• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.117-123
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• 2015

In order to develop stretchable substrate technology for stretchable devices, locally stiffness-variant stretchable substrates were processed with two polydimethylsiloxane elastomers of different stiffnesses and their deformation behavior was characterized. Low-stiffness substrate matrix and embedded high-stiffness island of the stretchable substrate were formed by using Dragon Skin 10 of the elastic modulus of 0.09 MPa and Sylgard 184 of the elastic modulus of 2.15 MPa, respectively. A stretchable substrate was fabricated to a configuration of 6.5 cm length, 0.4 cm thickness, and 2.5 cm width. The elastic modulus of a stretchable substrate was increased from 0.09 MPa to 0.13~0.33 MPa by embedding a Sylgard 184 island of 1 cm width and 1~6 cm length into the center part of the Dragon Skin 10 substrate matrix. The elastic modulus of a stretchable substrate was improved to 0.16~0.2 MPa by embedding a Sylgard 184 island of 4 cm length and 0.5~1.5 cm width and to 0.1421~0.154 MPa by embedding a Sylgard 184 island of 2 cm length and 0.5~1.5 cm width. With increasing the tensile strain of a stretchable substrate, deformation restriction of the locally stiffness-variant Sylgard 184 island was further enhanced due to substantial increase in the strength difference between Sylgard 184 and Dragon 10 at large strain.

• Structural Engineering and Mechanics
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• v.74 no.2
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• pp.215-225
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• 2020

Thin films easily wrinkle under compressive loading due to their small bending stiffness resulting from their tiny thickness. For a thin film deposited on a functionally graded substrate with non-uniform stiffness exponentially changes along the length span in this paper, the uniaxial wrinkling problem is solved analytically in terms of hyper-Bessel functions. For infinite, semi-infinite and finite length systems the wrinkling load and wrinkling wavenumber are determined and compared with those in literature. In comparison with a homogeneous substrate-bounded film in which the wrinkling pattern is uniform along the length span, for a functionally graded substrate-film system the wrinkles accumulate around the softer location of the functionally graded substrate. Therefore, the effective length of the film influenced by the wrinkles decreases, the amplitude of the wrinkles on softer regions of the functionally graded substrate grows and the wrinkling load of the functionally graded substrates with higher softening rate decreases more. The results of the current research are expected to be useful in science and technology of thin films and wrinkling of the structures especially living tissues.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.91-98
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• 2015

In order to apply to stretchable electronics packaging, locally stiffness-variant stretchable substrates consisting of island structure were fabricated by combining two polydimethylsiloxane elastomers of different stiffnesses and their elastic moduli were characterized as a function of the width of the high-stiffness island. The low-stiffness substrate matrix and the embedded high-stiffness island of the stretchable substrate were formed by using Dragon Skin 10 of the elastic modulus of 0.09 MPa and Sylgard 184 of the elastic modulus of 2.15 MPa, respectively. A stretchable substrate was fabricated to be a configuration of 6.5-cm length, 0.4-cm thickness, and 2.5-cm width, in which a high-stiffness Sylgard 184 island, of 4-cm length, 0.2-cm thickness, and 0.5~1.5-cm width, was embedded. The elastic modulus of a stretchable substrate was increased from 0.09 MPa to 0.16 MPa by incorporating the Sylgard 184 island of 0.5-cm width to Dragon Skin 10 substrate matrix. The elastic modulus was further improved to 0.18 MPa and 0.2 MPa with increasing the Sylgard 184 island width to 1.0 cm and 1.5 cm, which were in good agreement with values estimated by combining the Voigt structure of isostrain and the Reuss structure of isostress.

• Transactions of the Korean Society of Automotive Engineers
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• v.15 no.3
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• pp.41-46
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• 2007

Lightweight multi-layered boards with high stiffness for the automotive interior trims were developed, which were composed of a single material. The boards were constructed in the form of substrate/core/substrate with newly developed materials. The materials which have high tensile strength and elongation were selected for the substrate materials, and those which have high compressive strength and low density were selected for the core materials. 25 types of multi-layered boards were fabricated using the selected substrate and core materials. The compatibility with the skin materials, the formability and the tensile strength and flexural strength of the specimens were evaluated. The results show that three types of multi-layered boards(Kenboard/EPP foam/Kenboard, Twintex/PP honeycomb/Twintex, Curv sheet/EPP foam/Curv sheet) are appropriate for the automotive interior trims. Considering the ease of materials supply and the economical aspect, Kenboard/EPP foam/Kenboard is thought to be the most realistic alternative.

• Composites Research
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• v.22 no.3
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• pp.9-17
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• 2009

Nanoindentation behaviours on the films of softer Ag film/harder Cu substrate structure were studied by the molecular dynamics method. As a result, it was shown that the stiffness and hardness of films were strongly dependent on the thickness of films. The stiffness and hardness increased with the thickness of film within a critical range as an inverse Hall-Petch relation. The stiffness and hardness of Cu substrate with Ag film less than 5 nm were observed to be lower than those of bulk silver. In particular, the flower-like dislocation loop was created on the interface by the interaction between dislocation pile-up and misfit dislocation during the indentation of Ag film/Cu substrate with film thickness less than 4 nm, which seemed to be associated with the drop of load in the indentation load versus displacement curve.

• Structural Engineering and Mechanics
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• v.58 no.3
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• pp.423-442
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• 2016

This study considers a functionally graded (FG) elastic layer resting on homogeneous elastic substrate under axisymmetric static loading. The shear modulus of the FG layer is assumed to vary in an exponential form through the thickness. In solution, the FG layer is approximated into a multilayered medium consisting of thin homogeneous sublayers. Stiffness matrices for a typical homogeneous isotropic elastic layer and a half-space are first obtained by solving the axisymmetric elasticity equations with the aid of Hankel's transform. Global stiffness matrix is, then, assembled by considering the continuity conditions at the interfaces. Numerical results for the displacements and the stresses are obtained and compared with those of the classical elasticity and the finite element solutions. According to the results of the study, the approach employed here is accurate and efficient for elasto-static problems of FGMs.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.61-67
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• 2020

In this paper, we calculated the warpage of bare substrates and chip attached substrates by using FEM (Finite Element Method), and compared and analyzed the effect of the chips' attachment on warpage. Also, the effects of layer thickness of substrates for reducing warpage were analyzed and the conditions of layer thickness were analyzed by signal-to-noise ratio of Taguchi method. According to the analysis results, the direction of warpage pattern in substrates can change when chips are attached. Also, the warpage decreases as the difference in the CTE (coefficient of thermal expansion) between the top and bottom of the package decreases and the stiffness of the package increases after chips are loaded. In addition, according to the impact analysis of design parameters on substrates where chips are not attached, in order to reduce warpage, the inner layers of the circuit layer Cu1 and Cu4 has be controlled first, and then concentrated on the thickness of the solder resist on the bottom side and the thickness of the prepreg layer between Cu1 and Cu2.

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.113-118
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• 2011

According to the high accuracy of semiconductor equipments, PCB substrate with much thin thickness is required. However, it is very difficult to sustain the PCB substrate without deformation in case of horizontal installation, due to low bending stiffness. In this research, new PCB process equipment with vertical installation has been developed in order to solve the problem of PCB substrate damage during etching process. As the main parts of etching system on PCB substrate, PCB substrate and JIG are analyzed through finite element method and experimental test. Through the analysis results of stress state, we could find the optimal JIG design to make the damage as low as possible.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1404-1408
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• 2008

The migration and proliferation of vascular endothelial cells (VEC), which play an important role in vascular remodeling, are known to be regulated by hemodynamic forces in the blood vessels. When shear stresses of 2, 6, 15 dynes/$cm^2$ are applied on mouse micro-VEC in vitro, cells surprisingly migrate against the flow direction at all conditions. While higher flow rate imposes more resistance against the cells, reducing their migration speed, the horizontal component of the velocity parallel to the flow increases with the flow rate, indicating the higher alignment of cells in the direction parallel to the flow at a higher shear stress. In addition, cells exhibit substrate stiffness and calcium dependent migration behavior, which can be explained by polarized remodeling in the mechanosensitive pathway under shear stress.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.47-53
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• 2019

Stiffness-gradient stretchable electronic packages of the soft PDMS/hard PDMS/PTFE structure were processed using the polydimethylsiloxane (PDMS) as the base substrate and the more stiff polytetrafluoroethylene (PTFE) as the island substrate, and their stretchable deformation-resistance characteristics were characterized. The flip-chip joints, formed by bonding the chip bumps of 50 ㎛-diameter onto the PDMS/PTFE substrate pads, exhibited an average contact resistance of 96 mΩ. When the stretchable package of the soft PDMS/hard PDMS/PTFE structure was deformed to 30% elongation, the strain on the PTFE was restrained to 1%, resulting in a negligible resistance increase of 1% in the daisy-chain circuit formed on the PTFE island substrate. The circuit resistance increased for 1.7% after 2,500 cycles of 0~30% stretchable deformation.