• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.11a
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• pp.428-433
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• 2006

This paper presents a new type of jetting dispenser for the integrated circuit(IC) fabrication and surface mount technology. The proposed system is featured by the piezoelectric actuator and hydraulic magnification device. After describing structural component of the dispensing mechanism and its operation principle, both the fluid modeling and the hydraulic magnification modeling are undertaken with a lumped-parameter method based on the analogy of the fluid system and mechanical system. A mathematical governing equation is then derived by integrating the fluid model with the mechanical model of the driving piston and piezoelectric actuator. Subsequently, in order to achieve a desired dispensing amount, control algorithm adjusting duty cycle of the driving voltage is synthesized and control responses are presented in time domain.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.83-89
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• 2014

Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.98.4-98
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• 2001

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens ...

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.16 no.7 s.112
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• pp.739-745
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• 2006

This paper presents a novel type of hybrid dispensing head for IC fabrication and surface mount technology. The proposed mechanism consists of solenoid valve and piezoelectric stack as actuators, and provides positive-displacement and jet dispensing. The positive-displacement dispensing can produce desired adhesive amount without viscosity effect, while the jet dispensing can produce high precision adhesive amount. In order to determine the relationship between required voltage of the piezoelectric actuator and needle displacement, both static and dynamic analysis are undertaken, In addition, finite element analysis is performed in order to find optimal design parameters. Dispensing flow rate and pressure in the chamber are evaluated through fluid dynamic model.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.9
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• pp.151-156
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• 2002

A new position correction method using four fiducials as reference points was developed and examined. It was aimed to calibrate nonlinear deformation by numerous error sources. A correlation for correction was derived from the geometric relationship between four fiducials and chip position. Compared with three points method, it exhibited more accurate correction, especially for inner area of a quadrilateral composed of four fiducial points. Its accuracy was found to be increased as fiducials moves outwardly within a printed circuit board (PCB) and/or as they form more rectangle-like shape As for arbitrarily nonlinear deformation, this method can be applied using more than five fiducials. In this case, local-area calibration is carried out by sectioning a board area into several rectangular are as.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.05a
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• pp.821-826
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• 2006

This paper presents a novel type of hybrid dispensing head for IC fabrication and surface mount technology. The proposed mechanism consists of solenoid valve and piezoelectric stack as actuators, and provides positive-displacement and jet dispensing. The positive-displacement dispensing can produce desired adhesive amount without viscosity effect, while the jet dispensing can produce high precision adhesive amount. In order to determine the relationship between required voltage of the piezo actuator and needle displacement, both static and dynamic analysis are undertaken, In addition, finite element analysis is performed in order to find optimal design parameters. Dispensing flow rate and pressure in the chamber are evaluated through fluid dynamic model.

• Journal of electromagnetic engineering and science
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• v.17 no.1
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• pp.29-33
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• 2017

This paper proposes a half-mode substrate integrated waveguide (HMSIW) amplifier using lumped-element transition. The input and output impedances of this amplifier are matched by the lumped-element transition structure. This structure provides compact impedance and mode matching circuits between the HMSIW and a stand-alone amplifier. Surface mount technology inductors and capacitors are implemented to realize the lumped-element transition. A prototype of the proposed HMSIW amplifier shows 15 dB gain with 3 dB bandwidth of 4 to 7.05 GHz in a simulation and measurement.

• Proceedings of the KIEE Conference
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• 2007.10a
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• pp.333-334
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• 2007

We propose a path planning method to decrease a inspection lead time of line scan camera in SMT(surface mount technology) in-line system. The inspection window area of printed circuit board should be minimized to consider the FOV(field of view) of line scan camera so that line scan inspector is going to find a optimal solution of path planning. We propose one of the hierarchical clustrering algorithm for a given board. Comparative simulation results are presented to verify the usefulness of proposed method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.442-446
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• 1999

Melting behavior and bridge phenomenon of solder paste, which is essential for surface mount technology in packaging, were investigated. solder paste of Sn-37%Pb was printed on Sn-coated Cu-pattern of PCB, and heated over melting point. Melting behavior of the paste was observed using CCD-camera. In order to modelize the melting and agglomeration phenomena of the paste, two solder balls of 0.76mm diameter were used. As experimental results, the paste start to melt from the margin of the printed shape. The hight of the melted paste decreased from 270 $\mu$m to 200 $\mu$m firstly, and finally recovered to 250 $\mu$m. During the melting procedure, pores were evolved from the molten paste. Bridge Phenomenon of the molten Paste depends upon the pitch of the pattern.

• Transactions on Electrical and Electronic Materials
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• v.13 no.3
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• pp.129-135
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• 2012

A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.