• Korea-Australia Rheology Journal
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• v.14 no.2
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• pp.63-70
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• 2002

Chemical mechanical planarization (CMP) is the polishing process enabled by both chemical and mechanical actions. CMP is used in the fabrication process of the integrated circuits to achieve adequate planarity necessary for stringent photolithography depth of focus requirements. And recently copper is preferred in the metallization process because of its low resistivity. We have studied the effects of chemical reaction on the polishing rate and surface planarity in copper CMP by means of numerical simulation solving Navier-Stokes equation and copper diffusion equation. We have performed pore-scale simulation and integrated the results over all the pores underneath the wafer surface to calculate the macroscopic material removal rate. The mechanical abrasion effect was not included in our study and we concentrated our focus on the transport phenomena occurring in a single pore. We have observed the effects of several parameters such as concentration of chemical additives, relative velocity of the wafer, slurry film thickness or ash)tract ratio of the pore on the copper removal rate and the surface planarity. We observed that when the chemical reaction was rate-limiting step, the results of simulation matched well with the experimental data.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.13 no.6
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• pp.66-72
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• 2014

Incremental forming is a relatively novel sheet forming process, in which parts can be formed without the use of dedicated dies. In this paper, the influence of the process parameters (tool diameter, step size, feed rate, existence of a die, forming methods, and kinds of tool path) on surface roughness in the case in which parts are processed by incremental forming was discussed. Al 1050 material is used in the experiments. A table of orthogonal arrays is used to design the experiments and the ANOVA method is employed to statistically analyze the results. The obtained results show that the process parameters of tool diameter, step size, and the existence of a die have a significant effect on the surface roughness, whereas the feed rate, forming methods and kinds of tool path are insignificant.

• Journal of the Korean institute of surface engineering
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• v.35 no.6
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• pp.401-407
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• 2002

Most of organic compounds discharged from industrial wastewater are treated by chemical oxidation, adsorption and biodegradable process. This process has been demanded a new advanced environmental wastewater treatment process. From this point of view, an electrochemical oxidation process using electrocatalysts has been developed for the destruction of organic compounds. Through this study, a ruthenium oxide/iridium oxide supported on titanium expanded metal was fabricated by thermal decomposition method and its performance was excellent during this experiment.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.10a
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• pp.254-259
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• 1997

The measurement of surface roughness and waviness by means of noncontact method is an important area to be developed for GAC(Geometrical Adaptive Control) system. This paper deal with the design of noncontact in-process measurement system which measures the surface roughness and waviness during cylindrical grinding. This measuring system is simple and the apparatus proposed is composed of a laser unit, photodetector and optical system. During operation, the surface of a workpiece is continuously scanned by a laser beam. This method makes it possible to detect the surface roughness and waviness along the feed direction by control the spot diameter of laser beam. The experimental results show that the presence of chattering, loading and glazing can be detected sensitively along the feed directions.

• Restorative Dentistry and Endodontics
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• v.21 no.1
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• pp.360-365
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• 1996

The purpose of this study was to evaluate the changes in the degree of conversion on a composite resin surface following heat treatment and mylar strip finishing. The effects of the time interval between the light-curing and heat-curing process were also evaluated. The composite resin surface which had been covered with a coverglass showed a lower conversion rate than the surface from which a layer of $500{\mu}m$ was ground away. The composite resin surface was definitely affected by oxygen during the heat curing process when it had not been insulated. When the composite resins were heat cured after 3 days of storage following the light curing process, the increased in the degree of conversion through heatcuring was limited.

• Tunnel and Underground Space
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• v.5 no.4
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• pp.347-362
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• 1995

The purpose of this study was that manage effectively the excavation process of the transport tunnel in DONGHAE mine area by investigating the variationof the surface and groundwater flow system around the tunnel and neighbouring villages. Thus, the effect of excavation and water-prrofing process on the water system has been studied through the naked eye survey of the tunnel and the surface outcrop, joint survey, core drilling, the measurement of the surface water quantity, evapotranspiration and precipitation analysis, rock hydraulics approach, the pressure test of boreholes, the variation of the water level, and finally the numerical analysis. From above approachs, we derived the conclusion that the exhaustion of the surface water was not caused by the tunnel excavation on the groundwater system was minimized by effective water proofing process.

• Design & Manufacturing
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• v.8 no.2
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• pp.41-45
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• 2014

Automated polishing apparatus based on the research have been developed. The research is improvement of polishing process for surface quality and uniformity improvement of preform injection mold core. Surface quality of preform core have influence on ejecting and product quality after injection molding. Thus, the current being made by hand to automate the polishing process, the surface of the preform to improve the quality and uniformity improvement. First made a division by analyzing manual process a step-by-step. And draw a mechanism for converting mechanical movement. Automated polishing apparatus for preform core was developed, through which shortens production time and were able to secure the safety of the worker.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.82-85
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• 2003

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by Micro-lapping process. The sapphire crystalline wafers were characterized by DCXD(Double Crystal X-ray Diffraction). The sample quality of crystalline sapphire wafer at surface has a FWHM(Full Width at Half Maximum) of 250 arcsec. This value at the sapphire wafer surfaces indicated 0.12${\mu}{\textrm}{m}$ sizes. Surfaces of sapphire wafers were mechanically affected by residual stress and surface default. Also Surfaces roughness of sapphire wafers were measured 2.1 by AFM(Atom Force Microscope).

• Laser Solutions
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• v.10 no.1
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• pp.19-27
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• 2007

Previous studies demonstrated that laser ablation under transparent liquid can result in ablation enhancement and particle removal from the surface. Although the ablation enhancement by liquid is already known for semiconductor and metal, the phenomena of polymer ablation have not been studied. In this work, tile liquid-assisted excimer laser ablation process is examined for polymer materials, such as polyethylene terephthalate (PET), polymethyl methacrylate (PMMA) with emphasis on ablation enhancement and surface topography. In the case of PET and PMMA, the effect of liquid is analyzed both for thin water film and bulk water. The results show that application of liquid increases the ablation rate of PMMA while that of PET remains unchanged even in the liquid-assisted process. However, the surface roughness is generally deteriorated in the liquid-assisted process. The surface topography is found to be strongly dependent on the method of liquid application, i.e., thin film or bulk liquid.