• Journal of Korean Society for Geospatial Information Science
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• v.21 no.3
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• pp.55-62
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• 2013

This paper aims to detect Speed Bump by using Omni-directional Camera and to suggest Real-time update scheme of Speed Bump through Vision Based Approach. In order to detect Speed Bump from sequence of camera images, noise should be removed as well as spot estimated as shape and pattern for speed bump should be detected first. Now that speed bump has a regular form of white and yellow area, we extracted speed bump on the road by applying erosion and dilation morphological operations and by using the HSV color model. By collecting huge panoramic images from the camera, we are able to detect the target object and to calculate the distance through GPS log data. Last but not least, we evaluated accuracy of obtained result and detection algorithm by implementing SLAMS (Simultaneous Localization and Mapping system).

• Proceedings of KOSOMES biannual meeting
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• 2005.11a
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• pp.197-202
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• 2005

Generally, a semiconductor chip measured with a few micro units is captured by line scan camera for higher inspection accuracy. However, the faulty inspection requires an exact boundary detection algorithm because it is very sensitive to scan speed and lighting conditions. In this paper we propose boundary detection using subpixel edge detection method in order to increase the accuracy of bump faulty detection on chips. The bump edge is detected by first derivative to four directions from bump center point and the exact edge positions are searched by the subpixel method. Also, the exact bump boundary to calculate the actual bump size is computed by LSM(Least Squares Method) to minimize errors since the bump size is varied such as bump protrusion, bump bridge, and bump discoloration. Experimental results exhibit that the proposed algorithm shows large improvement comparable to the other conventional boundary detection algorithms.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.4
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• pp.793-799
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• 2007

Generally, a semiconductor chip measured with a few micro units is captured by line scan camera for higher inspection accuracy. However, the faulty inspection requires an exact boundary detection algorithm, because it is very sensitive to scan speed and lighting conditions. In this paper we propose boundary detection with subpixel edge detection in order to increase the accuracy of bump faulty detection on chips. The bump edge is detected by first derivative to four directions from bump center point and the exact edge positions are searched by the subpixel method. Also, the exact bump boundary to calculate the actual bump size is computed by LSM(Least Squares Method) to minimize errors since the bump size is varied such as bump protrusion, bump bridge, and bump discoloration. Experimental results exhibit that the proposed algorithm shows large improvement comparable to the other conventional boundary detection algorithms.

• Journal of Institute of Control, Robotics and Systems
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• v.18 no.1
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• pp.62-68
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• 2012

In this paper, a detection method of a pedestrian safety road marking was proposed. The proposed algorithm uses laser range and reflectivity of a range finder (LRF). For a detection of crosswalk marking and stop line, the DFT (Discrete Fourier Transform) of reflectivity and cross-correlation method between the reference replica and the measured reflectivity are used. A speed bump is detected through measuring an altitude difference of two LRFs which have the different tilted angle. Furthermore, we proposed a velocity constrained a detection method of a speed bump. Finally, the proposed methods are tested in on-line, on the pavement of a road. The considered road markings are wholly detected. The localization errors of both road markings are smaller than 0.4 meter.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.7
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• pp.702-708
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• 2013

The white-light scanning interferometer (WSI) is an effective optical measurement system for high-precision industries (e.g., flat-panel display and electronics packaging manufacturers) and semiconductor manufacturing industries. Its major disadvantages include a slow image-capturing speed for interferogram acquisition and a high computational cost for peak-detection on the acquired interferogram. Here, a WSI system is proposed for the semiconductor inspection process. The new imaging acquisition technique uses an 'on-the-fly' imaging system. During the vertical scanning motion of the WSI, interference fringe images are sequentially acquired at a series of pre-defined lens positions, without conventional stepwise motions. To reduce the calculation time, a parallel computing method is used to link multiple personal computers (PCs). Experiments were performed to evaluate the proposed high-speed WSI system.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.11
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• pp.1879-1886
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• 2016

In this paper, we propose a real-time recognition algorithm of lanes, stop lines and speed bumps on roads for autonomous vehicles. First, we generate a top-view using the image transmitted from a camera that is installed to see the front of a vehicle. To speed up the processing, we simplify the mapping algorithm in constructing a top-view wherein the region of interest (ROI) is concerned. The features of lanes, stop lines and speed bumps, which are composed of lines, are searched in the edge image of the top-view, then followed by labeling and clustering specialized to detect straight lines. The width of lines, distances from the center of a vehicle, and curvature of each cluster are considered to select final candidates. We verify the proposed algorithm on real roads using the commercial car (KIA K7) which is converted into an autonomous vehicle.

• Journal of Korea Society of Industrial Information Systems
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• v.17 no.3
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• pp.35-42
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• 2012

The database for driving patterns can be utilized in various system such as automatic driving system, driver safety system, and it can be helpful to monitor driving style. Therefore, we propose a driving pattern recognition system in which the sensor streams from a smartphone are recorded and used for recognizing driving events. In this paper we focus on the driving pattern recognition that is an essential and preliminary step of driving style recognition. We divide input sensor streams into 7 driving patterns such as, Left-turn(L), U-turn(U), Right-turn(R), Rapid-Braking(RB), Quick-Start(QS), Rapid-Acceleration (RA), Speed-Bump(SB). To classify driving patterns, first, a preprocessing step for data smoothing is followed by an event detection step. Last the detected events are classified by DTW(Dynamic Time Warping) algorithm. For assisting drivers we provide the classified pattern with the corresponding video stream which is recorded with its sensor stream. The proposed system will play an essential role in the safety driving system or driving monitoring system.

• Current Optics and Photonics
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• v.7 no.1
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• pp.38-46
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• 2023

Optical Fourier-domain reflectometry (OFDR) sensors have been widely used to measure distances with high resolution and speed in a noncontact state. In the electroplating process of a printed circuit board, it is critically important to monitor the copper-plating thickness, as small deviations can lead to defects, such as an open or short circuit. In this paper we employ a phase-based OFDR sensor for in situ relative distance sensing of a sample with nanometer-scale resolution, during electroplating. We also develop an optical-path difference (OPD)-regulated sensing probe that can maintain a preset distance from the sample. This function can markedly facilitate practical measurements in two aspects: Optimal distance setting for high signal-to-noise ratio OFDR sensing, and protection of a fragile probe tip via vertical evasion movement. In a sample with a centimeter-scale structure, a conventional OFDR sensor will probably either bump into the sample or practically out of the detection range of the sensing probe. To address this limitation, a novel OPD-regulated OFDR system is designed by combining the OFDR sensing probe and linear piezo motors with feedback-loop control. By using multiple OFDR sensors, it is possible to effectively monitor copper-plating thickness in situ and uniformize it at various positions.