• Journal of Welding and Joining
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• v.34 no.2
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• pp.46-53
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• 2016

Effect of heating rate on microstructure of brazed joints with STS 304 Printed Circuit Heat Exchanger (PCHE),which was manufactured as large-scale($1170(L){\times}520(W)){\times}100(T)$, mm), have been studied to compare bonding phenomenon. The specimens using MBF 20 was bonded at $1080^{\circ}C$ for 1hr with $0.38^{\circ}C/min$ and $20^{\circ}C/min$ heating rate, respectively. In case of a heating rate of $20^{\circ}C/min$, overflow of filler metal was observed at the edge of a brazed joints showing the height of filler metal was decreased from $100{\mu}m$ to $68{\mu}m$. At the center of the joints, CrB and high Ni contents of ${\gamma}$-Ni was existed. For the joints brazed at a heating rate of $0.38^{\circ}C/min$, the height of filler was decreased from $100{\mu}m$ to $86{\mu}m$ showing the overflow of filler was not appeared. At the center of the joints, only ${\gamma}$-Ni was detected gradating the Ni contents from center. This phenomenon was driven from a diffusion amount of Boron in filler metal. With a fast heating rate $20^{\circ}C/min$, diffusion amount of B was so small that liquid state of filler metal and base metal were reacted. But, for a slow heating rate $0.38^{\circ}C/min$, solid state of filler metal due to low diffusion amount of B reacted with base metal as a solid diffusion bonding.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.139-142
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• 2004

Nickel base superalloys are widely used for high temperature applications due to heat resisting capability and corrosion resistance at high temperatures. Superalloys with many strengthening alloying elements are frequently used in powder form to alleviate harmful effects of alloy segregation. HIP (hot isostatic pressing) and DB (diffusion bonding) as a form of solid-state bonding process is used to make turbine components, such as integrated turbine rotors. HIP/DB process requires many technical overcomes related to dimensional changes as well as microstructural control. In this research, HIP/DB process for nickel base superalloys, Udimet 720 and MM 247, were investigated with a view to control the dimensional change during the consolidation process. Simple disc-shaped cans were used to select the conceptual die design for the control of the dimensional change especially in radial direction. The change in the shape of consolidated shape was investigated using commercial FE code with constitutive equations fur low temperature plasticity deformation.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.171-174
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• 2004

Superalloys with many strengthening alloying elements are frequently used in powder form to alleviate harmful effects of alloy segregation. HIP (hot isostatic pressing) and DB (diffusion bonding) as a form of solid-state bonding process is often used to make turbine components, such as integrated turbine rotors. HIP/DB process requires many technical overcomes related to dimensional changes as well as microstructural control. In this research, HIP/DB process for nickel base superalloys, Udimet 720, were investigated with a view to control the dimensional change during the consolidation process. Simple disc-shaped cans were used to select the conceptual die design for the control of the dimensional change especially in radial direction. The change in the shape of consolidated shape was investigated using commercial FE code with constitutive equations for low temperature plasticity and creep deformation.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.9-15
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• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.