• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.507-512
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• 1999

In modern engineering practice, the grinding process is one of the most important and widely used operations for the precision finishing of components. In this paper, machining characteristics of external plunge grinding were investigated by using spindle motor current signal through hall sensor. Grinding experiments were performed in terms of various grinding conditions such as wheel speed, workpiece speed, infeed rate and spark-out time with conventional vitrified bonded WA wheel. The relationship between spindle motor current signal and metal removal rate in terms of infeed rate was induced the by analyzing spindle motor current signal.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.10
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• pp.2514-2522
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• 1994

The mirror surface grinding of carbon fiber reinforced plastics(CFRP) was realized by using the metal bonded super-abrasive micro grain wheel with electrolytic in-process dressing(ELID). The maximum surface roughness $R_{max}$ of CFRP which was obtained with #6,000 wheel, was 0.65 $\mu{m}$, which was rougher surface finish compared to those of hard and brittle materials with the same mesh number wheel with ELID. The grinding performance was much dependent on the grinding direction and the best surface roughness was obtained at $90^{\circ}C$ grinding with fiber direction. The spark-out effect on the surface improvement was significant when smaller mesh number grinding wheels were used. From the surface observations of CFRP with scanning electron microscope(SEM) and Auger electron spectroscopy(AES), it was found that the mirror surface grinding of CFRP was generated by the homogenization due to carbonization of the ground surface and smearing of chips composed of the carbon fiber and carbonized epoxy resin into the ground surface.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.104-107
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• 2005

Recently, according to the development of semiconductor industry, needed to high-integration and high-functionality. These changes are required for silicon wafer of large scale diameter and precision of TTV (Total Thickness variation). So, in this research, suggest that the method of monitoring system is using motor current. This method is needed for observation of silicon wafer grinding process. Motor current sensor is consisted of hall sensor. Hall sensor is known to catching of change of current. Received original signal is converted to the diginal, then, it is calculated RMS values, and then, it is analysed in computer. Generally, the change of force is relative to the change of current, So this reason, in this research tried to monitoring of motor current change, and then, it will be applied to analysis for silicon wafer grinding process. using motor current sensor.