• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.314.1-314.1
• /
• 2014

The properties of Ni/Au Ohmic contacts formed on nonpolar a-plane GaN grown on r-plane sapphire substrate with different tilt angles are investigated using current-voltage (I-V) measurements. To investigate the effects of pattern direction and size on Ohmic contact properties of a-plane GaN, transmission line method (TLM) patterns are formed either along c-axis and m-axis on nonpolar GaN surface with different size. I-V measurement results show that the size of TLM pattern and formation direction of electrode have an effect on the electrical properties of a-plane GaN. The large sized patterns show the relatively lower sheet resistance compared to the small sized patterns. In addition, the sheet resistance of a-plane GaN along m-axis shows lower values than that along the c-axis. Finally, the effects of miscut angle of r-sapphire substrate ($0.2^{\circ}$, 0.4oand $0.6^{\circ}$) on electrical properties of a-plane GaN will be discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.04a
• /
• pp.18-22
• /
• 2004

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on polyimide surfaces using thin plastic substrates. It was found that monodomain alignment of NLC is obtained with rubbing alignment method on polyimide surfaces using thin plastic substrates. The NLC pretilt angles generated are about $3^{\circ}$ by the rubbing alignment method on thin plastic substrates, However, the pretilt angle are at about $1.7^{\circ}$ lower on the glass substrate than on thin plastic substrate. Also, EO characteristics of the TN-LCD with a rubbed PI surface based on polymer are almost the same as that of the TN-LCD with a rubbed PI surface based on glass. However, the transmittances of the TN-LCD with a rubbed PI surface based on polymer is less than that with a rubbed PI surface based on glass.

• Journal of the Korean Magnetics Society
• /
• v.5 no.5
• /
• pp.465-469
• /
• 1995

We have investigated the effects of deposition angle on structural and magnetic properties of e-beam evaporated ${(4-{\AA}\;Co/9.2-{\AA}\;Pt)}_{23}$ multilayer thin films prepared on tilted substrates. It was found that the [111] crystallographic orientations of the multilayer thin films were not aligned with colummar growth orientations and they were remained to be normal to the substrate planes even though the deposition angle was severely oblique up to $60^{\circ}$. The analysis of the torque curve reveal that the intrinsic anisotropy energy was monotonically decreased with the deposition angle but the easy axis orientation parallel to the substrate normal was not much influenced by deposition angle.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2015.08a
• /
• pp.181.2-181.2
• /
• 2015

Sputtering is one of the most popular physical deposition methods due to their versatility and reproducibility. Synthesis of Cr thin films by DC magnetron sputtering using glancing angle deposition (GLAD) has been reported. Chromium thin films have been prepared at two different working pressure($2.0{\times}10-2$, 30, $3.3{\times}10-3torr$) on Si-wafer substrate using magnetron sputtering with glancing angle deposition (GLAD) technique. The thickness of Cr thin films on the substrate was adjusted about 1 mm. The electrical property was measured by four-point probe method. For the measurement of density in the films, an X-ray reflectivity (XRR) was carried out. The sheet resistance and column angle increased with the increase of glancing angle. However, nanohardness and density of Cr thin films decreased as the glancing angle increased. The measured density for the Cr thin films decreased from 6.1 to 3.8 g/cc as the glancing angle increased from $0^{\circ}$ to $90^{\circ}$ degree. The low density of Cr thin films is resulted from the isolated columnar structure of samples. The evolution of the isolated columnar structure was enhanced at the conditions of low sputter pressure and high glancing angle. This GLAD technique can be potentially applied to the synthesis of thin films requiring porous and uniform coating such as thin film catalysts or gas sensors.

• Korean Journal of Materials Research
• /
• v.31 no.1
• /
• pp.38-42
• /
• 2021

In this study, high temperature wetting analysis and AZ80/Ti interfacial structure observation are performed for the mixture of AZ80 and Ti, and the effect of Al on wetting in Mg alloy is examined. Both molten AZ80 and pure Mg have excellent wettability because the wet angle between molten droplets and the Ti substrate is about 10° from initial contact. Wetting angle decreases with time, and wetting phenomenon continues between droplets and substrate; the change in wetting angle does not show a significant difference when comparing AZ80-Ti and Mg-Ti. As a result of XRD of the lower surface of the AZ80-Ti sample, in addition to the Ti peak of the substrate, the peak of TiAl3, which is a Ti-Al intermetallic compound, is confirmed, and TiAl3 is generated in the Al enrichment region of the Ti substrate surface. EDS analysis is performed on the droplet tip portion of the sample section in which pure Mg droplets are dropped on the Ti substrate. Concentration of oxygen by the natural oxide film is not confirmed on the Ti surface, but oxygen is distributed at the tip of the droplet on the Mg side. Molten AZ80 and Ti-based compound phases are produced by thickening of Al in the vicinity of Ti after wetting is completed, and Al in the Mg alloy does not affect the wetting. The driving force of wetting progression is a thermite reaction that occurs between Mg and TiO2, and then Al in AZ80 thickens on the Ti substrate interface to form an intermetallic compound.

• Journal of IKEEE
• /
• v.23 no.3
• /
• pp.1077-1081
• /
• 2019

Lights that enter the surface of a solar cell cannot be absorbed inside all of the solar cells, and some of it is reflected off the surface of the substrate, resulting in loss. Because of this, many studies are underway to reduce reflective losses on the surface of substrates or to steam the generated charge inside the solar cell. In this paper, surface treatment for forming a rough surface by wet etching the surface of a glass substrate is advanced, and structural characteristics of the rough surface are analyzed. Then, spectral characteristics by changing the angle of the glass substrate to which light enters the company are analyzed. When the light entering the company is investigated on a etched surface, it is confirmed that the probability of re-absorbing the light inside the glass substrate by multiple reflection is increased. When entering the light while changing the angle of the glass substrate, the transmission and reflection performance of the light are not changed.

• Journal of the Korean Institute of Telematics and Electronics A
• /
• v.30A no.8
• /
• pp.81-87
• /
• 1993

The growth thickness uniformity of epitaxial layers deposited using a moiecular beam epitaxy system is calculated from the arrangement of molecular beam source and the substrate and the geometric dimensions of the crucible in order to predict the optimum design conditions of the prototype MBE system. The thickness uniformity better than 5% over a 3-inch wafer can be obtained by keeping the distance between the substrate and the crucible's orifice longer than 20cm, the tapering angle of the crucible larger than 6$^{\circ}$, and the angle between the normal to the substrate at the center and the crucible axis as larger as possible. In addition, the growth yield decreases to below 51% as the distance between the substrate and the orifice becomes longer than 25cm.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.22 no.5
• /
• pp.282-288
• /
• 2010

Experiment on the surface characteristics of polymer films treated by atmospheric pressure plasma has been conducted. We chose the process parameters as frequency, gas flow, treatment time, and scrutinized the effects of the process parameters on the surface characteristics of polymer materials by measuring the contact angle and examining SEM. As the result, the surface characteristics highly depends on frequency, reaction gas and treatment time. In the case of PC substrate, the contact angle was changed from $83.5^{\circ}$ (before plasma treatment) to $30^{\circ}$ (after plasma treatment) at 30 kHz, CDA 0.6%, and number of repeat 7. In the case of PET substrate, the contact angle change was found from $59^{\circ}$ to $23.5^{\circ}$ at 20 kHz, CDA 0.6%, and number of repeat 7. In the case of EVA substrate, it shows from $84^{\circ}$ to $44.2^{\circ}$ at 30 kHz, CDA 0.6%, and number of repeat 7.

• Transactions on Electrical and Electronic Materials
• /
• v.16 no.3
• /
• pp.112-116
• /
• 2015

This work studied the thickness and contact angle of solder joints between SAC 305 lead-free solder alloy and a Copper (Cu) substrate. Intermetallic compound (IMC) thickness and contact angle of 3Sn-Ag-0.5Cu (SAC 305) leadfree solder were measured using varying aging times, at a fixed temperature at 30℃. The thickness of IMC and contact angle depend on the aging time. IMC thickness increases as the aging increases. The contact angle gradually decreased from 39.49° to 27.59° as aging time increased from zero to 24 hours for big solder sample. Meanwhile, for small solder sample, the contact angle increased from 32.00° to 40.53° from zero to 24 hours. The IMC thickness sharply increased from 0.007 mm to 0.011 mm from zero to 24 hours aging time for big solder. In spite of that, for small solder the IMC thickness gradually increased from 0.009 mm to 0.017 mm. XRD analysis was used to confirm the intermetallic formation inside the sample. Cu₆Sn₅, Cu₃Sn, Ni₃Sn and Ni₃Sn₂ IMC layers were formed between the solder and the copper substrate. As the aging time increased, the strength of the solder joint mproved due to reduced contact angle.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.1515-1518
• /
• 2009

Hydrophobic treatments were conducted for different kinds of substrates, glass substrate, silicon wafer and plastic substrate. Ar-$CH_4$ gas mixture was used as a discharge gas for the hydrophobic treatment. The change of the contact angle before and after treatment was measured and compared. Time evolution of the contact angle change after hydrophobic treatment was investigated.