• Proceedings of the Korean Institute of Building Construction Conference
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• 2015.05a
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• pp.17-18
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• 2015

In manufacturing industry, image scanning technique has made enormous progress in past decades. 3D models have been also very important to continuously monitor the related spatial information for freeform buildings. The process of shape making of 3D scanning is as follows: mesh surface segmentation, NURBS surface generation, and parametric solid model generation. We will review the process and applying process. Especially in the construction industry, 3D data collection by laser scanning has become an high quality 3D models. Therefore, in this research, we have an effort to review construction of reverse design process for freeform envelope using 3D scanning. The technology enables many 3D shape engineering and design parameterization of reverse engineering in the construction site.

• Journal of computational fluids engineering
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• v.12 no.4
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• pp.14-19
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• 2007

We present a direct numerical simulation technique and some preliminary results of the capillary spreading of a droplet containing particles on the solid substrate. We used the level-set method with the continuous surface stress for description of droplet spreading with interfacial tension and employed the discontinuous Galerkin method for the stabilization of the interface advection equation. The distributed Lagrangian-multipliers method has been combined for the implicit treatment of rigid particles. We investigated the droplet spreading by the capillary force and discussed effects of the presence of particles on the spreading behavior. It has been observed that a particulate drop spreads less than the pure liquid drop. The amount of spread of a particulate drop has been found smaller than that of the liquid with effectively the same viscosity as the particulate drop.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2017.05a
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• pp.776-777
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• 2017

The grain burn-back analysis has been required for the calculation of the solid propellant performance. The conventional grain burn-back analysis uses the level set method, but problems in the moving surface analysis may occur. In this study, the face offsetting method has been used for analyzing the moving surface. As results, the face offsetting method has been proven to be useful method for the grain burn-back analysis.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.474-477
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• 1996

The solid state cesium ion beam sputter deposition system has been developed for negative carbon ion beam deposition. The negative carbon ion beams are effectively produced by cesium ion bombardment. The C-ion beam current and deposition energy can be independently controlled for the deposition of a-D films. This system is very compact, reliable and high flux without any gas discharge or plasma and has been successfully used in the studies of the ion beam deposited amorphous diamond(a-D)

• Journal of the Korean Institute of Intelligent Systems
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• v.12 no.3
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• pp.255-260
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• 2002

This paper describes a fuzzy-based system for analyzing the stress intensity factors (SIFs) of three-dimensional (3D) cracks. A geometry model, i.e. a solid containing one or several 3D cracks is defined. Several distributions of local node density are chosen, and then automatically superposed on one another over the geometry model by using the fuzzy knowledge processing. Nodes are generated by the bucketing method, and ten-coded quadratic tetrahedral solid elements are generated by the Delaunay triangulation techniques. The singular elements such that the mid-point nodes near crack front are shifted at the quarter-points, and these are automatically placed along the 3D crack front. The complete finite element(FE) model is generated, and a stress analysis is performed. The SIFs are calculated using the displacement extrapolation method. To demonstrate practical performances of the present system, semi-elliptical surface cracks in a inhomogeneous plate subjected to uniform tension are solved.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.520-524
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• 1999

Light-emitting diode(LEDs), diode arrays, and phosphor display panels are finding increased use in a variety of commercial applications. Present and anticipated application of these devices include solid state indicator and display systems. In this work, Phosphor based on ZnS:Cu are used. Relation by luminance with the thickness of insulating layer and phosphor layer are discussed. Increased thickness of insulating layer are stable on voltage to 300V. By considering thickness and voltage, optimal structure and thickness are investigated. In order to maximize even surface emission, various sieving processes are introduced. 150cd/m$^2$ luminance by various wave intensity are investigated in stable voltage and frequency.

• Journal of the Korea Institute of Military Science and Technology
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• v.4 no.1
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• pp.207-215
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• 2001

Plastic bonded explosive(PBX) is mainly composed of the nitramine-ploymer compositions. PBX is characterized by high velocity and pressure of detonation, low vulnerability and good thermal stability. Many important applications of PBX require the good adhesion between nitramine crystals and the binder. For PBXs as well as propellants, where good mechanical properties are of great importance, dewetting therefore must be prevented by strong adhesion between filler-binder. Adhesion depends on surface characteristics of filler and binder. In order to design for better adhesion, an understanding of the surface properties of explosive and binder is required. The surface free energies are calculated from contact angle values by the method of Kaelble. Critical surface tension of solids are calculated by Zisman plot. Critical surface tension is a useful parameter for characterizing the wettability of solid surface. In this study, HMX and 3 kinds of copolymers are selected, since they are widely used in many plastic bonded explosives. The technical objective of this investigation is to predict the interaction between filler and binder from their surface free energies.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.6
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• pp.845-852
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• 2001

The characteristics of evaporation cooling of single droplet on a heated surface were studied experimentally. The two kinds of heater modules were tested to measure cooling characteristics of metal surface (high conductivity) and Teflon surface (low-energy surface, low conductivity). The results showed that time averaged heat flux during droplet evaporation increased exponentially with initial surface temperatures of brass, copper and steel. The heat flux and evaporation time did not varied with metal conductivities. However, the temperature drop after the deposition of droplet was larger on Teflon than on the metals. Thus, the correlation of interface temperature between liquid droplet and metal surface was proposed as a function of the initial surface temperature of heating materials, which could be applied to both metal and non-metal ones.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.774-778
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• 1996

Developed in this research is a surface modeling kernel for various CAD/CAM applications. Its internal surface representations are rational parametric polynomials, which are generalizations of nonrational Bezier, Ferguson, Coons and NURBS surface, and are very fast in evaluation. The kernel is designed under the OOP concepts and coded in C++ on PCs. The present implementation of the kernel supports surface construction methods, such as point data interpolation, skinning, sweeping and blending. It also has NURBS conversion routines and offers the IGES and ZES format for geometric information exchange. It includes some geometric processing routines, such as surface/surface intersection, curve/surface intersection, curve projection and so forth. We are continuing to work with the kernel and eventually develop a B-Rep based solid modeler.

• Journal of the Korean Society of Safety
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• v.18 no.3
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• pp.29-33
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• 2003

The objective of the present work is to examine evaporation cooling of droplet due to surface roughness on a heated surface. The surface temperatures varied from 80-$160^{\circ}C$ on aluminum alloy (AL 2024) md surface roughness was 0.l8$\mu\textrm{m}$ 1.36$\mu\textrm{m}$. The results are as follows; Regardless of surface roughness, as droplet diameter is bigger, the in-depth temperature of solid decreases and evaporation time increases. In the case of same initial temperature on the heated surface, as droplet diameter is smaller and small surface roughness is bigger, evaporation time decreases and time averaged heat flux increases.