}C$, 60min. Surface color of the silk fabric dyed with Pteridium aquilinum extracts was 2.7Y Surface color of the pre-mordanted fabrics with Al, Cu and Fe were 4.3Y, 2.5Y and 4.7Y, respectively. And Surface color of the post-mordanted fabrics with Al, Cu and Fe were 3.7Y, 2.8Y and 0.2GY. The water fastness and the alkaline perspiration fastness were improved in the Al-mordanted silk fabrics. By acidic and alkaline perspiration treatment, ${\Delta}E of the unmordanted fabrics was lower than hat of pre- and post- mordanted fabrics. Also after 40hour irradiation, ${\Delta}E of the unmordanted fabrics was lower than that of pre- and post- mordanted fabrics.

• 한국재료학회지
• /
• 제20권12호
• /
• pp.661-668
• /
• 2010

Cu(In,Ga)$Se_2$(CIGS) photovoltaic thin films were electrodeposited on Mo/glass substrates with an aqueous solution containing 2 mM $CuCl_2$, 8 mM $InCl_3$, 20 mM $GaCl_3$ and 8mM $H_2SeO_3$ at the electrodeposition potential of -0.6 to -1.0 V(SCE) and pH of 1.8. The best chemical composition of $Cu_{1.05}In_{0.8}Ga_{0.13}Se_2$ was found to be achieved at -0.7 V(SCE). The precursor Cu-In-Ga-Se films were annealed for crystallization to chalcopyrite structure at temperatures of 100-$500^{\circ}C$ under Ar gas atmosphere. The chemical compositions, microstructures, surface morphologies, and crystallographic structures of the annealed films were analyzed by EPMA, FE-SEM, AFM, and XRD, respectively. The precursor Cu-In-Ga-Se grains were grown sparsely on the Mo-back contact and also had very rough surfaces. However, after annealing treatment beginning at $200^{\circ}C$, the empty spaces between grains were removed and the grains showed well developed columnar shapes with smooth surfaces. The precursor Cu-In-Ga-Se films were also annealed at the temperature of $500^{\circ}C$ for 60 min under Se gas atmosphere to suppress the Se volatilization. The Se amount on the CIGS film after selenization annealing increased above the Se amount of the electrodeposited state and the $MoSe_2$ phase occurred, resulting from the diffusion of Se through the CIGS film and interaction with Mo back electrode. However, the selenization-annealed films showed higher crystallinity values than did the films annealed under Ar atmosphere with a chemical composition closer to that of the electrodeposited state.

• 마이크로전자및패키징학회지
• /
• 제16권3호
• /
• pp.31-37
• /
• 2009

3차원 소자 집적을 위한 저온접합 공정 개발을 위해 Cu-Cu 열 압착 접합을 $300^{\circ}C$에서 30분간 실시하고 $N_2+H_2$, $N_2$분위기에서 전 후속 열처리 효과에 따른 정량적인 계면접착에너지를 4점굽힘시험법을 통해 평가하였다. 전 열처리는 100, $200^{\circ}C$의 $N_2+H_2$ 가스 분위기에서 각각 15분간 처리하였고, 계면접착에너지는 2.58, 2.41, 2.79 $J/m^2$로 전 열처리 전 후에 따른 변화가 없었다. 하지만 250, $300^{\circ}C$의 $N_2$ 분위기에서 1시간씩 후속 열처리 결과 2.79, 8.87, 12.17 $J/m^2$으로 Cu 접합부의 계면접착에너지가 3배 이상 향상된 결과를 얻을 수 있었다.

• 대한금속재료학회지
• /
• 제50권1호
• /
• pp.71-77
• /
• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.