• Title/Summary/Keyword: Surface technology

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A Reliability Test for Pb-Free Plating Solution and its Deposit (Pb-Free 도금용액 및 피막의 신뢰성평가)

  • Hur, Jin-Young;Koo, Suck bone;Lee, Hong-Kee
    • Clean Technology
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    • v.11 no.3
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    • pp.153-164
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    • 2005
  • This study found a reliable evaluation for four kinds of pb-Free plating solutions and it's layers, through pure Sn, SnAg, SnBi and SnCu. These four kind of solutions are widely used to pb-Free plating. Hull-cell, Harring-blum, coverage, throwing power, current efficiency, stability, life-time, composition, hardness, roughness, abrasion, scratch, solderability, corrosion, contact angle, morphology, SIR(Surface insulation resistance) and Whisker test were experimented. Also, Using ICP, XRF, FE-SEM, EDS, temperature/humidity chamber, solderability tester, hardness tester, roughness tester, abrasion tester, salt spray tester, contact angle tester, SIR tester, and microscope. In this paper could be shown the systematic and various analysis for reliability about four kinds of pb-Free plating solutions, processes and it's deposit surface.

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Effect of Complexing Agents on Adhesion Strength between Electroless Copper Film and Ta Diffusion Barrier (무전해 구리 도금액에서 착화제가 접합력에 미치는 영향에 대한 고찰)

  • Lee, Chang-Myeon;Jeon, Jun-Mi;Hur, Jin-Young;Lee, Hong-Kee
    • Journal of Surface Science and Engineering
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    • v.47 no.4
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    • pp.162-167
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    • 2014
  • The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength using rochelle's salt as complexing agent was higher than the case of using EDTA-4Na. Effect of complexing agent on adhesion strength and electrical resistivity was studied in crystal structural point of view.

Development of Surface Treatment for Hydrophobic Property on Aluminum Surface (알루미늄의 발수 표면처리 기술 개발)

  • Byun, Eun-Yeon;Lee, Seung-Hun;Kim, Jong-Kuk;Kim, Yang-Do;Kim, Do-Geun
    • Journal of Surface Science and Engineering
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    • v.45 no.4
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    • pp.151-154
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    • 2012
  • A hydrophobic surface has been fabricated on aluminum by two-step surface treatment processes consisting of structure modification and surface coating. Nature inspired micro nano scale structures were artificially created on the aluminum surface by a blasting and Ar ion beam etching. And a hydrophobic thin film was coated by a trimethylsilane ($(CH_3)_3SiH$) plasma deposition to minimize the surface energy of the micro nano structure surface. The contact angle of micro nano structured aluminum surface with the trimethylsilane coating was $123^{\circ}$ (surface energy: 9.05 $mJ/m^2$), but the contact angle of only trimethylsilane coated sample without the micro nano surface structure was $92^{\circ}$ (surface energy: 99.15 $mJ/m^2$). In the hydrophobic treatment of aluminum surface, a trimethylsilane coated sample having the micro nano structure was more effective than only trimethylsilane coated sample without the micro nano structure.

Effect of Alkali Surface Modification on Adhesion Strength between Electroless-Plated Cu and Polyimide Films (알카리 표면개질 처리가 무전해 구리 도금피막과 폴리이미드 필름의 접합력에 미치는 효과)

  • Son, Lee-Seul;Lee, Ho-Nyun;Lee, Hong-Kee
    • Journal of Surface Science and Engineering
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    • v.45 no.1
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    • pp.8-14
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    • 2012
  • The effects of the alkali surface modification process on the adhesion strength between electroless-plated Cu and polyimide films were investigated. The polyimide surfaces were effectively modified by alkali surface treatments from the hydrophobic to the hydrophilic states, and it was confirmed by the results of the contact angle measurement. The surface roughness increased by alkali surface treatments and the adhesion strength was proportional to the surface roughness. The adhesion strength of Cu/polyimide interface treated by KOH + EDA (Ethylenediamine) was 874 gf/cm which is better than that treated by KOH and KOH + $KMnO_4$. The results of XPS spectra revealed that the alkali treatment formed oxygen functional groups such as carboxyl and amide groups on the polyimide films which is closely related to the interfacial bonding mechanism between electroless-plated Cu and polyimide films. It could be suggested that the species and contents of functional group on polyimide films, surface roughness and contact angle were related with the adhesion strength of Cu/polyimide in combination.

Study on Two Step Plasma Treatment for Electroless Cu Plating of Fluoropolymer (불소수지의 무전해 동도금을 위한 단계적 플라즈마 전처리법에 관한 연구)

  • Shin, Seung-Han;Han, Sung-Ho;Kim, Young-Seok
    • Journal of Surface Science and Engineering
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    • v.38 no.3
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    • pp.118-125
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    • 2005
  • Low temperature plasma treatment with different gases and rf powers were performed to improve the adhesion strength between polytetrafluoroethylene(PTFE) and electroless deposited copper. According to the research, $H_2$ plasma having hydrogen radical was more effective in surface polarity modification than $O_2$ plasma due to the defluorination reaction. However, surface roughness of PTFE was more increased with $O_2$ than $H_2$ plasma. PTFE treated with $120W-O_2$ plasma and $250w-H_2$ plasma, consecutively showed rougher surface than single step $250w-H_2$ plasma treated one and more hydrophilic than single step $120W-O_2$ plasma treated one. And it showed 5B tape test grade, which is better adhesion property than 1B or 3B obtained by single step plasma treatment. In addition, adhesion strength between PTFE and Cu deposit is also deeply affected by residual water on its interface.

A Reliability Test for ph-free SnCu Plating Solution and It's Deposit (Sn-Cu 무연 도금용액 및 피막의 신뢰성평가)

  • Lee Hong-Kee;Hur Jin-Young
    • Journal of Surface Science and Engineering
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    • v.38 no.6
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    • pp.216-226
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    • 2005
  • Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, JIS, KS, JEDEC, EIAJ etc. All products can divide at solder part and finishing part These can tested each and synthetically divide. This research is reliability evaluation for three kind of ph-free SnCu solder plating solution and it's deposit. First, executed analysis about Pure Sn, SnCu solutions and plating surface by way similar to other plating solution analysis. Next, executed reliability about test method and equipment for reliable analyzer system construction. Next, data comparison and estimation, main estimation test method and item's choice. In this paper the systematic surface analysis and reliability for plating solutions and it's deposit in metal surface finishing processes could be shown.

Hydrophilic surface formation of polumer treated by ion assisted reaction and its applications (이온빔보조 반응법을 이용한 고분자 표면의 친수성처리와 그 응용)

  • Cho, J.;Choi, S. C.;Yun, K.H.;Koh, S. K.
    • Journal of the Korean Vacuum Society
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    • v.8 no.3B
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    • pp.262-268
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    • 1999
  • Polycarbonate (PC) and Polymethylmethacrylate (PMMA) surface was modified by ion assisted reaction (IAR) technique to obtain the hydrophilic functional groups and improve the wettability. In conditions of ion assisted reaction, ion beam energy was changed from 500 to 1500eV, and ion dose and oxygen gas blown rate were fixed $1\times10^{16}$ ions/$\textrm{cm}^2$ and 4ml/min, respectively. Wetting angle of water on PC and PMMA surface modified by $Ar^+$ ion without blowing oxygen at 4ml/mon showed $5^{\circ}$ and $10^{\circ}$. Changes of wetting angle with oxygen gas and $Ar^+$ ion irradiation were explained by considering formation of hydrophilic group due to a reaction between irradiated polymer chain by energetic ion irradiation and blown oxygen gas. X-ray photoelectron spectroscopy analysis shows that hydrophilic groups such as -C-O, -(C=O)- and -(C=O)-O- are formed on the surface of polymer by chemical interaction. The polymer surface modification using ion assisted reaction only changed the surface physical properties and sept the bulk properties. In comparison with other modification methods, the surface modification by IAR treatment was chemically stable and enhanced the adhesion between metal and polymer surface. The applications of various kinds of polymer surface modification methods, metal and polymer surface. The applications of various kinds of polymer surface modification could be appled to the new materials about hydrophilic surface properties by IAR treatment. The adhesion between metal film and polymer measured by Scotch tape test whether the hydrophilic surfaces could improve the adhesion strength or not.

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Effect of process pressure and nitrogen addition ratio on the uniformity of hardening depth and surface properties of Cr-Mo low alloy steel in vacuum carburizing (Cr-Mo 저합금강의 진공침탄 공정 압력 및 질소 첨가 비율에 따른 경화깊이 균일도 및 표면 특성 효과)

  • Gi-hoon Kwon;Hyunjun Park;;Young-Kook Lee;Kyoungil Moon
    • Journal of Surface Science and Engineering
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    • v.56 no.1
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    • pp.94-103
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    • 2023
  • The effects of carburizing pressure and gas ratio on vacuum carburizing properties (uniformity and surface characteristics) have been studied through the analyses of carbon concentration, hardness, surface color, surface roughness and type of carbon bonding. AISI 4115 steel specimens were carburized with various pressures (1, 5, and 10 Torr) at different locations (P1, P2, P3, P4, P5, and P6) inside a furnace held at 950 ℃. Since the carburizing pressure represents the density of the carburizing gas, it plays an important role in improving the carburizing uniformity according to locations in the furnace. As the carburizing pressure increased, the carburizing uniformity according to the sample location was improved, but the surface of the carburized specimen was discolored due to the residual acetylene gas, which does not contribute to the carburizing reaction. Therefore, the carburizing uniformity and surface discoloration have been improved by injecting acetylene gas (carburizing gas) and nitrogen gas (non-reactive gas) in a specific ratio.