• Title/Summary/Keyword: Substrate Stiffness

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Bacterial Pattern Formation in Response to the Stiffness of Substrates (접촉 표면의 강성 변화에 따른 박테리아의 군집 패턴)

  • Kim, J.K.;Park, E.J.;Kim, S.R.;Cho, M.Y.;Han, H.
    • 한국가시화정보학회:학술대회논문집
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    • 2007.11a
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    • pp.88-91
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    • 2007
  • Animal cells show different behaviors in response to the mechanical properties of the substrates. We hypothesize that the rigidity of the substrates also affects the bacterial motility and controls the colony dynamics. It is found that the colony size of Escherichia colis and Bacillus subtilis grown on the agar plates is correlated with agarose gel concentrations and thus with the substrate rigidity. High- resolution microscopic imaging reveals that bacteria in single colonies form different aggregation patterns on the agar plates with varying gel concentration. We measured the apparent diffusion coefficients in the agarose gel plates made with different gel concentrations. Mathematical modeling and quantitative imaging of dye dispersion in the agar plates suggest that there is a close connection between the diffusion rate and the colony size. Nanoscale pore structures and kinetic constraints in the porous media may have an effect on bacterial colony dynamics.

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A Study on Mechanical Characteristics of Interface of Ceramic/Metal Composites (세라믹/금속 이종재료 계면의 기계적 특성에 관한 연구)

  • Seo, Do-Won;Kim, Hak-Kun;Song, Jun-Hee;Lim, Jae-Kyoo;Park, Chan-Gyung
    • Proceedings of the KSME Conference
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    • 2000.04a
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    • pp.121-126
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    • 2000
  • Metal/Ceramic structures have many attractive properties, with great potential for applications that demand high stiffness, as well as chemical and biological stability, thermal and electrical insulation. They are currently in use for mechanical and thermal protection in cutting tool and engine parts. With all their great advantage, ceramics suffer from one major problem they are brittle, and are especially susceptible to cracking from surface contacts. Delamination at the interfaces with adjacent layers is a particularly disturbing problem, and can cause premature failure of a composite system. so determination of adhesive properties of coating is one of the most important problems for the extension of the use of coated materials. In this work, mechanical characteristics of Interface of ceramic/Metal composites are evaluated by means of hardness test, indentation test apparent interfacial toughness and bonding strength test. The interface indentation test provides a relation between the applied load(P) and the length of the crack(a) created at the interface between the coating and the substrate.

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Determination of Deformation Behavior of Coating Layer on Electronic galvanized Sheet Steel using Nano-indentation and FEM (나노 인덴테이션 실험과 유한요소해석을 이용한 전기아연도금강판의 코팅층 체적 거동 결정)

  • Ko, Young-Ho;Lee, Jung-Min;Kim, Byung-Min
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.10 s.175
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    • pp.186-194
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    • 2005
  • This study was designed to investigate the mechanical properties of the coating layer on electronic galvanized sheet steel as a part of the ongoing research on the coated steel. Those properties were determined using nano-indentation, the finite element method, and artificial neural networks. First and foremost, the load-displacement curve (the loading-unloading curve) of coatings was derived from a nano-indentation test by CSM (continuous stiffness measurement) and was used to measure the elastic modulus and hardness of the coating layer. The properties derived were applied in FE simulations of a nano-indentation test, and the analytical results were compared with the experimental result. A numerical model for FE simulations was established for the coating layer and the substrate separately. Finally, to determine the mechanical properties of the coating, such as the stress-strain curve, functional equations of loading and unloading curves were introduced and computed using the neural networks method. The results show errors within $5\%$ in comparison with the load-displacement measured by a nano-indentation test.

Characterization of Thin Film Materials by Nanoindentation and Scanning Probe Microscopy (나노인덴테이션과 주사탐침현미경을 이용한 박막 재료의 특성평가)

  • Kim, Bong-seob;Yun, Jon-do;Kim, Jong-kuk
    • Korean Journal of Materials Research
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    • v.13 no.9
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    • pp.606-612
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    • 2003
  • Surface and mechanical properties of thin films with submicron thickness was characterized by nanoindentation with Berkovich and Vickers tips, and scanning probe microscopy. Nanoindention was made in a depth range of 15 to 200 nm from the surface by applying tiny force in a range from 150 to $9,000 \mu$N. Stiffness, contact area, hardness, and elastic modulus were determined from the force-displacement curve obtained. Reliability was first tested by using fused quartz, a standard sample. Elastic modulus and hardness values of fused quartz measured were the same as those reported in the literature within two percent of error. Mechanical properties of ITO thin film were characterized in a depth range of 15∼200nm. As indentation depth increased, elastic modulus and hardness decreased by substrate effect. Ion beam deposited DLC thin films were indented in a depth range of 40∼50 nm. The results showed that the DLC thin film using benzene and bias voltage 0∼-50 V has elastic modulus and hardness value of 132 and 18 GPa respectively. Pure DLC thin films showed roughnesses lower than 0.25 nm, but silicon-added DLC thin films showed much higher roughness values, and the wavy surface morphology.

Development of Repair System for Drain Pipe to Enhance Safety (하수관거 안전성 향상을 위한 보수 시스템 개발)

  • Chung, Jee-Seung;Kang, Weon-Dae
    • Journal of the Korean Society of Safety
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    • v.26 no.6
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    • pp.45-53
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    • 2011
  • This study was performed to develop repair and reinforcing materials in sewage drain pipe by using 40% of CAC(Calcium Aluminate Cement) and 4% of Polymer Powder. Regarding reinforcing materials to enhance load-bearing capacity, polyester textile and wire mesh were adopted and then they were evaluated by the measurement of deflection and Stress-strain Relationship. Two types of drain pipe made by concrete and PE were considered as plain specimens and then loading test were performed after repaired by CAC mortar impregnated reinforcing materials. As the test results of the load-bearing test on both drain pipe, there was higher load-bearing capacity on the specimen adopted wire mesh but debonding of repair mortar was found due to stiffness of wire mesh. By the way, repair system using CAC mortar impregnated polyster textile without wire mesh showed satisfactory results including bonding and load-bearing capacity regardless substrate, so this repair system using by mixture of CAC mortar and polyster textile is suggested as the reasonable repairing method within this experimental scope.

A refined vibrational analysis of the FGM porous type beams resting on the silica aerogel substrate

  • Mohammad Khorasani;Luca Lampani;Abdelouahed Tounsi
    • Steel and Composite Structures
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    • v.47 no.5
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    • pp.633-644
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    • 2023
  • Taking a look at the previously published papers, it is revealed that there is a porosity index limitation (around 0.35) for the mechanical behavior analysis of the functionally graded porous (FGP) structures. Over mentioned magnitude of the porosity index, the elastic modulus falls below zero for some parts of the structure thickness. Therefore, the current paper is presented to analyze the vibrational behavior of the FGP Timoshenko beams (FGPTBs) using a novel refined formulation regardless of the porosity index magnitude. The silica aerogel foundation and various hydrothermal loadings are assumed as the source of external forces. To obtain the FGPTB's properties, the power law is hired, and employing Hamilton's principle in conjunction with Navier's solution method, the governing equations are extracted and solved. In the end, the impact of the various variables as different beam materials, elastic foundation parameters, and porosity index is captured and displayed. It is revealed that changing hygrothermal loading from non-linear toward uniform configuration results in non-dimensional frequency and stiffness pushing up. Also, Al - Al2O3 as the material composition of the beam and the porosity presence with the O pattern, provide more rigidity in comparison with using other materials and other types of porosity dispersion. The presented computational model in this paper hopes to help add more accuracy to the structures' analysis in high-tech industries.

Research Trends in the Nanoscale Friction and Surface Characteristics of Graphene (그래핀의 나노스케일 마찰 및 표면 특성에 대한 연구동향)

  • Yoon, Min-Ah;Kim, Kwang-Seop;Cho, Dae-Hyun
    • Tribology and Lubricants
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    • v.37 no.5
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    • pp.151-163
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    • 2021
  • Since the discovery of single-layer graphene, exploiting graphene's excellent physical/chemical properties in tribology systems has been a topic of interest in academia over the last few decades. There is no doubt that understanding the underlying friction mechanism of graphite should precede this. Even now, new properties of graphene are being reported in academia, and based on this, studies exploring the origins of graphene's surface properties and friction characteristics in a wide range of scales are also being performed. From the perspective of lubrication engineering, graphene research can be largely divided into studies that 1) reveal its basic friction mechanism at the nanoscale and 2) explore its application in macroscale sliding systems. At the nanoscale, the basic friction mechanism of graphene is mainly due to its atomic thickness. In this paper, the various research on the nanoscale friction and surface characteristics of graphene is reviewed. Graphene surface properties, such as wettability and surface energy and the basic friction mechanisms of graphene attributed to adhesion, electronphonon scattering, bending stiffness, and the underlying substrate, are summarized. Further, we provide the research outcomes on the superlubricity of graphene. Finally, the potential application and challenges of the superlubricity of graphene are highlighted. Through this, we intend to provide summarized information to researchers interested in the tribological properties of graphene and help set the direction of future research.

Effects of Encapsulation Layer on Center Crack and Fracture of Thin Silicon Chip using Numerical Analysis (봉지막이 박형 실리콘 칩의 파괴에 미치는 영향에 대한 수치해석 연구)

  • Choa, Sung-Hoon;Jang, Young-Moon;Lee, Haeng-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.1
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    • pp.1-10
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    • 2018
  • Recently, there has been rapid development in the field of flexible electronic devices, such as organic light emitting diodes (OLEDs), organic solar cells and flexible sensors. Encapsulation process is added to protect the flexible electronic devices from exposure to oxygen and moisture in the air. Using numerical simulation, we investigated the effects of the encapsulation layer on mechanical stability of the silicon chip, especially the fracture performance of center crack in multi-layer package for various loading condition. The multi-layer package is categorized in two type - a wide chip model in which the chip has a large width and encapsulation layer covers only the chip, and a narrow chip model in which the chip covers both the substrate and the chip with smaller width than the substrate. In the wide chip model where the external load acts directly on the chip, the encapsulation layer with high stiffness enhanced the crack resistance of the film chip as the thickness of the encapsulation layer increased regardless of loading conditions. In contrast, the encapsulation layer with high stiffness reduced the crack resistance of the film chip in the narrow chip model for the case of external tensile strain loading. This is because the external load is transferred to the chip through the encapsulation layer and the small load acts on the chip for the weak encapsulation layer in the narrow chip model. When the bending moment acts on the narrow model, thin encapsulation layer and thick encapsulation layer show the opposite results since the neutral axis is moving toward the chip with a crack and load acting on chip decreases consequently as the thickness of encapsulation layer increases. The present study is expected to provide practical design guidance to enhance the durability and fracture performance of the silicon chip in the multilayer package with encapsulation layer.