• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.21 no.12
• /
• pp.1467-1474
• /
• 2010

A tile type active T/R(Transmit/Receive) module for X-band active array radar is demonstrated in this paper. Proposed tile type structure based on fuzz button solderless vertical interconnection shows wide band characteristic of about 30 % bandwidth in X-band with insertion loss of below 0.6 dB and input and output VSWR of less than 1.7. Moreover, the mismatching generally appeared in the vertical interconnection which shown wide band characteristic can also be minimized and, therefore, good gain flatness can be achieved.

• Journal of Ocean Engineering and Technology
• /
• v.14 no.4
• /
• pp.79-85
• /
• 2000

Press-fit pin connection is the solderless interference-fit between pins and plated through holes(PTH) in the printed curcuit board(PCB). Because of not only its simple assembly and absence of problems associated with soldering, but also its good mechanical and electrical characteristics, the press-fit pin connection technology has quickly gained wide acceptance in the telecommunications and computer industries. In this paper, the contact stress characteristics of the domestic CPF pin when inserted into the friction coefficients were compared and the stress variations of the compliant part of the pin, which have an influence on the performance, were displayed with the time and arc length after complete connected. It is supposed that the results will provide useful data to improve the performance of the pin-PCB interconnection mechanism.