• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.317-320
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• 2008

The Hot Stamping process, which is the hot pressing of steel parts using cold dies. can utilize both case of shaping and high strength due to the hardening effect of rapid quenching during the pressing. We carried out experiments of quenching rate and tempering treatments at temperatures of $200^{\circ}C$ and $300^{\circ}C$ and different soaking times. Tn this study, the mechanical properties and microstructure of micro boron alloyed steels after heat treatments are compared.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.327-331
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• 1997

As demand for various kinds and small lot products has been increasing, batch annealing has been appreciated for its small restiction for the opteration. The cold spot of the coil is very important in the BAF(Batch annealing furnace) annealing process. Because of the annealing cycle time in the BAF, annealing was decided on the cold spot of the coil. So, we tested the effect,variation of cold spot, for hydrogen contents of atmospheric gas at the annealing furnace. As a result of several investigations. We confirmed the following characteristics ; after the heating and soaking,the cold spot of coil moved to 1/3 of coil thickness in the NHx atmospheric gas, but the mid point of the coil thickness is the cold spot in the Ax or .H/sub2. atmospheric gas. Therefore, the use of hydrogen instead of nitrogen as the protective gas,combined with high convection in batch annealing furnaces, has shown that considerable increases in furnace output and material quality are attainable. Owing to the low density, high diffusion and reducing character of hydrogen, a better transfer resulting in uniform material temperatures and improved coil surfaces can be achieved.

• Journal of the Korean Society for Heat Treatment
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• v.11 no.3
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• pp.200-206
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• 1998

The aim of this study is to investigate the effect of impurity level and fabrication processes on the strength, impact and fracture toughness of 7075, 7050 and 7175 aluminum alloy forgings. A specially processed 7175S-T74 aluminum forgings was superior to a conventionally processed 7075-T73, 7050-T74 and 7175-T74 aluminum forgings in both strength and toughness. The reduction of impurity level of iron and silicon has significantly diminished the size and volume fraction of second phase particles such as $Al_7Cu_2Fe$ and $Mg_2Si$. A further reduction of the amount of second phase particles has been observed by applying a special fabrication process. This phenomena result from the application of intermediate soaking at higher temperature and more sufficiant hot working temperature than that of a conventional processing.

• Journal of the Korean institute of surface engineering
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• v.41 no.6
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• pp.331-334
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• 2008

The replica of highly ordered nano-sphere array patterns were fabricated using hot embossing method. First, silica nano-sphere array on Si substrate was transferred to PVC film at $130^{\circ}C$ and 7 bar using hot embossing process. Then, silica nano-sphere array on PVC template was removed by soaking the PVC film in buffered oxide etcher. In order to form anti-stiction layer, the PVC template was coated with silicon dioxide layer and self-assembled monolayer. Through UV nanoimprint lithography with the fabricated flexible PVC template, highly ordered nano-sphere array pattern was imprinted on curved substrates with high fidelity.

• Corrosion Science and Technology
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• v.3 no.4
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• pp.172-177
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• 2004

Biaxially oriented polyethylene terephthalate copolymer(BO - PET)film laminated aluminiums have been applied for chip condenser case. The BO PET film is characterized by high molecular which gives high corrosion resistance, good adhesion and high heat resistance. The higher orientation lowers formability of the film. So, optimum orientation has to be controlled during the laminating process. And to confirm the adhesion between BO PET and aluminium and to guarantee the formability of PET laminated aluminums, we have controlled the chromium oxides weight on the aluminium and laminating condition ( laminating temperature, soaking temperature and lag time after nip roll and quenching conditions) This paper discusses the effect of the laminating conditions on the formability of laminated aluminums. As results, it is clear that the orientation of the BO PET film decreased with an increase in the strip temperature. When the film temperature is over the melting point of the film, its orientation drastically decreased.

• Proceedings of the Membrane Society of Korea Conference
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• 2004.05a
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• pp.175-178
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• 2004

Concerning the application of the inorganic composite membranes to high temperature process such as the catalytic dehydrogenation of hydrocarbons, important aspects to consider in the application include the improvement of the thermal stability and good permeability.(omitted)

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.299-302
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• 2000

RTD temperature sensor is a thermoresistor which uses the liner dependence of the resistance of the sensing material on the temperature, and has good stability and sensibility, so it can be used in highly precise temperature measurement. In this study RTD sensor was fabricated using Pt thin film. The Pt thin film was deposited on alumina using DC-Sputter, and annealed with various temperature. Through the experiments of XRD, AFM, 4-point probe, the surface structure of the thin film with annealing conditions and their effects on the electrical resistance were investigated. RTD with serpentine pattern was fabricated using Lift-off and resistance-temperature characteristics were studied.

• Journal of Powder Materials
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• v.7 no.3
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• pp.149-153
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• 2000

In this study, the fabrication of $Al_2O_3$/5vol.%Cu nanocomposite and its mechanical property were discussed. The nanocomposite powders were produced by high energy ball milling of $Al_2O_3$ and Cu elemental powders. The ball-milled powders were sintered with Pulse Electric Current Sintering (PECS) facility. The relative densities of specimens sintered at $1200^{\circ}C$ and $1250^{\circ}C$ after soaking process at $900^{\circ}C$ were 96% and over 97%, respectively. The sintered microstructures were composed of $Al_2O_3$ matrix and the nano-sized Cu particles distributed on grain boundaries of $Al_2O_3$ matrix. The nanocomposite exhibited the enhanced fracture toughness compared with general monolithic $Al_2O_3$. The toughness increase was explained by the crack deflection and bridging by dispersed Cu particles.

• 한국신재생에너지학회:학술대회논문집
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• 2007.11a
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• pp.297-300
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• 2007

In this study, we have attempted a new method to enhance the coloring of dye on the $TiO_2$ surface in the dye sensitized solar cell. In the conventional coloring process in a dye sensitized solar cells, dye is absorbed by the covalent bond between TiO2 and dye molecule while the photo-electrode coated with $TiO_2$ layer is soaked in dye solution for about 12-24 hours. But this process takes long time, so we have researched more effective and faster way than the conventional process by applying electric field. Three kinds of electric power such as direct voltage, alternating voltage and pulse voltage were applied to the transparent conducting oxide during the coloring process. As a result, we achieved improved power, fill factor and efficiency of dye-sensitized solar cell in case of applying direct voltage and pulse voltage. In contrast, alternating voltage tend to reduce the dye adsorption on the $TiO_2$ surface and hence the efficiency. We measured the absorption spectra of dye by UV-VIS spectrophotometer before and after soaking the $TiO_2$ in the dye and found no characteristic change in the dye was observed. In this study, we researched on shortening time of coloring process which spent much time in the whole process.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.435-437
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• 2002

Polishing of copper, a process called copper chemical mechanical polishing, is a critical, intermediate step in the planarization of silicon wafers. During polishing, the electrodeposited copper films are removed by slurries: and the differential polishing rates between copper and the surrounding silicon dioxide leads to a greater removal of the copper. The differential polishing develops dimples and furrows; and the process is called dishing and erosion. In this work, we present the results of experiments on dishing and erosion of copper-CMP, using patterned silicon wafers. Results are analyzed for the pattern factors and properties of the copper layers. Three types of pads - plain, perforated, and grooved - were used for polishing. The effect of slurry chemistries and pad soaking is also reported.