• Proceedings of the Materials Research Society of Korea Conference
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• 1997.05a
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• pp.116-116
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• 1997

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.103-104
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• 2012

• Journal of the Korean Society for Precision Engineering
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• v.31 no.6
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• pp.483-489
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• 2014

In this study, experiments were conducted for micro pattern printing to combine solution atomization process and stencil printing based on electrospray deposition. The stencil mask fabricated by etching the photosensitive glass placed below 0.3 mm distance to substrate has 100 um line width. The process parameters of electrospray deposition system for the atomization of the solution are applied voltage and supply flow rate of the solution. Meniscus angle of cone-jet was optimized by varying the supply flow rate from 0.3 ml/hr to 0.7 ml/hr. Voltage condition was verified having symmetric cone-jet angle and no pulsation at 8.5 kV applied voltage. In addition, a number of micro patterns are printed using a single 1 step process by solution atomization process. Variable line width of approximate 100 um was confirmed by changing conditions of solution atomization regardless of the pattern size of stencil mask.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.47-53
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• 2010

In this study, analyses on the stencil printing using solder paste were carried out. The key design parameters in the stencil printing process are printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of physical properties of solder paste such as viscosity, surface tension, and contact angle on the stencil printing process were investigated. The analyses were performed for simple geometry and boundary conditions. In the analysis, solder paste was pushed into a stencil hole by pressure instead of printer pad. Considering the geometry and computational efficiency, axisymmetric analyses were adopted. A commercial software (COMSOL), which is well known in the area of micro-fluids analysis, was used. From the results, it was shown that viscosity of solder paste had an effect on the filling speed, while surface tension and contact angle had an effect on the filling shape.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.456-462
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• 2002

In the present work, a low cost and fine pitch bumping process by electroless Ni/immersion Au UBM (under bump metallurgy) and stencil printing for the solder bump on the Al pad is discussed. The Chip used this experimental had an array of pad 14x14 and zincate catalyst treatment is applied as the pretreatment of Al bond pad, it was shown that the second zincating process produced a dense continuous zincating layer compared to first zincating. Ni UBM was analyzed using Scanning electron microscopy, Energy dispersive x-ray, Atomic force microscopy, and X-ray diffractometer. The electroless Ni-P had amorphous structures in as-plated condition. and crystallized at 321 C to Ni and Ni$_3$P. Solder bumps are formed on without bridge or missing bump by stencil print solder bump process.

• Journal of the Korea Computer Graphics Society
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• v.9 no.4
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• pp.1-7
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• 2003

본 논문에서는 GPU와 스텐실 버퍼(stencil buffer) 및 깊이 버퍼(depth buffer)를 이용하여 가려진 픽셀들을 렌더링 단계 이전에 건너뛰는(skipping) 방법을 제시하고자 한다. 그래픽 카드에 기본적으로 제공되는 기능인 깊이 및 스텐실 버퍼 검사(depth & stencil buffer test)를 이용하여 이진 차폐 맵(binary occlusion map)을 만들고 이를 재사용하여 가려지는 부분의 픽셀들을 효과적으로 건너뛰게 하는 방법이다. 전체 볼륨 데이터는 팔진트리(octree) 구조를 가진 서브볼륨들로 나뉘어 저장되며 시점에 가까운 서브볼륨부터 렌더링에 사용된다. 서브볼륨들을 차례로 렌더링하면서 차폐 맵을 갱신하게 하면, 멀리 있는 서브볼륨들을 렌더링할 때 이미 가려진 픽셀들을 렌더링에서 제외할 수 있다.

• Proceedings of the Korea Contents Association Conference
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• 2013.05a
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• pp.343-344
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• 2013

The purpose of this study can freely express your imagination is not limited to the description of the facts and reproduce the photos as a media to explore the new possibilities for creative expression and the experience of the day-to-day operations for the implementation of the scheme.

• Korean Architects
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• s.635
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• pp.110-113
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• 2022

• Journal of the Korean Graphic Arts Communication Society
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• v.20 no.2
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• pp.31-43
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• 2002

Screen printing is a stencil process whereby ink is transferred to the substrate through a stencil supported by a fine fabric mesh. Therefore screen had a tendency to distort and swell, as ink was deposited between the fibers, and were difficult to clean. The tow importance of stencil parameters that affect print quality are stencil thread diameter and the fabric thickness because of their influence on both ink deposit and print definition. Since screen printing inks can be formulated to adhere to almost any surface, and the printing process itself can be handled almost any substrate in a wide variety of shape, screen printing is a very versatile process. The small size pronting is reproduced image used screen printing because the surface of substrates is not suited at screen printing method. In screen printing, the need of high definition printing is gradually increasing according to developing special inks. A conventional haftone, so called AM screening, is simple and easy to implement, but the haftone dot patterns by using this method are not free for the moire fringe. This paper is used densitometry and image analysis to investigate relation with printing according to screen mesh, opening size and resolution of copy in image reproduction used FM screen. We had the good result of dot gain and tone reproduction on the screen printing of high definition using FM screen.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.115-118
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• 2001