• Tribology and Lubricants
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• 제35권6호
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• pp.323-329
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• 2019

Sapphire is currently used as a substrate material for blue light-emitting diodes (LEDs). The market for sapphire substrates has expanded rapidly as the use of LEDs has extended into various industries. However, sapphire is classified as one of the most difficult materials to machine due to its hardness and brittleness. Recently, a lap-grinding process has been developed to combine the lapping and diamond mechanical polishing (DMP) steps in a single process. This paper studies, the effect of wafer surface roughness on the chemical mechanical polishing (CMP) process by pressure and abrasive concentration in the lap-grinding process of a sapphire wafer. In this experiment, the surface roughness of a sapphire wafer is measured after lap-grinding by varying the pressure and abrasive concentration of the slurry. CMP is carried out under pressure conditions of 4.27 psi, a plate rotation speed of 103 rpm, head rotation speed of 97 rpm, and slurry flow rate of 170 ml/min. The abrasive concentration of the CMP slurry was 20wt, implying that the higher the surface roughness after lapgrinding, the higher the material removal rate (MRR) in the CMP. This is likely due to the real contact area and actual contact pressure between the rough wafer and polishing pad during the CMP. In addition, wafers with low surface roughness after lap-grinding show lower surface roughness values in CMP processes than wafers with high surface roughness values; therefore, further research is needed to obtain sufficient surface roughness before performing CMP processes.

• Transactions on Electrical and Electronic Materials
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• 제1권4호
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• pp.1-6
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• 2000

The mechanical strength of silicon carbide dose nor permit the use of diffusion as a means to achieve selective doping as required by most electronic devices. While epitaxial layers may be doped during growth, ion implantation is needed to define such regions as drain and source wells, junction isolation regions, and so on. Ion activation without an annealing cap results in serious crystal damage as these activation processes must be carried out at temperatures on the order of 1600$^{\circ}C$. Ion implanted silicon carbide that is annealed in either a vacuum or argon environment usually results in a surface morphology that is highly irregular due to the out diffusion of Si atoms. We have developed and report a successful process of using silicon overpressure, provided by silane in a CAD reactor during the anneal, to prevent the destruction of the silicon carbide surface, This process has proved to be robust and has resulted in ion activation at a annealing temperature of 1600$^{\circ}C$ without degradation of the crystal surface as determined by AFM and RBS. In addition XPS was used to look at the surface and near surface chemical states for annealing temperatures of up to 1700$^{\circ}C$. The surface and near surface regions to approximately 6 nm in depth was observed to contain no free silicon or other impurities thus indicating that the process developed results in an atomically clean SiC surface and near surface region within the detection limits of the instrument(${\pm}$1 at %).

• Journal of Korean Dental Science
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• 제14권2호
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• pp.79-89
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• 2021

Purpose: The technique introduced in this study describes a technique for surface treatment that applies a photocuring resin to the surface of an interim crown fabricated by three-dimensional (3D) printing without a conventional polishing method. The purpose of this study was to evaluate marginal and internal fit and the intaglio surface trueness of interim crowns after surface treatment of 3D-printed crowns for clinical application. Materials and Methods: An interim crown was fabricated using a 3D printer with digital light-processing technology, and the surface support was removed. After the posttreatment process, the resin was thinly applied to the surface of the interim crown and polymerized to solve the esthetic problem of the surface without the conventional polishing process. In addition, the marginal and internal fits were measured to verify the clinical use of this technique, and the trueness was evaluated to confirm the deformation of the inner surface according to the technical application of the outer surface of the interim crown. The difference before and after the evaluation by a statistical method was verified using an independent t-test (α=0.05). Result: There was no significant difference in the marginal and internal fit before and after the application of this technique (P>0.05). There was no significant difference in intaglio surface trueness before and after the application of this technique (P=0.963). Conclusion: There was no change in the marginal and internal fit or in intaglio surface trueness of the interim crowns to which this technology was applied. This surface treatment technique is a more convenient method for interim crowns fabricated using 3D-printing technology without the conventional polishing process.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1283-1288
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• 2003

The friction heat generated by the CMP process hasinfluence on removal rate and WIWNU(Within Wafer Non-Uniformity). Therefore, the object of this study is to find the distribution of temperature on pad surface during CMP process. To do this, the authors analyse the kinematics of CMP equipment to verify the sources of friction heat and compare the analysis result with the experimental results. Through the analysis and experiment conducted in this paper, we can predict the distribution of polishing temperature across the pad surface. Furthermore the result could help to predict the process conditions which could enhance the polishing results, such as WIWNU and removal rate of thin film to achieve more efficient process.

• 한국정밀공학회지
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• 제20권9호
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• pp.32-39
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• 2003

Pulse electrochemical machining process with high or low current density may produce a non-lustrous surface on workpiece surface. The usual polishing process to remove a black layer from the surface has been hand polish the part. But the milli-to-micro meter scale structure formed by the electrochemical machining process may be destroyed while polishing process. The application of ultra short voltage pulses based on the analysis of electrical double layer charging process allows high resolution electrochemical machining and polishing. This technique was based on the specific polarization resistance from the comparison of ideal and experimental potential variation during short voltage pulses.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1999년도 춘계학술대회논문집
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• pp.169-172
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• 1999

Thixoforming process has been accepted as a new method for fabricating near net shaped products with lighweight aluminum alloys. The thixoforming process consists of reheating process of billet, billet handing filling into the die cavity and solidification of thixoformed part,. in this paper the thixoforming experiments are performed with two different die temperature ({{{{ TAU _d}}}}=20$0^{\circ}C$ 30$0^{\circ}C$) and orifice gate type. The microstructures of SSM(357, A490 and ALTHIX 86S) fabricated in thixoforming process are evaluated in therms of globularization and grain size. effect of alloying elements onthe surface and internal defects is investigated. Finally the methods to obtain the thixoformed products with good mechanical propertis are proposed by solution for avoiding the surface and internal defects.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 추계학술대회논문집
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• pp.311-314
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• 2004

The housing of the fuel injector supports the rod, the niddle valve and the solenoid. Based on the procedure of process design, in this paper, the forming operation is designed by the rigid-plastic finite element method. The metal flow during the forming of the fuel injector housing is axisymmetric until the final forming process. The response surface method has been performed to reduce the under-fill and the maximum effective strain. From the results of RSM, the second order regression model of equation is calculated by the least square method and used to determine the optimal values of design variables by simultaneously considering the responses. It is noted that upper under-fill is affected by the design variables of the $2^{nd}$ forming process and lower under-fill is affected by the design variables of the 1st forming process.

• 한국공작기계학회논문집
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• 제18권1호
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• pp.22-28
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• 2009

In order to optimize the polishing process, Run to Run control scheme has been applied to the micro mold polishing in this study. Also, to fully understand the effect of parameters on the surface roughness a design of experiment is performed. By linear approximation of main factors such as gap and rotational speed of micro quill, EWMA (Exponential Weighted Moving Average) gradual mode controller is adopted as a optimizing tool. Consequently, the process converged quickly at a target value of surface roughness Ra 10nm and Rmax 50nm, and was hardly affected by unwanted process noises like initial surface quality and wear of magnetic abrasives.

• 한국표면공학회지
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• 제29권5호
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• pp.350-356
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• 1996

This paper presents VHF-Plasma Enhanced Chemical Vapor Deposition (VHF-PECVD) of Ti/TiN with silne reduction process, using $TiCl_4$ source. VHF plasma, which is denser than a conventional RF plasma, produces a large number of radicals. Silane reduction process, which supplies silane radicals, more promotes dissociation of Ti-Cl bond than a conventional hydrogen reduction process. therefore, the VHF-PECVD with silane reduction process forms high quality Ti/TiN films, which have low level of Cl content(<0.2 at.%). In result, the resistivity for Ti or TiN is less than 200$\mu$$\Omega$cm. The surface morphology of Ti film is very smooth. The structure of TiN film is amorphous. Furthermore, excellent step coverage for the films is obtained.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 춘계학술대회 논문집
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• pp.281-284
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• 2008

Film insert melding is one of the surface processes that enhances functional or aesthetic qualities of an existing product's surface. In general, film insert molding consists of three processes including thermoforming, trimming and injection molding. Thermoforming, which is the first process of film insert molding, is the most important process because the variation of film thickness has an effect on the mold design and process conditions for the subsequent processes, that are, trimming and injection molding. This study is focused on predicting the film thickness distribution through film insert thermoforming process using commercial FEM code. In order to describe rheological behavior of thermoplastic film (ABS), G'Sell's viscoelastic constitutive law was adopted. The numerical model of film insert thermoforming was established, and the simulation to predict film thickness distribution was performed. Comparison between the results of simulation and experiment was made to validate the proposed finite element analysis.