• Journal of the Korean Society for Precision Engineering
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• v.22 no.6 s.171
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• pp.144-151
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• 2005

Spin coater is regarded as a major module rotating at high speed to be used build up polymer resin thin film layer fur bonding process of GaAs wafer. This module is consisted of spin unit for spreading uniformly, align device, resin spreading nozzle and et. al. Specially, spin unit which is a component of module can cause to vibrate and finally affect to the uniformity of polymer resin film layer. For the stability prediction of rotation velocity and uniformity of polymer resin film layer, it is very important to understand the dynamic characteristics of assembled spin coater module and the dynamic response mode resulted from rotation behavior of spin chuck. In this paper, stress concentration mode and the deformed shape of spin chuck generated due to angular acceleration process are presented using analytical method for evaluation of structural safety according to the revolution speed variation of spin unit. And also, deformation form of GaAs wafer due to dynamic behavior of spin chuck is presented fur the comparison of former simulated results.

• Journal of the Semiconductor & Display Technology
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• v.8 no.1
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• pp.1-5
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• 2009

Typically, single-wafer wet etching is done by dispensing chemical onto the front and back side of spin wafer. The wafer is fixed by a number of chuck pins, which obstruct the chemical flow and would result in the incomplete removal of the remaining film, which can become a source of contamination in the next process. In this paper, we introduce a novel design of wafer chuck, in which chuck pins are groupped into two and each group of pins fixes the substrate alternatively. Two groups of chuck pins fix the high-speed spin substrate with non contact method using a magnetic material. The actual process has been executed to observe the effectiveness of this new wafer chuck. It was found that the new wafer chuck performed better than the conventional wafer chuck for removing the remaining film from the bevel and edge side of substrate.

• Proceedings of the Korean Information Science Society Conference
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• 1998.10a
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• pp.116-118
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• 1998

본 논문에서 Holzmann이 제시한 커널 스케줄링 방식이 Liveness를 만족하지 못하며, 자원의 충돌이 일어남을 알제브라 ACSR-VP를 이용해서 확인하였고, SPIN과 LTL formula를 이용하여 검증하였다. 이것을 SPIN과 ACSR-VP를 이용하여하여 오류가 없는 새로운 모델을 제시하였다.

• Proceedings of the Korean Information Science Society Conference
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• 2000.04a
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• pp.412-414
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• 2000

고속 네트워크 인터페이스 카드에서 수행되는 펌웨어의 기능이 다양해지고 그 개발이 자유로워짐에 따라 체계적인 펌웨어의 정형검증이 요구된다. 본 논문은 정형검증 도구인 SPIN을 사용하여 미리넷 네트워크 인터페이스 카드에서 수행되는 펌웨어인 MCP를 정형검증하여 데이터 송신에 오류가 없음을 보인다. 이를 통해서 본 논문은 펌웨어에 대한 가능한 정형검증 방법을 보이고 SPIN의 적용 범위를 확대한다.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.121-127
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• 2022

Micro-LED is a light-emitting diode smaller than 100 ㎛ in size. It attracts much attention due to its superior performance, such as resolution, brightness, etc., and is considered for various applications like flexible display and VR/AR. Micro-LED display requires a mass transfer process to move micro-LED chips from a LED wafer to a target substrate. In this study, we proposed a vacuum chuck method as a mass transfer technique. The vacuum chuck was fabricated with MEMS technology and PDMS micro-mold process. The spin-coating approach using a dam structure successfully controlled the PDMS mold's thickness. The vacuum test using solder balls instead of micro-LED confirmed the vacuum chuck method as a mass transfer technique.