• Journal of Welding and Joining
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• 제21권2호
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• pp.82-88
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• 2003

The bonding phenomenon and mechanism in the transient liquid phase bonding(TLP Bonding) of directionally solidified Ni base superalloy, GTD-111 was investigated. At the bonding temperature of 1403K, liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B and Si into the base metal and solids in the bonded interlayer grew epitaxially from mating base metal inward the insert metal. The number of grain boundaries formed at the bonded interlayer was corresponded with those of base metal. The liquation of grain boundary and dendrite boundary occurred at 1433K. At the bonding temperature of 1453K which is higher than liquation temperature of grain boundary, liquids of the Insert metal were connected with liquated grain boundaries and compositions in each region mixed mutually. In Joints held for various time at 1453t phases formed at liquated grain boundary far from the interface were similar to those of bonded interlayer. With prolonged holding time, liquid phases decreased gradually and liquids of continuous band shape divided many island shape. But liquid phases did not disappeared after holding for 7.2ks at 1453k. Isothermal solidification process at the bonding temperature which is higher than the liquation temperature of the grain boundary was controlled by diffusion of Ti to be result in liquation than B or Si. in insert metal. (Received January 15, 2003)

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.798-802
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• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.

• Korean Chemical Engineering Research
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• 제50권1호
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• pp.61-65
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• 2012

이성분 용융액의 시간의존형 응고계에서 mush 층의 대류발생을 선형 안정성 이론으로 해석하였다. 본 연구에서는 근공융물 mush 층을 다공성 블록으로 가정한 단순화된 모델에 전파이론을 적용하여 대류발생 임계조건을 구하였다. 본 연구 모델에서는 기존의 실험결과 및 mush층 위의 액체층을 포함하여 고려한 이론적 연구의 결과보다 더 높은 임계 Rayleigh 수가 얻어졌다. mush 층의 윗 경계면에 일정압력(투과)조건을 적용하는 경우가 비투과조건에 비해 임계 Rayleigh 수를 더 작게 하며 염화암모늄 수용액의 응고실험결과와 더 근접한 것으로 조사되었다.

• Journal of Welding and Joining
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• 제9권4호
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• pp.28-39
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• 1991

The change of microstructure in the bonded interlayer and mechanical properties of the joints were investigated during Transient Liquid Phase Diffusion Bonding(TLP bonding) of STS304/SM17C and STS304/SM45C couples using Ni base amorphous alloys added boron and prepared alloy as insert metal. Main experimental results obtained in this study are as follows: 1) Isothermal solidification process was completed much faster than theoretically expected time, 14ks at 1473K temperature. Its completion times were 3.6ks at 1423K, 2.5ks at 1473K and 1.6ks at 1523K respectively. 2) As the concentration of boron in the insert metal increased, the more borides were precipitated near bonded interlayer and grain boundary of STS304 side during isothermal solidification process, its products were $M_{23}P(C,B)_6}_3)$ The formation of grain boundary during isothermal solidification process was completed at structural carbon steel after starting the solidfication at STS304 stainless steel. 4) The highest value of hardness was obtained at bonded interface of STS304 side. The desirable tensile properties were obtained from STS304/SM17C, STS304/SM45C using MBF50 and experimentally prepared insert metal with low boron concentration.

• 한국주조공학회지
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• 제14권6호
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• pp.558-565
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• 1994

The horizontal continuous casting process with the heated mold was applied to obtain the unidirectionally solidified rods($4{\sim}8mm$ dia.) of pure copper with good surface quality. The results could be summarized as follows. 1. The unidirectional solidification of pure copper rods with good surface(mirror surface) quality could be obtained by placing the S/L interface inside the heated mold cavity even though the cast copper rods were covered with thin copper oxide layer. 2. The casting speed for 4mm dia. rods with mirror surfaces was affected significantly by the mold-cooler distance rather than the cooling flow rate when other casting conditions were fixed. 3. The casting speed was the main factor affecting the oxidation of copper during the continuous casting and the thickness of copper oxide layer decreased almost linearly as the casting speed increased.

• 대한기계학회논문집
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• 제19권1호
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• pp.193-201
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• 1995

The role of thermal contact resistance between a casting and a metal mold as well as natural convection in the melt during solidification of a pure metal is numerically studied. Numerical simulation is performed for a rectangular cavity using the coordinate transformation by boundary-fitted coordinate and pure aluminum is used as the phase- change material. The influences of thermal contact resistance on the interface shape and position, solidified volume fraction, temperature field and local heat transfer are investigated.

• 대한기계학회논문집
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• 제13권6호
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• pp.1082-1091
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• 1989

본 논문에서는 응고계면을 기준으로 하여 액상역, 고상역 및 로울등을 각각 계산 가능한 영역으로 좌표변환하는 경계공정법을 사용하여 로울두께 방향의 온도분 포와 고상역과 액상역의 속도 분포를 고려한 2차원 응고해석을 하여 모델재료를 이용 한 실험결과와 비교 검토하여 이론해석의 타당성을 검정한다. 그리고 열전도율이 연 강보다 적어 박판제조가 어려운 재료인 스테인리스강을 용탕으로부터 직접 생산하기 위한 압연조건을 정량적으로 제시하며, 압연로울의 냉각특성을 밝힌다.

• 한국전산유체공학회지
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• 제5권1호
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• pp.27-32
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• 2000

This study investigates the problem of phase change from liquid to solid in the inviscid stagnation flow. The instantaneous location of the solid-liquid interface is fixed for all times by a coordinate transformation. Finite difference method is used to obtain the solution of the unsteady problem, and the growth rate of solid and the transient heat transfer from the surfaces of solid are investigated. The transient solution is dependent on the three dimensionless parameters, but the final steady state is determined by only one parameter of temperature ratio/conductivity ratio. It is observed that the instantaneous heat flux at the surface of solid can be obtained with sufficient accuracy by measuring the thickness of the solid or vice versa.

• 대한기계학회논문집B
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• 제24권6호
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• pp.792-801
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• 2000

The problem of phase change from liquid to solid in the inviscid plane-stagnation flow is theoretically investigated. The solution at the initial stage of freezing is obtained by expanding it in powers of time, and the final equilibrium state is determined from the steady-state governing equations. The transient solution is dependent on the three dimensionless parameters, but the equilibrium state is determined by one parameter of (temperature ratio/conductivity ratio). The effect of the fluid flow on the growth rate of the solid in the pure conduction problem can be clearly seen from the solution of the initial stage and the final equilibrium state. The characteristics of the transient heat transfer at the surface of the solid and the liquid side of the solid-liquid interface for all the dimensionless parameters are elucidated.

• 한국주조공학회지
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• 제7권2호
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• pp.122-132
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• 1987

Full mold casting process is a new technique offering numerous advantages and promising possibilities. The present study is aimed to bring out the results of experiments carried out to study the effect of pattern coatings on the solidification of 99.5% pure aluminum plate-shaped castings in the various sand molds and the thermal behavior of the molds. The results of the investigation indicate that (i) with increase in pattern coating thickness, the relative chilling power decreases gradually for silica and increases for zircon coating, and (ii) the application of a pattern coating significantly reduces the maximum interface temperature by the mold which is more pronounced in the case of thinner mold wall. The investigation also indicates that Chvorinov's rule is not found to be valid for the casting in the full mold, with or without pattern coating. Therefore in full mold process, the pattern coating thickness will be a very important parameter in the study of thermal behavior.