• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.69-69
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• 2012

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.11a
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• pp.4-4
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• 1998

• Transactions on Electrical and Electronic Materials
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• v.13 no.2
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• pp.51-59
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• 2012

Piezoelectric langasite crystals have superior properties such as high temperature performance and high quality Q and can be applied in combustion pressure sensors and surface acoustic wave (SAW) filters. Crystal growth, crystal structure and properties of langasite group are reviewed, and the mechanism of piezoelectricity of langasite is presented based on the crystal structure and deformation under high pressure. Finally, for the discovery of new piezoelectric materials, this paper presents the role of the framework, and recommends the search of framework crystal structure, because the characteristic of the mechanism exists on the framework of the crystal structure.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.383-386
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• 2004

The one of important requisites for fabricating molecular electronic device is the single crystal direction of bottom substrate nowadays. [1,2]. We obtain the optimum SAM result when the Au crystal is <111> structure for Self-Assembled molecular. To get the <111> crystal Au, we generally repeat heating and cooling course after evaporating Au [3]. However, we can fabricate <111> crystal Av thin film except post treatment because we simultaneously evaporate and anneal using Effusion Cell. In this paper, we study on thin film growth of <111> crystal Au as bottom electrode which is essential for Self-Assembled molecular by Effusion Cell and analyze crystal structure, thickness, surface conductivity and so on as each process condition.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.1
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• pp.34-38
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• 2005

Effects of pH level and slurry particle size on material removal rate and planarization of langasite single crystal wafer have been examined. Higher material removal rate was obtained with lower pH level slurries while the planarization was found to be determined by average particle size of colloidal silica slurries. Slurries containing 0.045 ㎛ amorphous silica particles showed the best polishing effect without any scratches on the surface. Effective particle number has a strong effect on the surface planarization and the removal rate, so that the lower effective particle numbers produced low removal rate but the better planarization results.

• Journal of Advanced Marine Engineering and Technology
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• v.29 no.1
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• pp.68-77
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• 2005

A transient liquid crystal technique has become one of the most effective ways in measuring the local heat transfer coefficients on the entire surface. The key Point of this technique is to convert the inlet flow temperature into an exponential temperature profile using a mesh heater. In order to verify the validity of this technique. the heat transfer characteristics on the wall surface by a pair of longitudinal vortices is investigated experimently and numerically. A standard ${\kappa}-{\varepsilon}$ is used for the numerical analysis of turbulent flow field. It is found from experiment and numerical analysis that two peak values exist over the whole domain. as the longitudinal vortices move to the farther downstream. these peak values decrease and the dimensionless averaged Nusselt number with the lapse of time is maintained nearly at constant values. The experiment results obtained from the present experiment in terms of the transient liquid crystal technique are in good agreement with the numerical results. Therefore, the transient liquid crystal technique developed for the measurement of heat transfer coefficient is proved to be a valid method.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.16 no.2
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• pp.66-70
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• 2006

Various kind of structural defects are observed to be present on the oxidized surface of the silicon crystal which was previously damaged mechanically. The formation of such defects was found to depend on the amount of damage induced and the temperature of thermal oxidation. It was confirmed by the measurement of minority carrier life time that gettering capability decreases as the size of the defects increase. The strained layer which is formed due to smaller amount of damage or lower oxidation temperature believed to has higher capability of gettering over defects like dislocation loops or stacking faults.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.19 no.5
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• pp.242-245
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• 2009

AlN crystals were grown by a sublimation process without seed crystals and the growth morphology of them was characterized. The grown AlN crystals were a polycrystalline phase, which had a diameter of $60\sim200\;{\mu}m$ and were grown with a growth rate of $0.2\sim0.5\;{\mu}n/hr$. It was observed that the as-grown crystals had a hexagonal crystal structure and revealed that these crystals were grown with a morphology of columnar morphology in the initial stage of the growth before they were enlarged in a way of a lateral growth behavior in the final stage. On the surface, a lot of pinholes were observed on the surface of crystals grown. The evolution of a growth morphology was characterized by optical and scanning electron microscopic observation.

• Journal of the Korean institute of surface engineering
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• v.51 no.4
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• pp.191-196
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• 2018

The self-annealing which leads evolution of microstructure in copper electroplating layers at room temperature occurs after forming deposition layer. During the process, crystal orientation, size and sheet resistance of plating layer change. Lastly, it causes the change of physical and mechanical characteristics such as a tensile strength of plating layer. In this study, the variation of incorporated impurities, microstructure and sheet resistance of copper plating layer formed by electroplating are measured with and without inorganic additives during the self-annealing. In case of absence of inorganic additives, the copper layer presents strong total intensity of incorporated impurities. During the self-annealing, such width of reduction was significant. Moreover, microstructure and crystal size are increased while the tensile strength is decreased noticeably. On the other hand, in the presence of inorganic additives, there is no observable distinction in the copper plating layer. According to the observation on movements of the incorporated impurities in electrodeposition copper layer, within 12 hours the impurities are continuously shifted from inside of the plating layer to its surface after as-deposited electroplating. Within 24 hours, except for the small portion of surface layer, it is considered that most of the microstructure is transformed.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.12 no.4
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• pp.371-380
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• 2000

The turbulent heat transfer from a round oblique impinging jet on a concave surface were experimentally investigated. The transient measurement method using liquid crystal was used in this study. In this measurement, a preheated wall was suddenly exposed to an impinging jet while recording the response of liquid crystals to measure surface temperature. The Reynolds numbers were 11000, 23000 and 50000, nozzle-to-surface distance ratio was from 2 to 10 and the surface angles were a =$0^{\circ}\;15^{\circ},\;30^{\circ}and\;40^{\circ}$. Correlations of the stagnation point Nusselt numbers with Reynolds number, jet-to-surface distance ratio and dimensionless surface angle, which account for the surface inclined angle, are presented. The maximum Nusselt numbers, in this experiment, occurred in the direction of upstream. The displacement of the maximum Nusselt number from the stagnation point increases with increasing surface angle or decreasing nozzle-to-surface distance. In this experiment, the maximum displacement is about 0.7 times of the jet nozzle diameter when surface curvature, D/d is 10.