• Journal of Powder Materials
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• v.7 no.3
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• pp.161-167
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• 2000

Mechanically-alloyed NiAl powder and ball-milled (Ni+Al) powder mixture were sintered by spark-plasma sintering(SPS) process. Mechanical alloying was performed in a horizontal attritor for 20 h with rotation speed of 600 rpm. (Ni+Al) powder mixtures were prepared by ball milling for 1 and 10 h with 120 rpm. Both powders were sintered at $1150^{\circ}C$ for 5 min under $10^{-3}$ torr vacuum with 50 MPa die pressure in a SPS facility. Sintered densities of 97% and 99% were obtained from mechanically-alloyed NiAl powder and (Ni+Al) powder mixture, respectively. The sintered compact of (Ni+Al) powder mixture showed large grain size by a very rapid grain growth, while the grain size of mechanically-alloyed NiAl powder compact after sintering was extremely fine(80 nm). The difference in densification behavior of both powders were discussed.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.4 s.181
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• pp.183-190
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• 2006

Digital 3D Real Object Duplication System (RODS) consists of 3D Scanner and Solid Freeform Fabrication System (SFFS). It is a device to make three-dimensional objects directly from the drawing or the scanning data. In this research, we developed an office type SFFS based on Three Dimensional Printing Process and an industrial SFFS using Dual Laser. An office type SFFS applied sliding mode control with sliding perturbation observer (SMCSPO) algorithm for control of this system. And we measured process variables about droplet diameter measurement and powder bed formation etc. through experiments. In case of industrial type SFFS, in order to develop more elaborate and speedy system for large objects than existing SLS process, this study applies a new Selective Dual-Laser Sintering (SDLS) process and 3-axis Dynamic Focusing Scanner for scanning large area instead of the existing f lens. In this process, the temperature has a great influence on sintering of the polymer. Also the laser parameters are considered like that laser beam power, scan speed, and scan spacing. Now, this study is in progress to evaluate the effect of experimental parameters on the sintering process.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.3
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• pp.516-524
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• 2012

Selective Laser Sintering(SLS) system consists of various element technologies. Main components of the system include a position control system, a speed control system of the roller, and nitrogen atmosphere furtherance for the powdered sintering. Other systems which make the core of the SLS system are build room and the feed room for powder epitaxial, a temperature control system, and a scan path generator for the laser. The powder material for laser sintering is necessary to produce prototypes in Solid Freeform Fabrication(SFF) based on SLS process. This powder material is sintered in powder room using $CO_2$ laser after spreading evenly using roller to reproduce mold via SFF. This study addresses an SFF system by using the SLS process which applies single laser system to enable manufacturing of 3D shape. And to evaluate applicability of the single laser system, experiments were conducted with optimal fabricating process.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.134-134
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• 2016

The effect of different thermal treatments on the sub-50 nm copper nanoparticles is examined in the aspects of chemical, electrical and surface morphology. The copper nanoparticles are chemically synthesized and fabricated for paste-type solution. Simple bar coating method is practiced as a deposition process to form copper thin film on a typical slide glass. Deposited copper thin films are annealed by two different routes: general tube furnace with 99.99 % Ar atmosphere and selective laser sintering process. The thermal behavior of the different thermal-treated copper thin films is compared by SEM, XRD, FT-IR and XPS analysis. In this study, the laser sintering process ensures low annealing temperature, fast working speed and ambient-accessible route. Moreover, the laser-sintered copper thin film shows good electrical property and enhanced chemical stability than conventional thermal annealing process. Consequently, the proposed laser sintering process can be compatible with plastic substrate for flexible applications.

• Korean Journal of Materials Research
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• v.20 no.11
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• pp.559-569
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• 2010

The liquid-phase sintering method was used to prepare a glass lens forming core composed of SiC-$Al_2O_3-Y_2O_3$. Spark plasma sintering was used to obtain dense sintered bodies. The sintering characteristics of different SiC sources and compositions of additives were studied. Results revealed that, owing to its initial larger surface area, $\alpha$-SiC offers sinterability that is superior to that of $\beta$-SiC. A maximum density of $3.32\;g/cm^3$ (theoretical density [TD] of 99.7%) was obtained in $\alpha$-SiC-10 wt% ($6Al_2O_3-4Y_2O_3$) sintered at $1850^{\circ}C$ without high-energy ball milling. The maximum hardness and compression stress of the sintered body reached 2870 Hv and 1110 MPa, respectively. The optimum ultra-precision machining parameters were a grinding speed of 1243 m/min, work spindle rotation rate of 100 rpm, feed rate of 0.5 mm/min, and depth of cut of $0.2\;{\mu}m$. The surface roughnesses of the thus prepared final products were Ra = 4.3 nm and Rt = 55.3 nm for the aspheric lens forming core and Ra = 4.4 nm and Rt = 41.9 for the spherical lens forming core. These values were found to be sufficiently low, and the cores showed good compatibility between SiC and the diamond-like carbon (DLC) coating material. Thus, these glass lens forming cores have great potential for application in the lens industry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.386-389
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• 2001

In this study, development of a new LTCC material using non-glassy system was attempted with repsect to reducing the fabrication process steps and cost down. Lowering the sintering temperature can be achieved by liquid phase sintering. However, presence of liquid phases usually decrease dielectric properties, especially the quality factor. Therefore, the starting material must have quality factor as high as possible in microwave frequency range. And also, the material should have a low dielectric constant for enhancing the signal propagation speed. Regarding these factors, dielectric constants of various materials were estimated by the Clausius-Mosotti equation. Among them, $ZnWO_4$ was turned out the suitable LTCC material. $ZnWO_4$ can be sintered up to 98% of full density at $1050^{\circ}C$ for 3 hours. It's measured dielectric constant, quality factor, and temperature coefficient of resonant frequency were 15.5, 74380GHz, and $-70ppm/^{\circ}C$, respectively. In order to modify the dielectric properties and densification temperature, $B_{2}O_{3}$ and $V_{2}O_{5}$ were added to $ZnWO_4$. 40 mol% $B_{2}O_{3}$ addition reduced the dielectric constant from 15.5 to 12. And the temperature coefficient of resonant frequency was improved from -70 to $-7.6ppm/^{\circ}C$. However, sintering temperature did not change due to either lack of liquid phase or high viscosity of liquid phase. Incorporation of small amount of $V_{2}O_{5}$ in $ZnWO_{4}-B_{2}O_{3}$ system enhanced liquid phase sintering. 0.1 wt% $V_{2}O_{5}$ addition to the $0.6ZnWO_{4}-0.4B_{2}O_{3}$ system, reduced the sintering temperature down to $950^{\circ}C$. Dielectric constant, quality factor, and temperature coefficient of resonant frequency were 9.5, 16737GHz, and $-21.6ppm/^{\circ}C$, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.386-389
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• 2001

In this study, development of a new LTCC material using non-glassy system was attempted with respect to reducing the fabrication process steps and cost down. Lowering the sintering temperature can be achieved by liquid phase sintering. However, presence of liquid phases usually decrease dielectric properties, especially the quality factor. Therefore, the starting material must have quality factor as high as possible in microwave frequency range. And also, the material should have a low dielectric constant for enhancing the signal propagation speed. Regarding these factors, dielectric constants of various materials were estimated by the Clausius-Mosotti equation. Among them, ZnWO$_4$ was turned out the suitable LTCC material. ZnWO$_4$ can be sintered up to 98% of full density at 105$0^{\circ}C$ for 3 hours. It's measured dielectric constant, quality factor, and temperature coefficient of resonant frequency were 15.5, 74380GHz, and -70ppm/$^{\circ}C$, respectively In order to modify the dielectric properties and densification temperature, B$_2$O$_3$ and V$_2$O$_{5}$ were added to ZnWO$_4$. 40 mol% B$_2$O$_3$ addition reduced the dielectric constant from 15.5 to 12. And the temperature coefficient of resonant frequency was improved from -70 to -7.6ppm/$^{\circ}C$. However, sintering temperature did not change due to either lack of liquid phase or high viscosity of liquid phase. Incorporation of small amount of V$_2$O$_{5}$ in ZnWO$_4$-B$_2$O$_3$ system enhanced liquid phase sintering. 0.lwt% V$_2$O$_{5}$ addition to the 0.6ZnWO$_4$-0.4B$_2$O$_3$ system, reduced the sintering temperature down to 95$0^{\circ}C$ Dielectric constant, quality factor, and temperature coefficient of resonant frequency were 9.5, 16737GHz, and -21.6ppm/$^{\circ}C$ respectively.ively.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1997.04a
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• pp.13-13
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• 1997

• Journal of Powder Materials
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• v.17 no.4
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• pp.312-318
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• 2010

High speed steels (HSS) were used as cutting tools and wear parts, because of high strength, wear resistance, and hardness together with an appreciable toughness and fatigue resistance. Conventional manufacturing process for production of components with HSS was used by casting. The powder metallurgy techniques were currently developed due to second phase segregation of conventional process. The powder injection molding method (PIM) was received attention owing to shape without additional processes. The experimental specimens were manufactured with T42 HSS powders (59 vol%) and polymer (41 vol%). The metal powders were prealloyed water-atomised T42 HSS. The green parts were solvent debinded in normal n-Hexane at $60^{\circ}C$ for 24 hours and thermal debinded at $N_2-H_2$ mixed gas atmosphere for 14 hours. Specimens were sintered in $N_2$, $H_2$ gas atmosphere and vacuum condition between 1200 and $1320^{\circ}C$. In result, polymer degradation temperatures about optimum conditions were found at $250^{\circ}C$ and $480^{\circ}C$. After sintering at $N_2$ gas atmosphere, maximum hardness of 310Hv was observed at $1280^{\circ}C$. Fine and well dispersed carbide were observed at this condition. But relative density was under 90%. When sintering at $H_2$ gas atmosphere, relative density was observed to 94.5% at $1200^{\circ}C$. However, the low hardness was obtained due to decarbonization by hydrogen. In case of sintering at the vacuum of $10^{-5}$ torr at temperature of $1240^{\circ}C$, full density and 550Hv hardness were obtained without precipitation of MC and $M_6C$ in grain boundary.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1205-1206
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• 2006

Dispersion-strengthened copper with $TiB_2$ was produced by ball-milling and spark plasma sintering (SPS).Ball-milling was performed at a rotation speed of 300rpm for 30 and 60min in Ar atmosphere by using a planetary ball mill (AGO-2). Spark-plasma sintering was carried out at $650^{\circ}C$ for 5min under vacuum after mechanical alloying. The hardness of the specimens sintered using powder ball milled for 60min at 300rpm increased from 16.0 to 61.8 HRB than that of specimen using powder mixed with a turbular mixer, while the electrical conductivity varied from 93.40% to 83.34%IACS. In the case of milled powder, hardness increased as milling time increased, while the electrical conductivity decreased. On the other hand, hardness decreased with increasing sintering temperature, but the electrical conductiviey increased slightly