• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.23-30
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• 2004

Interfacial reaction of Pb-free $Sn0.7wt{\%}Cu$ and $Sn3.8wt{\%}Ag0.7wt{\%}Cu$ solders and Pt during aging has been investigated. After the $Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens were reflowed at $250^{\circ}C$ for 30s and the $Sn0.7wt{\%}Cu/Pt$ specimens were reflowed at $260^{\circ}C$, the specimens were aged at $125^{\circ}C,\;150^{\circ}C$ and $170^{\circ}C$ for 25-121 hours. The intermetallic thitkness and morphology change during aging were characterized using SEM, EDS and XRD. $PtSn_4$ and $PtSn_2$ were observed in the solder/pt interface and the intermetallic formation was governed by diffusion. The activation energy of intermetallic formation was 145.3 kJ/mol for$Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens for $Sn0.7wt{\%}Cu/Pt$ specimens from the measurement of the intermetallic thickness with aging temperature and time.