• Korean Journal of Materials Research
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• v.11 no.10
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• pp.879-888
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• 2001

The effects of final annealing temperature on the microstructure and creep characteristics were investigated for the Zr-lNb-0.2X (X=0, Mo, Cu) and Zr-lNb- 1Sn-0.3Fe-0.1X (X=0, Mo, Cu) alloys. The microstructures were observed by using TEM/EDS, and grain size and distributions of precipitates were analyzed using a image analyzer. The creep test was performed at $400^{\circ}C$ under applied stress of 150 MPa for 10 days. The $\beta$-Zr was observed at annealing temperature above $600^{\circ}C$. In the temperature above$ 600^{\circ}C$, the grain sizes of both alloy systems appeared to be increased with increasing the final annealing temperature. The creep strengths of Zr-1Nb-1Sn-0.3Fe-0.1X alloys were higher than those of Zr-1Nb-0.2X ones due to the effect of solid solution hardening by Sn in Zr-lNb-lSn-0.3Fe-0.1X alloy system. Also, Mo addition showed the strong effect of precipitate hardening in both alloy systems. The creep strength rapidly decreased with increasing the annealing temperature up to $600^{\circ}C$. However, a superior creep resistance was obtained in the sample that annealed to have a second phase of $\beta$-Zr. It was considered that the appearance of $\beta$-Zr would play an important role in the strengthening mechanism of creep deformation.

• Progress in Superconductivity
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• v.1 no.1
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• pp.61-67
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• 1999

We evaluated the effect of alloying element additions to Ag sheath on mechanical, electrical and thermal properties of Bi-2223. Additions of Au, Pd and Mg to Ag sheath increased hardness and strength, while reduced elongation and electrical and thermal conductivity. In addition, microstructural investigation showed that the grain size of Ag significantly decreased with increasing content of alloying elements. The improvements in strength and hardness are believed to be due to the presence of alloying elements that lead to strengthen materials by combined effects of solid-solution, dispersion hardening and grain size hardening. Thermal conductivity of Ag and Ag alloys was evaluated in the temperature range from 77 K to 300 K, and com-pared to calculated value obtained by Wiedermann-Franz law. It was observed that the thermal conductivity decreased with increasing the content of alloying elements. Specifically, the thermal conductivity of $Ag_{0.92}Pd_{0.06}Mg_{0.02}$ alloy was measured to be $48.2W/(m{\cdot}K)$ at 77 K, which is about 6 times lower than that of $Ag(302.6W/(m{\cdot}K))$.

• Korean Journal of Materials Research
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• v.27 no.7
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• pp.386-391
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• 2017

Using a customized diffusion bonder, we executed diffusion bonding for ring shaped white gold and red gold samples (inner, outer diameter, and thickness were 15.7, 18.7, and 3.0 mm, respectively) at a temperature of $780^{\circ}C$ and applied pressure of 2300 N in a vacuum of $5{\times}10^{-2}$ torr for 180 seconds. Optical microscopy, field emission scanning electron microscopy (FE-SEM), and energy-dispersive X-ray spectroscopy (EDS) were used to investigate the microstructure and compositional changes. The mechanical properties were confirmed by Vickers hardness and shear strength tests. Optical microscopy and FE-SEM confirmed the uniform bonding interface, which was without defects such as micro pores. EDS mapping analysis confirmed that each gold alloy was 14K with the intended composition; Ni and Cu was included as coloring metals in the white and red gold alloys, respectively. The effective diffusion coefficient was estimated based on EDS line scanning. Individual values of Ni and Cu were $5.0{\times}10^{-8}cm^2/s$ and $8.9{\times}10^{-8}cm^2/s$, respectively. These values were as large as those of the melting points due to the accelerated diffusion in this customized diffusion bonder. Vickers hardness results showed that the hardness values of white gold and red gold were 127.83 and 103.04, respectively, due to solid solution strengthening. In addition, the value at the interface indicated no formation of intermetallic compound around the bonding interface. From the shear strength test, the sample was found not to be destroyed at up to 100,000 gf due to the high bonding strength. Therefore, these results confirm the successful diffusion bonding of 14K white-red golds with a diffusion bonder at a low temperature of $780^{\circ}C$ and a short processing time of 180 seconds.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.10a
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• pp.46-49
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• 2003

Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties, Until now, strengthening of the copper at toy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the at toy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conduct ing material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the copper matrix composites of high strength and electric conductivity In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process in order to manufacture the intermediary materials for the carbon nanofiber reinforced Cu matrix nanocomposite and align mechanism as well as optimized drawing process parameters are verified via experiments and numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of $10~20\mu\textrm{m}$ In length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber. Optimal parameter for drawing process was obtained by experiments and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc Lower reduction areas provides the less rupture of cu tube is not iced during the drawing process. Optimal die angle was between 5 degree and 12 degree. Relative density of carbon nanofiber embedded in the copper tube is higher as drawing diameter decrease and compressive residual stress is occurred in the copper tube. Carbon nanofibers are moved to the reverse drawing direct ion via shear force caused by deformation of the copper tube and alined to the drawing direction.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.31 no.6
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• pp.282-286
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• 2021

Penetration depth and compressive residual stress of laser-carburized TiZrN coating by thickness of carbon paste were investigated in terms of carbon potential. The carbon paste was covered with a thickness of 1.1 mm using screen printing, and applied to a thickness of 0.4 mm using spin coating, and laser carburization was performed under the same conditions. As the thickness of carbon paste increased, the diffraction pattern of the laser-carburized TiZrN coating shifted to a lower angle, indicating solid solution strengthening and lattice distortion. For microstructure analysis using TEM, the defects and carbon concentration of the laser-carburized TiZrN coating increased as the carbon paste was thicker. It indicated that the variation of the carbon potential corresponds to the change in the paste thickness. In XPS depth profile analysis, high concentration of carbon and formation of carbide were observed in laser-carburized TiZrN coating with thick carbon paste. It revealed that the carbon concentration on the surface and carbon potential were changed by the thickness control of carbon paste. The compressive residual stress increased from 3.67 GPa to 4.58 GPa by the variation of carbon concentration.