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Kim Moon-Su;Rim Chong-Suck
- Journal of the Institute of Electronics Engineers of Korea SD
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- v.43 no.9 s.351
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- pp.1-9
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- 2006
In the System-on-Chip(SoC) design, the global wires are critical parts for the performance. Therefore, the global wires need to be pipelined using flip-flops or latches. Since the timing constraint of the latch is more flexible than it of the flip-flop, the latch-based design can provide a better solution for the clock period. Retiming is an optimizing technique which repositions memory elements in the circuits to reduce the clock period. Traditionally, retiming is used on gate-level netlist, but retiming for SoC is used on macro-level netlist. In this paper, we extend the previous work of retiming for SoC using flip-flops to retiming for SoC using single-phase clocked latches. In this paper we propose a MILP for retiming for SoC using single-phase clocked latches, and apply the fixpoint computation to solve it. Experimental results show that retiming for SoC using latches reduces the clock period of circuits by average 10 percent compared with retiming for SoC using flip-flops.
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Yoon, Hee-Jin
- Journal of the Korea Society of Computer and Information
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- v.23 no.1
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- pp.33-39
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- 2018
In this paper, We studied the possibility of SoC(System On Chip) design using infrared image processing IP(Intellectual Property). And, we studied NUC(Non Uniformity Correction), BPR(Bad Pixel Recovery), and CEM(Contrast Enhancement) processing, the infrared image processing algorithm implemented by IP. We showed the logic and timing diagram implemented through the hardware block designed based on each algorithm. Each algorithm was coded as RTL(Register Transfer Level) using Verilog HDL(Hardware Description Language), ALTERA QUARTUS synthesis, and programed in FPGA(Field Programmable Gated Array). In addition, we have verified that the image data is processed at each algorithm without any problems by integrating the infrared image processing algorithm. Particularly, using the directly manufactured electronic board, Processor, SRAM, and FLASH are interconnected and tested and the verification result is presented so that the SoC type can be realized later. The infrared image processing IP proposed and verified in this study is expected to be of high value in the future SoC semiconductor fabrication. In addition, we have laid the basis for future application in the camera SoC industry.
https://doi.org/10.9708/jksci.2018.23.01.033 인용 PDF KSCI