• 대한기계학회논문집
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• 제13권4호
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• pp.771-779
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• 1989

본 연구에서는 기판의 양면에 부품이 SMT방법으로 탑재되어 있는 경우에 기판사이에 형성되는 유동채널에서의 열전달 및 유동특성을 연구하였다.

• Journal of Advanced Marine Engineering and Technology
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• 제16권5호
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• pp.85-96
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• 1992

Engine enclosures are widely adopted to reduce the noise emission in various fields of application. The radiated noise, which is due to the vibration of enclosure's outer surface, is composed of two kinds of sound power with different path of propagation. One is the 'structure-borne sound power' which stems from the engine's vibratory force applied to the structure of enclosure through the mounting parts of engine etc., while the other is the 'air-borne sound power' which is originated by the sound power radiated from the engine surface to the inner space of enclosure that should excite the vibration of enclosure from inside. In order to get a most efficient engine enclosure is required a profound consideration upon the above structure-borne and air-borne noise, since the guiding principle of countermeasure for each noise is quite different. The controlling of input vibration and its isolation are major subject for the structure-borne sound power and the specifications of absorbing member and damping panels are the major interests for the air-borne sound power. Hence it seems very efficient to separate the total sound power into two categories with a great accuracy when one think of further reduction of engine noise from the exciting enclosure, however, its separating methods have not been made clear for many years. Then author proposes a new practical separation method of two propagation path's contribution to the total radiation sound power for the enclosure under the engine operating condition.

• 마이크로전자및패키징학회지
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• 제9권4호
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• pp.61-68
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• 2002

지금까지 전자 디바이스의 솔더접합부에 대한 신뢰성 평가에 있어서는 열충격시험에 의한 평가가 주류를 이루었다. 그러나 최근 모바일 제품이 소형화/다기능화되고 고밀도실장에 대한 요구가 증가함에 따라 BGA/CSP와 같은 솔더볼을 사용하는 패키지가 표면실장의 주류를 이루게 되었으며, 솔더접합부에 대한 메커니컬 스트레스 수명이 요구되어지고 있다. BGA/CSP의 솔더접합부에 대한 신뢰성 평가는 하중을 가한 상태에서 데이지체인 패턴의 전기적 저항변화와 스트레인 게이지에 의한 스트레스-스트레인 커브에 의해 행해진다. 본 연구에서는 자체 개발한 PCB만능시험장치의 응용과 솔더접합부에 대한 메커니컬 스트레스의 동적거동을 평가한 소니의 실험자료를 소개하도록 한다.

• 대한기계학회논문집A
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• 제21권6호
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• pp.951-960
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• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.

• 센서학회지
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• 제26권2호
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• pp.101-106
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• 2017

A novel intravenous (IV) infusion monitoring sensor is presented to measure the drop rate in the drip chamber of an IV infusion set. It is based on a capacitive proximity sensor and detects the variation of the longitudinal electric field induced by the drop falling into the drip chamber. Unlike the conventional capacitor sensor with two semi-cylindrical conductor plates, the proximity sensor for IV monitoring is composed of a pair of conductor rings which are mounted on the outer surface of the drip chamber with a specific gap between them. The characteristics of the proximity sensor for IV monitoring were investigated through three dimensional electrostatic simulations. It showed quite superior performances in comparison with the conventional capacitor sensor. Especially, the proposed proximity sensor exhibits consistent sensitivity regardless of its mounting position on the drip chamber, operates normally though the drip chamber is tilted and shows robustness to the changes of the drop size and the drip factor of the IV infusion set. Thus, the proximity sensor for IV monitoring is more suitable for use in actual environment of IV therapy compared with the conventional capacitor sensor.

• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.43-47
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• 2004

We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas ＆ moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.

• 반도체디스플레이기술학회지
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• 제5권3호
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• pp.29-32
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(Printed Circuit Boards), Thermal control of the reflow process is required in order to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD(Computational Fluid Dynamics) tool for predicting flow and temperature distributions. Porous plate was installed to prevent leakage flow which was one of the major problem of temperature uniformity in the reflow process. There is a separation region where the flow is turned. Outside wall made of porous plate is to prevent and minimize separation region for acquiring uniform temperature during operation. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• 한국정보처리학회:학술대회논문집
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• 한국정보처리학회 2023년도 춘계학술발표대회
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• pp.305-307
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• 2023

현재 제조업에서 설비 라인 증축 및 최적화를 위해서는 공정 분석과 설비 시스템 테스트가 요구되며, 많은 시간과 비용이 소요된다. 이러한 문제를 해결하기 위해, 가상의 설비모델을 이용해 설비검증과 라인 테스트를 수행할 수 있는 다양한 CPS(Cyber Physical System)가 연구되고 있다. 본 논문에서는 다양한 설비 이해관계자 사이의 상호운용성을 확보하기 위해 독일의 Industry 4.0에서 제안한 표준 설비 명세인 AAS(Asset Administration Shell)를 활용한 CPS 구현을 제안한다. SMT(Surface Mounting Technology) 라인 중 Screen Printer를 대상으로, 총 3개의 서브 모델(Sub model)과 17개의 속성(Property)을 AAS 명세하고 이를 이용한 CPS를 구현하는 사례연구를 수행했다. 제안 방법은 표준명세를 활용한 제조 분야 CPS 구현에 적용될 수 있다.

• 에너지공학
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• 제28권1호
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• pp.49-56
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• 2019

본 연구에서는 발전소에서 사용되는 부품의 넓은 표면을 세정하기 위한 브라스팅 노즐을 비압축성 유동해석에 기초하여 설계하였다. 설계된 노즐의 출구측 단면은 광폭의 직선 모양이다. 설계 후 3차원 프린팅으로 노즐 시제품을 제작하였고 이를 브라스팅 머신에 장착 후 세정 성능실험을 수행하였다. 해석 후 얻은 광폭 크기와 실험 후 시편 표면에서 얻은 세정된 광폭 크기가 거의 같았다. 이로부터 대면적 표면처리를 위한 브라스팅 노즐의 설계가 유효함을 확인하였다.

• Design & Manufacturing
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• 제14권1호
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• pp.8-14
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• 2020

In general, auto parts production assembly line is assembled and produced by automatic mounting by an automated robot. In such a production site, quality problems such as misalignment of parts (doors, trunks, roofs, etc.) to be assembled with the vehicle body or collision between assembly robots and components are often caused. In order to solve such a problem, the quality of parts is manually inspected by using mechanical jig devices outside the automated production line. Automotive inspection technology is the most commonly used field of vision, which includes surface inspection such as mounting hole spacing and defect detection, body panel dents and bends. It is used for guiding, providing location information to the robot controller to adjust the robot's path to improve process productivity and manufacturing flexibility. The most difficult weighing and measuring technology is to calibrate the surface analysis and position and characteristics between parts by storing images of the part to be measured that enters the camera's field of view mounted on the side or top of the part. The problem of the machine vision device applied to the automobile production line is that the lighting conditions inside the factory are severely changed due to various weather changes such as morning-evening, rainy days and sunny days through the exterior window of the assembly production plant. In addition, since the material of the vehicle body parts is a steel sheet, the reflection of light is very severe, which causes a problem in that the quality of the captured image is greatly changed even with a small light change. In this study, the distance between the car body and the door part and the door are acquired by the measuring device combining the laser slit light source and the LED pattern light source. The result is transferred to the joint robot for assembling parts at the optimum position between parts, and the assembly is done at the optimal position by changing the angle and step.