• Title/Summary/Keyword: Spherical silica

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EFFECT OF SPHERICAL SILICA FILLER ON THE PHYSICAL PROPERTIES OF EXPERIMENTAL COMPOSITES (구상형 실리카 필러가 실험적 복합레진의 물성에 미치는 효과)

  • Kang, Seung-Hoon;Park, Sang-Jin;Min, Byung-Soon;Choi, Ho-Young;Choi, Gi-Woon
    • Restorative Dentistry and Endodontics
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    • v.24 no.1
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    • pp.88-99
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    • 1999
  • The purpose of this study was to investigate the physical properties of experimental composite resins made with the spherical and crushed fillers. The 14 experimental composite resins containing 0, 5, 10, 15, 20 and 25%(w/w) in spherical filler group and 0, 10, 20, 30, 40, 50, 60 and 70%(w/w) in crushed filler group, incorporated in a Bis-GMA matrix (Aldrich Co., USA), were made with 1% ${\gamma}$-methoxy silane treated fillers. The polymer matrix was made by dissolving 0.7%(w/w) of benzoyl peroxide(Janssen Chemical Co. Japan) in methacrylate monomer, whereupon 0.7%(v/v) N,N-dimethyl-p-toluidine(Tokyo Kasei Co. Japan) was added to the monomer. The weight percentage of each specific particle size distribution could be determined from a knowledge of the specific gravity, the weight(w/w), and corresponding volume %(v/v) of the filler sample in resin monomer. In crushed silica group and spherical silica group, the diametral tensile strengths and compressive strengths were measured with Instron Testing Machine(No.4467), and analyzed in 14 experimental composite resins made by filler fractions. The shear bond strength of 14 experimental composite resins to bovine enamel was measured with universal testing machine(Instron No.4467). The fracture surfaces were sputter-coated with a gold film and investigated by SEM. The results were as follows; 1. The diametral tensile strength was tendency to increase in crushed silica group, but not in spherical silica group. The highest diametral tensile strength was found in 20% filler fractions of two groups. 2. The compressive strength was higher in 15%(w/w) and 20%(w/w) in spherical silica group than in crushed silica group, but not in spherical silica group. 3. The significant correlation was noticed in increase in shear bond strength in crushed silica group, but not in spherical silica group. 4. The significantly highest shear bond strength was noticed in 50% filler concentration in crushed silica group, and in 15% filler concentration in spherical silica group, it was not significant in relation. 5. In crushed silica group, cut surface of resin matrix and the interface between resin and filler is obvious. In spherical silica group, fractures that occurred through the filler particles were round in shape.

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Synthesis of spherical silica aerogel powder by emulsion polymerization technique

  • Hong, Sun Ki;Yoon, Mi Young;Hwang, Hae Jin
    • Journal of Ceramic Processing Research
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    • v.13 no.spc1
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    • pp.145-148
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    • 2012
  • Spherical silica aerogel powders were fabricated via an emulsion polymerization method from a water glass. A water-in-oil emulsion, in which droplets of a silicic acid solution are emulsified with span 80 (surfactant) in n-hexane, was produced by a high power homogenizer. After gelation, the surface of the spherical silica hydrogels was modified using a TMCS (trimethylchlorosilane)/n-hexane solution followed by solvent exchange from water to n-hexane. Hydrophobic silica wet gel droplets were dried at 80 ℃ under ambient pressure. A perfect spherical silica aerogel powder between1 to 12 ㎛ in diameter was obtained and its size can be controlled by mixing speed. The tapping density, pore volume, and BET surface area of the silica aerogel powder were approximately 0.08 g·cm-3, 3.5 ㎤·g-1 and 742 ㎡·g-1, respectively.

Effect of Mixing Ratio of Spherical Silica on the Electrical Insulation Breakdown Strength in Epoxy Composites

  • Park, Jae-Jun
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.2
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    • pp.101-104
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    • 2013
  • The effect of the mixing ratio of spherical silica on the electrical insulation breakdown strength in an epoxy/silica composite was studied. Spherical silicas with two average particle sizes of $5{\mu}m$ and $20{\mu}m$ were mixed in different mixing ratios, and their total filling content was fixed at 60 wt%. In order to observe the dispersion of the silicas and the interfacial morphology between silica and epoxy matrix, scanning electron microscopy (SEM) was used. The electrical insulation breakdown strength was estimated in sphere-sphere electrodes with different insulation thicknesses of 1, 2, and 3 mm. Electrical insulation breakdown strength decreased with increasing mixing ratio of $5/20{\mu}m$ and the thickness dependence of the breakdown strength was also observed.

Effect of Size and Morphology of Silica Abrasives on Oxide Removal Rate for Chemical Mechanical Polishing (기계화학적 연마용 실리카 연마재의 형상과 크기가 산화막 연마율에 미치는 영향)

  • Lee, Jinho;Lim, Hyung Mi;Huh, Su-Hyun;Jeong, Jeong-Hwan;Kim, Dae Sung;Lee, Seung-Ho
    • Applied Chemistry for Engineering
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    • v.22 no.6
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    • pp.631-635
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    • 2011
  • Spherical and non-spherical silica particles prepared by the direct oxidation were studied for the effect of the particle size and shape of these particles on oxide CMP removal rate. Spherical silica particles, which have 10~100 nm in size, were prepared by the direct oxidation process from silicon in the presence of alkali catalyst. The 10 nm silica particles were aggregated by addition of an acid, an alcohol, or a silane as an aggregation inducer between the particles. Two or more aggregated silica particles were used as a seed to grow non spherical silica particles in the direct oxidation process of silicon in the presence of alkali catalyst. The oxide removal rate of spherical silica particles increased with increasing an average particle size for spherical silica abrasives in the oxide CMP. It further increased non-spherical particles, compared with the spherical particles in the similar average particle size.

A Study on CMP Characteristics According to Shape of Colloidal Silica Particles (콜로이달 실리카 입자 형상에 따른 CMP 특성에 관한 연구)

  • Kim, Moonsung;Jeong, Haedo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.9
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    • pp.1037-1041
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    • 2014
  • Slurry used for polishing semiconductors processed by exchange, pressurization, and multi-step feeding has been studied to investigate the effect of the size and shape of slurry particles on the oxide CMP removal rate. First, spherical silica sol was prepared by the ion exchange method. The spherical silica particle was used as a seed to grow non-spherical silica sol in accordance with the multi-step feeding of silicic acid by the ion exchange and pressurization methods. The oxide removal rate of both non-spherical silica sol and commercially available slurry were compared with increasing average particle size in the oxide CMP. The more alkaline the pH level of the non-spherical silica sol, the higher was the removal rate and non-uniformity.

BAM:Mn Phosphor Prepared from Spray Solution with Colloidal Silica (실리카 함유 콜로이달 분무용액으로부터 합성된 BAM:Mn 형광체)

  • Ju, Seo-Hee;Koo, Hye-Young;Hong, Seung-Kwon;Kim, Do-Youp;Kang, Yun-Chan
    • Korean Journal of Materials Research
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    • v.16 no.2
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    • pp.123-128
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    • 2006
  • [ $BaMgAl_{10}O_{19}:Mn^{2+}$ ](BAM:Mn) phosphor particles with spherical shape were prepared by spray pyrolysis from colloidal solution with silica. The phosphor particles prepared by spray pyrolysis from aqueous solution had irregular morphology after high temperature post-treatment. On the other hand, the phosphor particles prepared from spray solution with colloidal silica had spherical shape after post-treatment. Colloidal silica used as additive improved the spherical shape and filled morphology of the precursor particles prepared by spray pyrolysis. The precursor particles with filled structure produced the BAM:Mn phosphor particles with spherical shape and non-aggregation characteristics after post-treatment at $1400^{\circ}C$ under reducing atmosphere. The phosphor particles prepared from colloidal solutions formed the crystal structure of BAM:Mn phosphor irrespective of the silica contents. The BAM:Mn phosphor particles prepared from aqueous and colloidal solutions had similar photoluminescence intensities under vacuum ultraviolet.

Effect of Particle Size on the Mechanical and Electrical Properties of Epoxy/Spherical Silica Composites

  • Park, Jae-Jun
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.1
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    • pp.39-42
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    • 2013
  • The effects of particle size on the mechanical and electrical properties of epoxy/spherical silica composites were studied. The silica particle sizes were varied from 5 to 30 ${\mu}m$ and the filler content was fixed to 60 wt%. Tensile and flexural tests were carried out and the interfacial morphology was observed by scanning electron microscopy (SEM). The electrical insulation breakdown strength was estimated using sphere-sphere electrodes with different insulation thicknesses of 1, 2 and 3 mm. The tensile strength and flexural strength increased with decreasing particle size, while electrical insulation breakdown strength increased with increasing particle size.

High-Transmittance Films Coated from Silica Colloidal Nano-Particles (II) (실리카 콜로이드 나노입자를 이용한 반사 방지막의 제조 (II))

  • Hwang, Yeon
    • Journal of the Korean Ceramic Society
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    • v.42 no.6 s.277
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    • pp.399-404
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    • 2005
  • Anti-reflection film was coated by using spherical silica nano colloidal particles and fumed silica particles. Silica colloid sol was reserved between two inclined slide glasses by capillary force, and particles were stacked to form a film onto the substrate as the upper glass was sliding. The deposition processes were studied to enhance the wavelength dependency of the light transmittance and to control the effective refractive index of the film. Both of the spherical and fumed silica particles showed an enhancement of $4.0-4.4\%$ in light transmittance by one step coating. The dependence of the transmittance on wavelength was largely improved at the longer wavelength by partial coating of fumed particles on the film of spherical particles. The effective refractive index of the film was controlled by removing latex particles that were co-deposited with silica particles. Using this process the light reflectance from one side of the glass substrate could be reduced from $4.2\%$ to $0.6\%$ although zero reflectance was not achieved due to the agglomeration of the latex particles.

Ultrasound-Aided Monolayer Assembly of Spherical Silica Nanobeads

  • Yun, Sang-Hui;Yun, Seo-Yeong;Lee, Jin-Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.267.1-267.1
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    • 2013
  • In modern science and technology, the organization of building blocks, such as spherical particles and zeolite, is important to form a nanostructure. So, it is essential to develop methods for organizing them into large scale for many precise applications. Up to now, reflux and stirring is widely used method for organization of colloidal particles. However, because this method is hard to organize building block with high coverage and uniform orientation, it is necessary to research another method. In this work, we synthesized spherical silica particles using St$\"{o}$ber method and organized them on the glass which is coated with 3-chloropropyltrimethoxysilane (CP-TMS) and polyethyleneimine (PEI) using Sonication method. Although spherical silica particles are difficult to attach on the glass due to their small attachment site, we improved this problem by coating PEI. We introduced two mode of reaction promotion, sonication (SO) and sonication with stacking between the bare glass (SS), and investigated degree of coverage (DOC) and degree of close packing (DCP).

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Effect of Reaction Condition and Solvent on The Size and Morphology of Silica Powder Prepared by An Emulsion Technique

  • Park, Won-Kyu;Kim, Dae-Yong
    • The Korean Journal of Ceramics
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    • v.6 no.3
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    • pp.229-235
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    • 2000
  • The spherical silica powder was synthesized by varying the kinds of solvent and mixing energy in emulsion method. The stirring speed varied from 500 to 1000 r.p.m. at 5$0^{\circ}C$ for 2h. Toluene in benzyl groups and a series of alkanes were used as dispersant. The average size of spherical silica particles decreased with increasing the stirring speed and the chain length o solvents used in this work. The average size was controlled in the range of 134~28$\mu\textrm{m}$ by selecting a proper solvent and stirring speed. The optimum processing parameters were described in details.

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