• Animal Systematics, Evolution and Diversity
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• v.31 no.3
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• pp.182-190
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• 2015

Two heterotrichid ciliates, Climacostomum virens (Ehrenberg, 1838) Stein, 1859 from brackish water and freshwater, and Fabrea salina Henneguy, 1890 from a solar saltern, were collected in Korea. They are novelly investigated in Korea by means of live observation, protargol staining and nuclear small subunit (SSU) rRNA gene sequencing. Climacostomum virens is characterized by pouch-like body shape, body length of $200-370{\mu}m$ in vivo, conspicuous cytopharyngeal tube, macronuclei ribbon-like shape, and one to four in number, with or without symbiont algae in cytoplasm, 34-66 somatic kineties, 67-113 adoral zone of membranelles, 8-42 peristomial kineties, 24-37 apical membranelles. SSU rDNA sequence size is 1,591 bp and GC contents 48.52%. Fabrea salina is also characterized by scoop-like body shape with proboscis, body length of $190-240{\mu}m$ in vivo, one to two rod-shaped macronuclei, oval micronuclei, grayish green cortical granules, 104-186 somatic kineties, 4-8 preoral kineties, 7-19 peristomial kineties and fragmented paroral membrane. SSU rDNA sequence size is 1,598 bp and GC contents 47.50%.

• The Bulletin of The Korean Astronomical Society
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• v.39 no.1
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• pp.69.1-69.1
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• 2014

We perform an MHD simulation combined with observed vector field data to clarify an eruptive dynamics in the solar flare. We first extrapolate a 3D coronal magnetic field under a Nonlinear Force-Free Field (NLFFF) approximation based on the vector field, and then we perform an MHD simulation where the NLFFF prior to the flare is set as an initial condition. Vector field was obtained by the Soar Dynamics Observatory (SDO) at 00:00 UT on February 15, which is about 90 minutes before the X2.2-class flare. As a result, the MHD simulation successfully shows an eruption of strongly twisted lines whose values are over one-turn twist, which are produced through the tether-cut magnetic reconnection in strongly twisted lines of the NLFFF. Eventually, we found that they exceed a critical height at which the flux tube becomes unstable to the torus instability determining the condition that whether a flux tube might escape from the overlying field lines or not. In addition to these, we found that the distribution of the observed two-ribbon flares is similar to the spatial variance of the footpoints caused by the reconnection of the twisted lines being resided above the polarity inversion line. Furthermore, because the post flare loops obtained from MHD simulation well capture that in EUV image taken by SDO, these results support the reliability of our simulation.

• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.10-16
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• 2018

In silicon crystalline PV (Photo Voltaic) industry, PV module or panel electric power is directly related to the companies' profit. Thus, many PV companies have invested and focused on R&D activities to get the higher module power. The main BOM (Bills of Material) on the module consists of PV solar cell, ribbon, EVA (Ethylene-Vinyl Acetate copolymer), glass and back sheet. Based on consistent research efforts on enhancing module power using BOM, there have been increase of around 5 watt per module every year as results. However, there are lack of studies related to enhancing accuracy of measurement. In this study, the enhancing on the metrology is investigated and the improvement shows actually contribution to company's profit. Especially, the measurement issues related to heat and to quasi state of bandgap diagram by EL(Electro Luminescence) are described in this study.

• Journal of the Korean Solar Energy Society
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• v.37 no.2
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• pp.77-85
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• 2017

Thin crystalline silicon (C-Si) solar cell is expected to be a low price energy source by decreasing the consumption of Si. However, thin c-Si solar cell entails the bowing and crack issues in high temperature manufacturing process. Thus, the conventional tabbing process, based on high temperature soldering (> $250^{\circ}C$), has difficulties for applying to thin c-Si solar cell modules. In this paper, a conductive paste (CP) based interconnection process has been proposed to fabricate thin c-Si solar cell modules with high production yield, instead of existing soldering materials. To optimize the process condition for CP based interconnection, we compared the performance and stability of modules fabricated under various lamination temperature (120, 150, and $175^{\circ}C$). The power from CP based module is similar to that with conventional tabbing process, as modules are fabricated. However, the output of CP based module laminated at $120^{\circ}C$ decreases significantly (14.1% for Damp heat and 6.1% for thermal cycle) in harsh condition, while the output drops only in 3% in the samples process at $150^{\circ}C$, $175^{\circ}C$. The peel test indicates that the unstable performance of sample laminated at $120^{\circ}C$ is attributed to weak adhesion strength (1.7 N) between cell and ribbon compared to other cases (2.7 N). As a result, optimized lamination temperature for CP based module process is $150^{\circ}C$, considering stability and energy consumption during the fabrication.

• Journal of Korea Foundry Society
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• v.33 no.4
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• pp.157-161
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• 2013

A ribbon-type polycrystalline silicon wafer was directly fabricated from liquid silicon via a novel technique for both a fast growth rate and large grain size by exploiting gas pressure. Effects of processing parameters such as moving speed of a dummy bar and the length of the solidification zone on continuous casting of the silicon wafer were investigated. Silicon melt extruded from the growth region in the case of a solidification zone with a length of 1cm due to incomplete solidification. In case of a solidification zone wieh a length of 2 cm, on the other hand, continuous casting of the wafer was impossible due to the volume expansion of silicon derived from the liquid-solid transformation in solidification zone. Consequently, the optimal length of the solidification zone was 1.5 cm for maintaining the position of the solid-liquid interface in the solidification zone. The silicon wafer could be continuously casted when the moving speed of the dummy bar was 6 cm/min, but liquid silicon extruded from the growth region without solidification when the moving speed of the dummy bar was ${\geq}$ 9 cm/min. This was due to a shift of the position of the solid-liquid interface from the solidification zone to the moving area. The present study reports experimental findings on a new direct growth system for obtaining silicon wafers with both high quality and productivity, as a candidate for an alternate route for the fabrication of ribbon-type silicon wafers.

• Transactions on Electrical and Electronic Materials
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• v.16 no.5
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• pp.268-273
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• 2015

While analyzing the specimens before and after the thermal shock test, we found that the power drop rate of the bare cell was 5.08%, while the power drop rate of the ribboned cell was 16.49%. In comparative terms, the efficiency was lower at the ribboned cell than at the bare cell. While analyzing through EL (Electroluminescence) shots and cross sections, we tried to decipher the exact cause of the power drop. Although mere color change of the cell was observed at the surface of the bare cell, no abnormality could be found inside the cell. On the surface of the ribboned cell, the short circuit of gridfinger extended from the front part of the front electrode of the ribboned cells. Therefore, cracks occurred on the surface of the cell. Cracks also appeared inside the cell. While analyzing the I-V curve, we determined an increase in the leakage current and an increase of resistances in series in the bare cell. In the ribboned cell, the resistances in parallel reduced remarkably. An increase of resistances in series could also be verified. Conclusively, we deduced that the power drop rate in the bare cell is a life span of the cell itself; aging is the cause of power drop rate in cells. In case of ribboned cell, the power drop rate was directly influenced by internal cracks and an intermetallic compound layer joining the ribbon at the front electrode.

• Current Photovoltaic Research
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• v.7 no.3
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• pp.65-70
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• 2019

As a demand of higher power photovoltaic modules, shingled, multi-busbar, half-cell, and bifacial techniques are developed. Multi-busbar module has advantage for large amount of light havesting. And, half-cell is high power module for reducing resistive losses and higher shade tolerance. Recently, researches on multi-busbar is focused on reliability according to adhesion and intermetallic compound between Sn-Pb solder and Ag electrode. And half-cell module is researched to comparing with full-sized cell module for structure difference. In this study, we investigated the factors affecting to efficiency and adhesion of multi-wires half-cell module according to wire thickness, solder thickness, and flux. The results of solar simulator and peel test was that peel strength and efficiency of soldered cell is not related. But samples with flux including high solid material showed high efficiency. The results of FE-SEM and EDX line scan on cross-section between wire and Ag electrode for different flux showed thickness of solder joint between wire and Ag electrode is increasing through solid material increasing. Flux including high solid material would affect to solder behavior on Ag electrode. Higher solid material occurred lower growth of IMC layer because solder permeate to sider of wire ribbon than Ag electrode. And it increased fill factor for high efficiency. In soldering process, amount of solid material in flux and solder thickness are the factor related with characteristic of soldered photovoltaic cell.