• Korean Chemical Engineering Research
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• v.45 no.5
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• pp.433-441
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• 2007

This work investigated the stability of a Sn-modified Pt electrode, which was used for reduction of nitrate, fabricated by an adsorption or electro-deposition of Sn on Pt. In order to find the causes for instability of the electrode, the effects of the solutions in which the electrode was used and the potential applied to the electrode on the electrochemical and metallurgical behaviors of Sn on Pt were studied. The Sn of freshly- prepared modified-Sn Pt electrode existed as Sn hydroxide form, which brought about an easy loss of the electro-activity of the electrode even staying in water, especially in acid solution. When the Sn-modified Pt electrode was used for the reduction of nitrate, the electro-activity of the electrode was affected depending on the potential applied to the electrode. When a more negative potential than the redox equilibrium potential between $Sn(OH)_2$ and Sn was applied to the electrode, the Sn hydroxide was converted to Sn that could diffused into Pt, which leaded to the loss of electro-activity of the electrode as well. The solid diffusion of Sn increased linearly with the applied potential. The Sn-electrodeposited Pt electrode which had more Sn on the electrode was more favorable to maintaining the integrity of the electrode during the reduction of nitrate than the Sn-adsorbed Pt electrode prepared in the under-potential deposition way.

• Korean Chemical Engineering Research
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• v.45 no.2
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• pp.124-132
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• 2007

This work investigated a fabrication way of stable platinized Ti electrode and evaluated the electrochemical characteristics of the Sn-modified platinized Ti electrode in nitrate solution. A Pt electro-plating way to form some open special clearances within the Pt coating layer on etched Ti substrate was very important to remove effectively the residual contaminate due to plating solution out of the fabricated electrode surface and to maximize the actual electrode surface area contacting solution. Both boiling and electro-cleaning processes of the fabricated electrode was essential to obtain a stable platinized-Pt electrode with reproducible and stable surface property which was necessary for the correct evaluation of Sn coverage on the electrode. The electro-cleaning caused a morphology change of the platinized Ti electrode surface with some downy hair-like polyps formed during the deposition disappearing, which made the electrode stable. The Sn-modified platinized Ti electrode in this work showed the best electro-activity for nitrate reduction, when it was fabricated through the Pt electro-plating of about 30 minutes.

• Current Photovoltaic Research
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• v.4 no.1
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• pp.16-20
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• 2016

$Cu_2ZnSnS_4$ (CZTS) thin films were fabricated by successive electrodeposition of layers of precursor elements followed by sulfurization of an electrodeposited Cu-Zn-Sn precursor. In order to improve quality of the CZTS films, we tried to optimize the deposition condition of absorber layers. In particular, I have conducted optimization experiments by changing the Cu-layer deposition time. The CZTS absorber layers were synthesized by different Cu-layer conditions ranging from 10 to 16 minutes. The sulfurization of Cu/Sn/Zn stacked metallic precursor thin films has been conducted in a graphite box using rapid thermal annealing (RTA). The structural, morphological, compositional, and optical properties of CZTS thin films were investigated using X-ray diffraction (XRD), Field emission scanning electron microscopy (FE-SEM), Raman spectroscopy, and X-ray Flourescenece Spectrometry (XRF). Especially, the CZTS TFSCs exhibits the best power conversion efficiency of 4.62% with $V_{oc}$ of 570 mV, $J_{sc}$ of $18.15mA/cm^2$ and FF of 45%. As the time of deposition of the Cu-layer to increasing, the properties were confirmed to be systematically changed. And we have been discussed in detail below.

• Journal of the Korean institute of surface engineering
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• v.4 no.1
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• pp.16-23
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• 1971

In this study , fluoborte solution consisting of lead fluoborate, tin fluoborate and cupric acetate was used. By addition of small amount of Cu+= ion to the solution, the Cu content of deposition layer was almost controlled less than 5%. The amount of Cu in deposition layer was almost constant without any influence of Pb++ & Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution, and the amount of Pb was increased by the increase of total concentration of Pb++ +Sn++ in the solution . Agitation of plating solution & low current density result in the increase of Cu content. Analyzing of microscopic structures and etching tests of the deposited alloy, it was believed that the alloy had a lamellar structure consisting of copper rich lamellar and lead rich layer.

• Proceedings of the Korean Vacuum Society Conference
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• 1996.02a
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• pp.173-173
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• 1996

• Journal of the Korean Ceramic Society
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• v.49 no.2
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• pp.191-196
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• 2012

In this study, tin phosphate glass system($SnO_2-(1-x)P_2O_5-xB_2O_3$) that occur during the melting of the metal oxide inhibition of the oxidation reaction, and to reduce oxides of high melting temperature in the following three methods were melting. The first is the general way in the atmosphere, and the second by injecting $N_2$ gas under a neutral atmosphere, and finally in the air were melted by the addition of a reducing agent Melt in the atmosphere when the oxidation of the metal oxide is inhibited by low temperatures were melting. In addition, the deposition of crystals within glassy or inhibit devitrification phenomenon is also improved over 80% transmittance. This phenomenon, when the melting of glass, many of $Sn^{4+}$ ions are reduced to the $Sn^{2+}$ was forming oxides SnO, because it acts as a modifier oxide.

• Journal of the Korean institute of surface engineering
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• v.44 no.4
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• pp.144-148
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• 2011

$Ga_2O_3$ doped $SnO_2$ thin films were grown by using pulsed laser deposition (PLD) technique on glass substrate. The optical and electrical properties of these films were investigated for different doping concentrations, oxygen partial pressures, substrate temperatures, and film thickness. The films were deposited at different substrate temperatures (room temperature to $600^{\circ}C$). The best opto-electrical properties is shown by the film deposited at substrate temperature of $300^{\circ}C$ with oxygen partial pressure of 80 m Torr and the gallium concentration of 2 wt%. The as obtained lowest resistivity is $9.57{\times}10^{-3}\;{\Omega}cm$ with the average transmission of 80% in the visible region and an optical band gap (indirect allowed) of 4.26 eV.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.287-287
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• 2012

주석합금도금 피막은 약한 전류가 흐르는 전자제품, 휴대전화, 자동차 공업용, 장식용으로 사용되고 있다. 현재까지 공업적으로 사용되고 있는 주석합금도금의 합금원소로서 은, 코발트, 니켈 등의 높은 가격의 금속과 납과 같이 ELV 및 RoHS 유해환경물질규제지침에 따라 수출제한을 받는 6가 크롬, 카드뮴 등이 알려져 있다.

• Korean Journal of Metals and Materials
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• v.49 no.5
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• pp.411-418
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• 2011

The current study investigates the electroplating characteristics of Sn-Cu eutectic micro-bumps electroplated on a Si chip for flip chip application. Under bump metallization (UBM) layers consisting of Cr, Cu, Ni and Au sequentially from bottom to top with the aim of achieving Sn-Cu bumps $10\times10\times6$ ${\mu}m$ in size, with 20${\mu}m$ pitch. In order to determine optimal plating parameters, the polarization curve, current density and plating time were analyzed. Experimental results showed the equilibrium potential from the Sn-Cu polarization curve is -0.465 V, which is attained when Sn-Cu electro-deposition occurred. The thickness of the electroplated bumps increased with rising current density and plating time up to 20 mA/$cm^2$ and 30 min respectively. The near eutectic composition of the Sn-0.72wt%Cu bump was obtained by plating at 10 mA/$cm^2$ for 20 min, and the bump size at these conditions was $10\times10\times6$ ${\mu}m$. The shear strength of the eutectic Sn-Cu bump was 9.0 gf when the shearing tip height was 50% of the bump height.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.409-409
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• 2011

All solid-state thin film lithium batteries have many applications in miniaturized devices because of lightweight, long-life, low self-discharge and high energy density. The research of cathode materials for thin film lithium batteries that provide high energy density at fast discharge rates is important to meet the demands for high-power applications. Among cathode materials, lithium manganese oxide materials as spinel-based compounds have been reported to possess specific advantages of high electrochemical potential, high abundant, low cost, and low toxicity. However, the lithium manganese oxide has problem of capacity fade which caused by dissolution of Mn ions during intercalation reaction and phase instability. For this problem, many studies on effect of various transition metals have been reported. In the preliminary study, the Sn-substituted LiMn2O4 thin films prepared by pulsed laser deposition have shown the improvement in discharge capacity and cycleability. In this study, the thin films of LiMn2O4 and LiSn0.0125Mn1.975O4 prepared by RF magnetron sputtering were studied with effect of deposition parameters on the phase, surface morphology and electrochemical property. And, all solid-state thin film batteries comprised of a lithium anode, lithium phosphorus oxy-nitride (LiPON) solid electrolyte and LiMn2O4-based cathode were fabricated, and the electrochemical property was investigated.