• Journal of IKEEE
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• v.25 no.1
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• pp.37-41
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• 2021

In this paper, a low-profile and broadband bowtie antenna using multi-layer substrate for UWB sensor application is presented. A compact bowtie antenna is designed and implemented on two multi-layered substrate with total thickness of 4.5 mm. The antenna consists of bowtie radiator and planar-type balun. The designed radiator and balun are connected to each other so that it can be easily implemented in various structures. The implemented antenna provides 3 to 6 dBi of gain for whole frequency range from 6.8 to 10 GHz.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.4
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• pp.259-265
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• 2016

This paper presents a study on the use of pulsed phase thermography in the measurement of thermal barrier coating thickness with a numerical simulation. A multilayer heat transfer model was ussed to analyze the surface temperature response acquired from one-sided pulsed thermal imaging. The test sample comprised four layers: the metal substrate, bond coat, thermally grown oxide and the top coat. The finite element software, ANSYS, was used to model and predict the temperature distribution in the test sample under an imposed heat flux on the exterior of the TBC. The phase image was computed with the use of the software MATLAB and Thermofit Pro using a Fourier transform. The relationship between the coating thickness and the corresponding phase angle was then established with the coating thickness being expressed as a function of the phase angle. The method is successfully applied to measure the coating thickness that varied from 0.25 mm to 1.5 mm.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2003.11a
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• pp.368-376
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• 2003

In this research, DLC thin films are produced as several hundred nm thickness by PE-CVD method. And then these thin films are estimated tribological characteristics to find out useful possibilities as a protecting film for high-quality function and life extension at MEMs by mechanical properties observation . These are measured thickness and residual stress of DLC coating. Compared after measuring friction coefficient, adhesion force, hardness, cohesive force of coating films. As results all test, we can decide several conclusions. First, friction coefficient decreased, as the load increased. otherwise, friction coefficient increased, as thickness of coating film increased under low load$(1\~50mN)$. Secod, adhesion force increased as thickness of coating films. Third, hardness of coating film is affected by substrate coating film when it is less than thickness of 300nm and it has general hardness of DLC coating film when it is more than thickness of 500nm. Fourth, cohesive force of coating film is complexly affected by hardness, adhesion force, residual stress, etc.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.3
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• pp.209-215
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• 2013

DSSCs electrical characteristics and efficiency fabricated with different tape casting thickness Pt counter electrodes and different thickness between $TiO_2$ photo electrode and Pt counter electrode substrate were studied. 1 layer Pt counter electrode shows 3.979% efficiency. Efficiency increased as tape casting thickness decreased. The lowest open-circuit voltage was a 0.726 V and the highest short-circuit current was a 2.188 mA on 1 layer Pt counter electrode. On the different thickness between two substrates, the lowest open-circuit voltage 0.712 V and the highest short-circuit current 2.787 mA was measured at $60{\mu}m$ surlyn film thickness and it shows the highest value of 5.067% efficiency.

• Journal of the Korean Vacuum Society
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• v.6 no.S1
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• pp.70-74
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• 1997

The study of the thickness dependence of the electron energy structure of Fe, Ni, Ti and Zr sublayers in Ni/Ti and Fe/Zr multilayers by using the experimental and computer simulated optical spectroscopy has been performed. A series of Ni/Ti and Fe/Ze multiayered films (MLF) with a bilayer period of 0.5 - 30 nm and constant (Ni/Ti) / different (Fe/Zr) sublayer thickness ratios were prepared by using computer-controlled double-pair target face-to-face sputtering onto a glass substrate at room temperature (RT) Computer simulation of the resulting optical properties of these MLF was carried out by solving of multireflection problem with a matrix method assuming either "sharp" interfaces resulting in rectangular depth profiles of the components or "mixed" (alloy-like) interfaces of variable thickness between pure-metal sublayers. Optical constants of pure bulk metals as well as equiatomic alloy interfaces were employed in these simulations. It was shown that the difference between experimental and simulated optical properties of the investigated MLF increases with decrease in sublayer thickness. This result allows to conclude that the electronic structures of sublayers below 4-5 nm thickness in mlf differ from the corresponding bulk metals.ponding bulk metals.

• Corrosion Science and Technology
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• v.23 no.3
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• pp.235-245
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• 2024

DLC coatings have been widely applied in industrial fields that require high corrosion resistance due to their excellent mechanical characteristics and chemical stability. In this research, effects of DLC coating thickness and defects on corrosion resistance were investigated for application of metallic bipolar plates in polymer membrane electrolyte fuel cells (PEMFCs). Results revealed that a DLC coating thickness of 0.7 ㎛ could lead to a defect size reduction of about 75.9% compared to that of 0.3 ㎛.As a result of potentiodynamic polarization experiments, the current density under a potential of 0.6 V was measured to be less than 1 ㎂/cm²,which was an excellent value. Inparticular, the delamination ratio and the decrease rate of maximum pitting depth were up to 84.8% and 63.3%, respectively, with an increase in the DLC coating thickness. These results demonstrate that DLC coating thickness and defects are factors that can affect corrosion resistance of DLC coating and its substrate.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.389.2-389.2
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• 2014

Polydimethylsiloxane (PDMS) based electronic devices are widely used for various applications in large area electronics, biomedical wearable interfaces and implantable circuitry where flexibility and/or stretchability are required. A few fabrication methods of electronic devices directly on PDMS substrate have been reported. However, it is well known that micro-cracks appear in the metal layer and in the lithography pattern on a PDMS substrate. To solve the above problems, a few studies for fabrication of stiff platform on PDMS substrate have been reported. Thin-film islands of a stiff region are fabricated on an elastomeric substrate, and electronic devices are fabricated on these stiff islands. When the substrate is stretched, the deformation is mainly accommodated by the substrate, and the stiff islands and electronic devices experience relatively small strains. Here, we report a new method to achieve stiff islands structures on an elastomeric substrate at a various thickness, as the platform for stretchable electronic devices. The stiff islands were defined by conventional photolithography on a stress-free elastomeric substrate. This technique can provide a practical strategy for realizing large-area stretchable electronic circuits, for various applications such as stretchable display or wearable electronic systems.

• 한국생물공학회:학술대회논문집
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• 2002.04a
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• pp.351-354
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• 2002

This research discussed about the substrate transport phenomena in anaerobic biofilm. Three anaerobic fixed biofilm reactors were filled with the sludge of anaerobic digestor from Suyoung wastewater treatment plant. After 15 days of biofilm formation periods, suspended solids within the reactors were removed, and each fixed biofilm reactor was supplied with synthetic wastewater of different concentration of 8.00 mgTOC/L, 9.76 mgTOC/L and 18.97 mgTOC/L, respectively. The experimental results in conjunction with substrate transfer phenomena indicated that data - thickness, substrate removal rate. At the low influent substrate concentration(reactor 1 : 8.00 mgTOC/L, reactor 2 : 9.76 mgTOC/L), the rate of substrate utilization($k_v$), effective diffusivity($D_{eff}$) of substrate in biofilm were similar. While $k_v$ and $D_{eff}$ of the high influent substrate concentration(reactor 3 : 18.97 mgTOC/L) were higher than data in the reactors of the low influent substrate concentration.

• Progress in Superconductivity
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• v.8 no.1
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• pp.93-97
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• 2006

YBCO films were deposited on a moving substrate by a spray pyrolysis method using nitrate aqueous solution as precursors. Deposition was made on $LaAlO_3$(100) single crystal substrate by spraying precursor droplets generated by a concentric nozzle. The cation ratio of precursor solution was Y:Ba:Cu=1:2.65:4.5. The distance between nozzle and substrate was 15 cm. Substrate was transported with a speed ranging from 0.23 cm/min to 0.5 cm/min. Films were deposited at the pressure ranging from 10 Torr to 20 Torr and the deposition temperature was ranged from $740^{\circ}C\;to\;790^{\circ}C$. Oxygen partial pressure was controlled between 1 Tow and S Torr. Superconducting YBCO films were obtained from $740^{\circ}C\;to\;790^{\circ}C$ with an oxygen partial pressure of 3 Torr. Scanning electron microscope(SEM) and X-ray diffraction(XRD) observation revealed that films are smooth and highly texture with(001) plans parallel to substrate plane. Highest Jc was 0.72 $MA/cm^2$ at 77K and self-field for the film with a thickness of 0.15 m prepared at a substrate temperature of $740^{\circ}C$ and $PO_2$=3 Torr.

• Korean Journal of Materials Research
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• v.21 no.3
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• pp.174-179
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• 2011

Ultra-thin aluminum (Al) and tin (Sn) films were grown by dc magnetron sputtering on a glass substrate. The electrical resistance R of films was measured in-situ method during the film growth. Also transmission electron microscopy (TEM) study was carried out to observe the microstructure of the films. In the ultra-thin film study, an exact determination of a coalescence thickness and a continuous film thickness is very important. Therefore, we tried to measure the minimum thickness for continuous film (dmin) by means of a graphical method using a number of different y-values as a function of film thickness. The raw date obtained in this study provides a graph of in-situ resistance of metal film as a function of film thickness. For the Al film, there occurs a maximum value in a graph of in-situ electrical resistance versus film thickness. Using the results in this study, we could define clearly the minimum thickness for continuous film where the position of minimum values in the graph when we put the value of Rd3 to y-axis and the film thickness to x-axis. The measured values for the minimum thickness for continuous film are 21 nm and 16 nm for sputtered Al and Sn films, respectively. The new method for defining the minimum thickness for continuous film in this study can be utilized in a basic data when we design an ultra-thin film for the metallization application in nano-scale devices.