• Journal of Sensor Science and Technology
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• v.31 no.4
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• pp.249-254
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• 2022

To achieve high-performance colloidal quantum dot light-emitting diodes (QD-LEDs), the use of a densely packed QD film is crucial to prevent the formation of leakage current pathways and increase in interface resistance. Spin coating is the most common method to deposit QDs; however, this method often produces pinholes that can act as short-circuit paths within devices. Since state-of-the-art QD-LEDs typically employ mono- or bi-layer QDs as an emissive layer because of their low conductivities, the use of a densely packed and pinhole-free QD film is essential. Herein, we introduce the Langmuir-Blodgett (LB) technique as a deposition method for the fabricate densely packed QD films in QD-LEDs. The LB technique successfully transfers a highly dense monolayer of QDs onto the substrate, and multilayer deposition is performed by repeating the transfer process. To validate the comparability of the LB technique with the standard QD-LED fabrication process, we fabricate and compare the performance of LB-based QD-LEDs to that of the spin-coating-based device. Owing to the non-destructiveness of the LB technique, the electroluminescence efficiency of the LB-based QD-LEDs is similar to that of the standard spin coating-based device. Thus, the LB technique is promising for use in optoelectronic applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.192-195
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• 2000

Antimony doped tin oxyde thin films have been deposited by sol-gel method using non-alkoxide precursor SnCl$_2$$.$2H$_2$O as host and SbC1$_3$ as dopant material. Using spin coating method, thin films of thickness up to 200nm have been uniformly deposited on Corning 1737F non-alkali glass substrates. Effect of Sb doping concentration and heat treatment on electrical and optical properties was investigated. Heat treatment was performed at the temperature from 350$^{\circ}C$ to 650$^{\circ}C$ in flowing O$_2$. The resulting ATO films showed widely changing electrical resistivity and optical transmittance values in the visible spectrum depending on the composition and firing condition.

• Polymer(Korea)
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• v.35 no.2
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• pp.130-135
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• 2011

Along with the fast development of electronics, the demands of portable electronics and wireless sensors are growing rapidly. The need for self-powering materials capable of powering the electrical devices attached to them is increasing, The piezoelectric effect of polyvinylidene fluoride (PVDF) can be used for this purpose. PVDF has a special crystal structure consisting of a ${\beta}$-phase that can produce piezoelectricity. In this paper, multilayer PVDF films were fabricated to increase the ${\beta}$-phase content. A solution of 10% concentration N;N-dimethylacetamide (DMAc) in PVDF (PVDF/DMAc) was used to fabricate the films via spin coating technique with the following optimum process parameters: a spin rate of 850 rpm, spin time of 60 s, drying temperature of $60^{\circ}C$, and drying time of 30 min, Compared with single-layer PVDF films, the multilayer films exhibited higher ${\beta}$-phase content. The ${\beta}$-phase content of the films increased gradually with increasing number of layers until 4, Maximum ratio of ${\beta}$-phase content was 7.72.

• Journal of the Korean Physical Society
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• v.73 no.9
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• pp.1351-1355
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• 2018

The photocurrent characteristics of zinc-oxide (ZnO) thin-film transistors (TFTs) prepared using radio-frequency sputtering and spin-coating methods were investigated. Various characterization methods were used to compare the physical and the chemical properties of the sputtered and the spin-coated ZnO films. X-ray photoelectron spectroscopy was used to investigate the chemical composition and state of the ZnO films. The transmittance and the optical band gap were measured by using UV-vis spectrometry. The crystal structures of the prepared ZnO films were examined by using an X-ray diffractometer, and the surfaces of the films were investigated by using scanning electron microscopy. ZnO TFTs were prepared using both sputter and solution processes, both of which showed photocurrent characteristics when illuminated by light. The sputtered ZnO TFTs had a photoresponsivity of 3.08 mA/W under illumination with 405-nm light while the solution-processed ZnO TFTs had a photoresponsivity of 5.56 mA/W. This study provides useful information for the development of optoelectronics based on ZnO.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.93.1-93.1
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• 2007

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.179.1-179
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• 2003

• Proceedings of the Korean Ceranic Society Conference
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• 2003.10a
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• pp.73.2-73
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• 2003

• Journal of Sensor Science and Technology
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• v.28 no.4
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• pp.251-255
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• 2019

We propose a two-step lithography process to minimize edge-bead issues caused by thick photoresist (PR) coating. In the conventional PR process, the edge bead can be efficiently removed by applying an edge-bead removal (EBR) process while rotating the silicon wafer at a high speed. However, applying conventional EBR to the production of desired PR mold with unique negative patterns cannot be used because a lower rpm of spin coating and a lower temperature in the soft bake process are required. To overcome this problem, a two-step lithography process was developed in this study and applied to the fabrication of a polydimethylsiloxane (PDMS) film having super-hydrophobic characteristics. Following UV exposure with a first photomask, the exposed part of the silicon wafer was selectively removed by applying a PR developer while rotating at a low rpm. Then, unique PR mold structures were prepared by employing an additional under-exposure process with a second mask, and the mold patterns were transferred to the PDMS. Results showed that the fabricated PDMS film based on the two-step lithography process reduced the height difference from 23% to 5%. In addition, the water contact angle was greatly improved by spraying of hydrophobic nanosilica on the dual-scaled PDMS surface.

• Journal of the Korean Vacuum Society
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• v.1 no.1
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• pp.198-205
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• 1992

Abstract-Planarieation technology, which is essential to VLSI, has been developed using non-etch back Spin- On-Glass (SOG). Process factors for 1.5 micron double metal technology are optimized by the statistical design of experiments. Optimum conditions are found to be a process with twice SOG coating, sufficiently long hot plate baking at 300t, and furnace curing for 40 minutes below 400$^{\circ}$C.

• Journal of Korean Ophthalmic Optics Society
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• v.4 no.1
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• pp.51-56
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• 1999

$TiO_2$ thin films were spin coated on commercial Nickel-Silver with 2%Ti-naphthanate toluene solution by sol-gel process. The thin films were heat-treated at $500^{\circ}C$ for 2min and then decorative-protective coating was obtained. The conditions for gold colored coating, and the morphology, microstructure and color of the coating surface were have been characterized by Optical microscope, Photospectrometer and XRD. The heating temperature of colored-$TiO_2$ coating was $500^{\circ}C$ and was preferable. The average thickness of 1 time coating was $0.24{\mu}m$ and the total thickness increased linearly as a function of the coating time. The color of amorphous colored-$TiO_2$ coating was changed from gold to dark redish gold with coating time. 'L' as lightness and 'b' were decreased to red, but 'a' was decreased to blue after increase with coating time.