• 한국환경과학회지
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• 제11권3호
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• pp.155-160
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• 2002

Using measured data at Daegu by tethersonde for the period of 1984∼1987, we have investigated the lower atmospheric boundary layer structure including relationships between inversion layer and meteorological factors(wind and temperature), and the inversion strength and inversion height. The inversion layer was defined from the vertical temperature profile and its strength was analyzed with the wind shear as well as the vertical temperature gradient. From October to January, measured inversion layer isn't destroyed, however, in June, after sun rise, it is destroyed by surface heating and mixed layer is developed from surface. According to Pasquill stability classes, the moderately stable cases dominated. It's the larger vertical temperature gradient the lower SBL height. We have introduced B(bulk turbulence scale) which indicated SBL height. It's larger B, the higher SBL height and vice versa. It was noted that the bulk turbulence scale (B) is appropriate to determine the stable boundary layer height.

• 한국표면공학회지
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• 제39권1호
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• pp.1-8
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• 2006

In this study, effect of sputtering after plasma nitriding and before PVD coating on the microstucture, microhardness, surface roughness and the adhesion strength of CrN thin films were investigated. Experimental results showed that this sputtering process not only removed surface compound layer which formed during a plasma nitriding process but also induced an alteration of the surface of plasma nitrided substrate in terms of microhardness distribution and surface roughness, which in turn affected the adhesion strength of PVD coatings. After sputtering, microhardness distribution showed general decrease and the surface roughness became increased slightly. The critical shear stress measured from the scratch test on the CrN coatings showed an approximately twice increase in the binding strength through the sputtering prior to the coating and this could be attributed to a complete removal of compound layer from the plasma nitrided surface and to an increase in the surface roughness after sputtering.

• 한국표면공학회지
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• 제39권6호
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• pp.268-275
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• 2006

In this study, effect of sputtering on the plasma-nitriding substrate and before PVD coating on the microstucture, microhardness, surface roughness and the adhesion strength of CrZrN thin films were investigated. Experimental results showed that this sputtering process not only removed surface compound layer which formed during a plasma nitriding process but also induced an alteration of the surface of plasma nitrided substrate in terms of microhardness distribution, surface roughness. This in turn affected the adhesion strength of PVD coatings. After sputtering, microhardness distribution showed general decrease and the surface roughness became increased slightly. The critical shear stress measured from the scratch test on the CrZrN coatings showed an approximately 1.4 times increase in the adhesion strength through the sputtering prior to the coating and this could be attributed to a complete removal of compound layer from the plasma nitrided surface and to an increase in the surface roughness after sputtering.

• 한국표면공학회지
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• 제22권4호
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• pp.185-196
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• 1989

The surface modification of a mild and stainless steel by alumina sprayed coating were studied. The effects of surface roughness and bond coating layer on the adhesive strengthy and durability of sprayed specimens were also investiated. The adhesive strength of ceramic coating was affected by surface roughness and bond coating layer thinkness. That showed excellent undergrit blast time and bond coating layer; 60 sec and 0.15-0.33mm, respectively. The adhesive strength and densification of sprayed coating with air pressure were superior to those of without and fracture was mainly occured at alumina-bond coating interface. Under ambient atmosphere at $800^{\circ}C$, the oxides existed within bond coating layer promote diffusion of oxygen to lower durability of sprayed specimens. In this case, fracure was occured at sudstrate-bond coating interface.

• 한국재료학회지
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• 제17권10호
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• pp.509-515
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• 2007

In order to fabricate adhesiveless 2-layer flexible copper clad laminate (FCCL) used for COF (chip on film) with high peel strength, polyimide (PI; Kapton-EN, $38\;{\mu}m$) surface was modified by reactive $O_2^+$ and $N_2O^+$ ion beam irradiation. 300 mm-long linear electron-Hall drift ion source was used for ion irradiation with ion current density (J) higher than $0.5\;mA/cm^2$ and energy lower than 200 eV. By vacuum web coating process, PI surface was modified by linear ion source and then 10-20 nm thick Ni-Cr and 200 nm thick Cu film were in-situ sputtered as a tie layer and seed layer, respectively. Above this sputtered layer, another $8-9{\mu}m$ thick Cu layer was grown by electroplating and subsequently acid and base resistance and thermal stability were tested for examining the change of peel strength. Peel strength for the FCCLs treated by both $O_2^+$ and $N_2O^+$ ion irradiation showed similar magnitudes and increased as the thickness of tie layer increased. FCCL with Cu (200 nm)/Ni-Cr (20 nm)/PI structure irradiated with $N_2O^+$ at $1{\times}10^{16}/cm^2$ ion fluence was proved to have a strong peel strength of 0.73 kgf/cm for as-received and 0.34 kgf/cm after thermal test.

• 한국표면공학회지
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• 제51권4호
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• pp.191-196
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• 2018

The self-annealing which leads evolution of microstructure in copper electroplating layers at room temperature occurs after forming deposition layer. During the process, crystal orientation, size and sheet resistance of plating layer change. Lastly, it causes the change of physical and mechanical characteristics such as a tensile strength of plating layer. In this study, the variation of incorporated impurities, microstructure and sheet resistance of copper plating layer formed by electroplating are measured with and without inorganic additives during the self-annealing. In case of absence of inorganic additives, the copper layer presents strong total intensity of incorporated impurities. During the self-annealing, such width of reduction was significant. Moreover, microstructure and crystal size are increased while the tensile strength is decreased noticeably. On the other hand, in the presence of inorganic additives, there is no observable distinction in the copper plating layer. According to the observation on movements of the incorporated impurities in electrodeposition copper layer, within 12 hours the impurities are continuously shifted from inside of the plating layer to its surface after as-deposited electroplating. Within 24 hours, except for the small portion of surface layer, it is considered that most of the microstructure is transformed.

• 한국표면공학회지
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• 제32권6호
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.78-81
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. Surface structure and adhesion of semiconductive silicon rubber by surface asperity was obtained from SEM and T-peel test. In addition, ac breakdown test was carried out for elucidating the change of electrical property by roughness treatment. From the results, Adhesive strength of semiconductive-insulation interface was increased with surface asperity. Dielectric breakdown strength by surface asperity decreased than initial Specimen, but increased from Sand Paper #1200. According to the adhesional strength data unevenness and void formed on the silicone rubber interface expand the surface area and result in improvement of adhesion. Before treatment Sand Paper #1200, dielectric breakdown strength was decreased by unevenness and void which are causing to have electric field mitigation small. After the treatment, the effect of adhesion increased dielectric breakdown strength. It is found that ac dielectric breakdown strength was increased with improving the adhesion between the semiconductive and insulating interface.

• 대한기계학회논문집A
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• 제24권8호
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• pp.2022-2031
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• 2000

Since the surface roughness of adherends affects much the strength of adhesivelybonded joints, the effect of surface roughness on the fatigue life of adhesively bonded tubular single lap joints was investigated analytically and experimentally by fatigue torsion test. The stiffness of the interfacial layer between adherends and adhesive was modeled as a normal statistical distribution function of surface roughness of adherends. From the investigation, it was found that the optimum surface roughness of adherends for the fatigue strength of tubular single lap joints was dependent on bondthickness and applied load.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1998년도 봄 학술발표회논문집(II)
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• pp.671-676
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• 1998

This study deals with the effect on penetration properties of siliceous ion througth the mortar applicated by the waterproofing coating materials of siliceous seler liquid type. The tests of properties for reinforcing effect in mortar substrate surface layer are five kinds of water permeability, absorption, compressive strength, surface layer strength, pH content and chemical attack effect. Water permeability of mortar coated siliceous sealer in very than that of plane mortar. compressive strength of mortar coated siliceous sealer in larger than that of plane mortar about 10%.