• 한국광학회지
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• 제21권1호
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• pp.6-11
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• 2010

아크릴레이트계 모노머를 사용한 최적화 된 포토폴리머에 안트라센 형광폴리머를 첨가하여 형광 특성을 가지는 포토폴리머를 제조하고, 514 nm 레이저를 이용하여 2-beam coupling 방법으로 형광 포토폴리머 필름 위에 회절격자를 형성하였다. 기록 시작 후 30초 이내에 선명한 fluorescent line pattern 이 형성되었으며, 회절격자 형성 뒤, 패턴이 형성된 부분에서 형광 세기의 증가가 관찰되었다. 기록 시 간섭 빔 앞에 mask pattern 을 이용하여 $50\;{\mu}m$ gap electrode 패턴을 형성하였다. 이 때 형성된 패턴은 micron scale gap패턴 안에 회절격자로부터 생성된 submicron scale의 grating line을 보였다. 이는 beam의 광 고분자 film 표면에 대한 각도($3.6^{\circ}$, $15^{\circ}$), 패턴에 사용된 광 고분자의 굴절률 등으로부터 Bragg's equation 을 사용하여 계산된 이론적인 grating 간격 ($0.6\;{\mu}m$) 과 오차범위 안에서 일치 하였다.

• Progress in Superconductivity
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• 제7권1호
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• pp.6-10
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• 2005

We have studied feasibility of single-layer second-order $high-T_c$ SQUID gradiometers in magnetocardiography. We have measured human cardiomagnetic signals using a short-baseline (5.8 mm) single-layer second-order YBCO gradiometer in partially shielded environments. The gradiometer has an overall size of $17.6\;mm{\times}6\;mm$ and contains three parallel-connected pickup coils which are directly coupled to a step-edge junction SQUID. The gradiometer showed an unshielded gradient noise of $0.84\;pT/cm^2/Hz^{1/2}$ at 1 Hz, which corresponds to an equivalent field noise of $280\;fT/Hz^{1/2}$. The balancing factor was $10^3$. Based on the same design rules as the short-baseline devices, we have studied fabrication of 30 mm-long baseline gradiometers. The devices had an overall size of $70.2\;mm{\times}10.6\;mm$ with each pickup coil of $10\;mm{\times}10\;mm$ in outer size. As Josephson elements we made two types of submicron bridges, which are variable thickness bridge (VTB) and constant thickness bridge (CTB), from $3\;{\mu}m-wide$ and 300 nm-thick YBCO lines with a thin layer of Au on top by using a focused ion beam (FIB) patterning method. VTB was 300 nm wide, 200 nm thick, 30 nm long with Au removed and CTB 100 nm wide and 30 nm long. In temperature-dependent critical currents, $I_c(T)$, VTB showed an nonmetallic barrier-type behavior and CTB an SNS behavior. We believe that those characteristics are ascribed to naturally formed grain boundaries crossing the bridges.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.436-436
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• 2011

Recently, spintronic devices with submicron structures are widely investigated to take advantage of their unique micromagnetic properties. In this work, we study the temperature dependence of exchange bias in bilayer anti-dot arrays made by depositing Co (40 nm)/Ni (5 nm) ferromagnetic bilayer on Si substrate to form anti-dot arrays with a diameter $1{\mu}m$. The anti-dot patterning was done only for the upper Co layer, while the Ni underlayer was kept unperforated. The temperature dependences of magnetoresistance (MR) and exchange bias were studied along magnetic easy and hard axes. The in-plane MR measurements were performed using a physical-property measurement system (PPMS ; Quantum Design Inc.) at various temperatures. The standard in-line four-point probe configuration was used for the electrical contacts. As temperature was varied, the MR data were obtained in which in-plane field (H=3 kOe) was applied in the directions along the hard and the easy axes with respect to the lattice plane. The temperature dependences of magnetic anisotropy and exchange bias were also studied along the magnetic easy and hard axes. As temperature decreases, the single peak splits into two peaks. While no exchange bias was observed along the magnetic easy axis, the exchange bias field steadily increased with decreasing temperature along the magnetic hard axis. These results were interpreted in connection with the magnetic anisotropy and the effect of the anti-dots in pinning domain wall motion along the respective direction.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 추계총회 및 학술대회 논문집
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• pp.171-171
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• 2012

In this study, we fabricated the high-brightness AlGaInP-based red light emitting diodes (LED)s using by direct printing technique and inductive coupled plasma (ICP) reactive ion etching (RIE). In general, surface roughening was fabricated by wet etching process to improve the light extraction efficiency of AlGaInP-based red LED. However, a structure of the surface roughening, which was fabricated by wet etching, was tiled cone-shape after wet etching process due to crystal structure of AlGaInP materials, which was used as top-layer of red LED. This tilted cone-shape of surface roughening can improve the light extraction of LED, but it caused a loss of the light extraction efficiency of LED. So, in this study, we fabricated perfectly cone shaped pattern using direct printing and dry etching process to maximize the light extraction efficiency of LED. Both submicron pattern and micron pattern was formed on the surface of red LED to compare the enhancement effect of light extraction efficiency of LEDs according to the diameter of sapphire patterns.After patterning process using direct printing and ICP-RIE proceeded on the red LED, light output was enhanced up to 10 % than that of red LED with wet etched structure. This enhancement of light extraction of red LED was maintained after packaging process. And as a result of analyze of current-voltage characteristic, there is no electrical degradation of LED.

• Corrosion Science and Technology
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• 제9권6호
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• pp.276-280
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• 2010

Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.