• Title/Summary/Keyword: Subpixel Measurement

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Estimation of Real Boundary with Subpixel Accuracy in Digital Imagery (디지털 영상에서 부화소 정밀도의 실제 경계 추정)

  • Kim, Tae-Hyeon;Moon, Young-Shik;Han, Chang-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.8
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    • pp.16-22
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    • 1999
  • In this paper, an efficient algorithm for estimating real edge locations to subpixel values is described. Digital images are acquired by projection into image plane and sampling process. However, most of real edge locations are lost in this process, which causes low measurement accuracy. For accurate measurement, we propose an algorithm which estimates the real boundary between two adjacent pixels in digital imagery, with subpixel accuracy. We first define 1D edge operator based on the moment invariant. To extend it to 2D data, the edge orientation of each pixel is estimated by the LSE(Least Squares Error)line/circle fitting of a set of pixels around edge boundary. Then, using the pixels along the line perpendicular to the estimated edge orientation the real boundary is calculated with subpixel accuracy. Experimental results using real images show that the proposed method is robust in local noise, while maintaining low measurement error.

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A 3D BGA Inspection Algorithm with Subpixel Accuracy (부화소 정밀도를 가지는 3차원 BGA 검사 알고리즘)

  • 김정훈;박성한;심영석
    • Proceedings of the IEEK Conference
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    • 1999.11a
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    • pp.507-510
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    • 1999
  • Inspection of BGAs presents several challenges for modem measurement equipment. No only must these systems be fast and accurate, they must deal with the special challenges presented by very small shiny metal spheres. For accurate measurement, we propose an algorithm which fits for estimating the accurate ball height using 2-D curve-fitting algorithm. The real boundary between two adjacent pixels and the real ball diameter are measured with subpixel accuracy Experimental results show that the proposed method calculates the ball height and diameter with subpixel accuracy and is robust in local noise with low measurement error.

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Abdominal-Deformation Measurement for a Shape-Flexible Mannequin Using the 3D Digital Image Correlation

  • Liu, Huan;Hao, Kuangrong;Ding, Yongsheng
    • Journal of Computing Science and Engineering
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    • v.11 no.3
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    • pp.79-91
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    • 2017
  • In this paper, the abdominal-deformation measurement scheme is conducted on a shape-flexible mannequin using the DIC technique in a stereo-vision system. Firstly, during the integer-pixel displacement search, a novel fractal dimension based on an adaptive-ellipse subset area is developed to track an integer pixel between the reference and deformed images. Secondly, at the subpixel registration, a new mutual-learning adaptive particle swarm optimization (MLADPSO) algorithm is employed to locate the subpixel precisely. Dynamic adjustments of the particle flight velocities that are according to the deformation extent of each interest point are utilized for enhancing the accuracy of the subpixel registration. A test is performed on the abdominal-deformation measurement of the shape-flexible mannequin. The experiment results indicate that under the guarantee of its measurement accuracy without the cause of any loss, the time-consumption of the proposed scheme is significantly more efficient than that of the conventional method, particularly in the case of a large number of interest points.

Vision Inspection Module for Dimensional Measurement in CMM having Vision Probe (비젼프로브를 가지는 3차원 측정기를 위한 형상 측정 시스템 묘듈 개발)

  • 이일환;박희재;김구영
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.379-383
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    • 1995
  • In this paper, vision inspection module for dimensional measurement has been developed. For high accuracy of CMM, camera calibration and edge detection with subpixel accuracy have been implemented. In measurement process, the position of vision probe can be recognized in PC by serial communication with CMM controller. The developed vision inspection module can be widely applied to the practical measurement process.

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A Study on the Improvement of Accuracy and Precision in the Vision-Based Surface-Strain Measurement (비전을 이용한 곡면변형률 측정의 정확도 및 정밀도 향상에 관한 연구)

  • 김두수;김형종
    • Transactions of Materials Processing
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    • v.8 no.3
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    • pp.294-305
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    • 1999
  • A vision-based surface-strain measurement system has been still improved since the authors devel-oped the first version of it. New algorithms for the subpixel measurement and surface smoothing are introduced to improve the accuracy and precision in the present study. The effects of these algorithms are investigated by error analysis. And the equations required to calculate 3D surface-strain of a shell element are derived from the shape function of a linear solid finite-element. The influences of external factors on the measurement error are also examined, and several trials are made to obtain possible optimal condition which may minimize the error.

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In-line Critical Dimension Measurement System Development of LCD Pattern Proposed by Newly Developed Edge Detection Algorithm

  • Park, Sung-Hoon;Lee, Jeong-Ho;Pahk, Heui-Jae
    • Journal of the Optical Society of Korea
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    • v.17 no.5
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    • pp.392-398
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    • 2013
  • As the essential techniques for the CD (Critical Dimension) measurement of the LCD pattern, there are various modules such as an optics design, auto-focus [1-4], and precise edge detection. Since the operation of image enhancement to improve the CD measurement repeatability, a ring type of the reflected lighting optics is devised. It has a simpler structure than the transmission light optics, but it delivers the same output. The edge detection is the most essential function of the CD measurements. The CD measurement is a vital inspection for LCDs [5-6] and semiconductors [7-8] to improve the production yield rate, there are numbers of techniques to measure the CD. So in this study, a new subpixel algorithm is developed through facet modeling, which complements the previous sub-pixel edge detection algorithm. Currently this CD measurement system is being used in LCD manufacturing systems for repeatability of less than 30 nm.

Study on Improvement of Measurement Precision in Digital Image Correlation Measurement Method by Using Subpixel Algorithms (이미지 상관법의 서브 픽셀 알고리즘을 이용한 측정 분해능 향상에 관한 연구)

  • Kim, Seung Jong;Kang, Young Jun;Choi, In Young;Hong, Kyung Min;Ryu, Won Jea
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.12
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    • pp.1039-1047
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    • 2015
  • Contact type sensors (e.g., displacement sensor and strain gauge) were typically used to evaluate the safety and mechanical properties in machines and construction. However, those contact type sensors have been constrained because of measurement problems such as surface roughness, temperature, humidity, and shape. The Digital Image Correlation (DIC) measurement system is a vision measurement system. This measurement system uses the taken image using a CCD camera and calculates the image correlation between the reference image and the deformed image under external force to measure the displacement and strain rates. In this paper, we discuss methods to improve the measurement precision of the digital image correlation measurement system. A tensile test was conducted to compare the precision improvement effects, by using the universal test machine and the DIC measurement system, with the use of subpixel algorithms, i.e., the Coarse Fine Search (CFS) algorithm and the Peak Finding (PF) algorithm.

Development of a Surface-Strain Measurement System Using the Image Processing Technique (화상처리법을 이용한 곡면변형률 측정 시스템의 개발)

  • Han, Sang-Jun;Kim, Yeong-Su;Kim, Hyeong-Jong;O, Su-Ik
    • Transactions of Materials Processing
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    • v.7 no.6
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    • pp.575-585
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    • 1998
  • An automated surface-strain measuring system using the image processing technique is developed in the present study which consists of the hardware to capture and to display digital images. and the software to calculate the 3-D informations of grid points from two views. New or improved algorithms for the mapping and establishing correspondence of grid points and elements the camera calibration and the subpixel measurement of grid points are implemented. As an application of the present system the surface-strains of deformed blanks in the limitting dome height test the square cup deep-drawing and punch stretching to obtain the forming limit diagram are measured. The results are com-pared with those obtained by conventional manual methods.

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Angle Measurement of MEMS Devices Image Processing (Image Processing에 의한 MEMS소자의 미세한 각도측정)

  • Ko, Jin-Hwan;Kim, Ho-Seong
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.2198-2200
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    • 2000
  • This paper reports on the measurement of angle between micro mirror and substrate in. the Micro Optical Cross Connect(MOXC). MOXC consists of beam collimators and $N{\times}N$ micro mirrors that are fabricated by using MEMS technology. Using subpixel level image processing, it is possible to measure the angle with the resolution of 0.27$^{\circ}$.

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