• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.577-584
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• 1996

Silicon oxide films with high hardness and water repellency were prepared by microwave plasma-enhanced CVD using four kind of organosilicon compound-fluoro-alkyl silane mixtures as source gases. An argon gas was used as a carrier gas for fluoro-alkyl silane. The substrate temperatures during deposition were controlled by resistant heating at a constant value between 50 and $300^{\circ}C$. The hardness of the films increased, but the deposition rate and the contact angle for a water drop decreased with increasing substrate temperature. The number of methoxy groups also affected the water repellency and hardness. The deposited films became more inorganic with increasing substrate temperature because of the thermal dissociation of reactants.

• Journal of the Semiconductor & Display Technology
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• v.8 no.2
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• pp.15-21
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• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

• Journal of the Korean Society for Heat Treatment
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• v.23 no.1
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• pp.17-22
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• 2010

The enhancement of adhesion for Cr film on polycarbonate (PC) substrate with electron irradiation treatment was considered. The electron treatment changes the contact angle of the PC substrates. As increase the electron energy from 300 eV to 900 eV, the contact angle decreases from $90^{\circ}$ to $60^{\circ}C$. It is supposed that electron treatment changes the chemical property of PC substrate into hydrophilic one. The micro surface roughness was also affected by electron treatment. The PC substrates irradiated with intense electron beam of 900 eV show the rougher surface than those of other PC substrates. Cr thin films deposited on the PC substrate treated with electron irradiation at 900 eV show the higher adhesion than that of the Cr thin film deposited untreated bare PC substrates.

• Textile Coloration and Finishing
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• v.1 no.1
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• pp.7-18
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• 1989

The distinguishing characteristic of the glow discharge is that chemical reaction induced by partially ionized gases are limited only to the substrate surface. Most studies have been done on the plasma etching and polymerization. The graft polymerization in vapour phase by cold plasma has been rarely investigated. In this study the system of tub3ar reaction chamber with capacitively coupled electrode of alternative current of 60 Hz was employed for the graft polymerization. The graft polymerization of Acylic Acid(AA) onto the poly (ethylene terephthalate) (PET) was carried out by treatment of PET film and fabric by cold plasma (glow discharge of argon gas), followed by the supply of AA vapour. The graft yield was about 1 wt%. The surface property was determined by contact angle, the surface tension was evaluated by zisman’s plot and equation of surface tension mesurement. The results were as follows: 1. In order to obtain lower contact angle, it was effective to avoid the vicinity of electrodes for a setting position of substrate. 2. Contact angle affected on the monomer pressure and its duration of exposure to the acid vapour. 3. Polymer radical formation was influenced by the changes of the value of current density and plasma treatment time. 4. Total surface tension of plasma grafted PET film increased. With an increase in the carboxylic acid content, the dispersion force decreased, while, the polar force and hydrogen bonding force increased. 5. The contact angle decreased from $75^\circ$ to around $30^\circ$ by plasma grafting. There was no ageing effect on the contact angle after 4 months.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.145-152
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• 2013

The growth behavior of nanocrystalline diamond (NCD) film has been studied for three different substrates, i.e. bare Si wafer, 1 ${\mu}m$ thick W and Ti films deposited on Si wafer by DC sputter. The surface roughness values of the substrates measured by AFM were Si < W < Ti. After ultrasonic seeding treatment using nanometer sized diamond powder, surface roughness remained as Si < W < Ti. The contact angles of the substrates were Si ($56^{\circ}$) > W ($31^{\circ}$) > Ti ($0^{\circ}$). During deposition in the microwave plasma CVD system, NCD particles were formed and evolved to film. For the first 0.5h, the values of NCD particle density were measured as Si < W < Ti. Since the energy barrier for heterogeneous nucleation is proportional to the contact angle of the substrate, the initial nucleus or particle densities are believed to be Si < W < Ti. Meanwhile, the NCD growth rate up to 2 h was W > Si > Ti. In the case of W substrate, NCD particles were coalesced and evolved to the film in the short time of 0.5 h, which could be attributed to the fact that the diffusion of carbon species on W substrate was fast. The slower diffusion of carbon on Si substrate is believed to be the reason for slower film growth than on W substrate. The surface of Ti substrate was observed as a vertically aligned needle shape. The NCD particle formed on the top of a Ti needle should be coalesced with the particle on the nearby needle by carbon diffusion. In this case, the diffusion length is longer than that of Si or W substrate which shows a relatively flat surface. This results in a slow growth rate of NCD on Ti substrate. As deposition time is prolonged, NCD particles grow with carbon species attached from the plasma and coalesce with nearby particles, leaving many voids in NCD/Ti interface. The low adhesion of NCD films on Ti substrate is related to the void structure of NCD/Ti interface.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1552-1555
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• 2005

We have studied the inkjet patterning of synthesized aqueous silver nano-sol on interface-controlled ITO glass substrate. Furthermore, we designed the conductive ink for direct inkjet patterning on bare ITO glass substrate. The first, the highly concentrated polymeric dispersant-assisted silver nano sol was prepared by variation of molecular weight and control of initial nucleation and growth of silver nanoparticles. The high concentration of batch-synthesized silver nano sol was possible to 40 wt%. At the same time the particle size of silver nanoparticles was below $10{\sim}20nm$. The second, the synthesized silver nano sol was inkjet - patterned on ITO glass substrate. The connectivity and width of fine line depended largely on the wettability of silver nano sol on ITO glass substrate, which was controlled by surfactant. The relationship was understood by wetting angle. The fine line of silver electrode as fine as $50{\sim}100\;{\mu}m$ was successfully formed on ITO glass substrate. The last, the direct inkjet-patternable silver nano sol on bare ITO glass substrate was designed also.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.753-754
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• 2009

• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.419-421
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• 2008

Sputter deposition on a Pt counter electrode was studied using RF plasma as the improvement of conversion efficiency for dye-sensitized solar cells (DSC). The effects of the sputtering thickness and incident angle on a Pt counter electrode for DSC was scrutinized. We conducted the experiment to get the optimal sputtering time for the performance of the DSC. Under the sputtering time condition of 120 seconds, we varied the incident angles of substrate from $0^{\circ}$ to $60^{\circ}$. Under standard test condition (AM 1.5, 100mW/$cm^2$), we obtained the maximum efficiency of 4.61% at the incident angle of $40^{\circ}$ with an active cell area of $1cm^2$.

• Proceedings of the KIEE Conference
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• 1999.07e
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• pp.2453-2455
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• 1999

We propose that we use a porous-Si for a new spatial walk-off polarizing material with a large split angle. The beam-split an91e f is determined by the filling factor g(or porosity p) of the columnar dielectric substance and the slant angle $\theta$. Theoretically, by the assuming that $n_2$=3.5, and $n_1$=1 one can predict that a large split angle, up to $27^{\circ}$, is possible if one can construct such films with $Si.^{[3]}$ To accomplish this, we use porous-Si. As a result of theoretical simulation, the best structural parameters for attaining the maximum split angle $\phi$=$27.5^{\circ}$ are $\theta$=$58.7^{\circ}$ and p=57.6%.

• Journal of the Korean institute of surface engineering
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• v.16 no.2
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• pp.41-47
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• 1983

An investigation has been performed on the effects of temperature and Ni addition on the wetting behaviour of Cu on W substrate in hydrogen atmosphere. An sessile drop method was used to measure a wetting angle. The concentration profiles of W, Cu and Ni elements in W/Cu - 5 Ni specimen were made by EPMA. With increasing temperature, the wetting angle of Cu droplet on W plate decreases and the time to reach an equilibrium wetting angle is shortened in hydrogen atmosphere. The addition of Ni improves appreciably the wettability of Cu on W. With increasing Ni content in Cu liquid droplet(0, 1, 3, 5%), the wetting angle is decreased from 21$^{\circ}$to 0$^{\circ}$.