• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.47-54
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• 2008

In this paper, we studied how and why did abnormal IMC growth at component affect on board level mechanical reliability. First, interfacial reactions between Sn2.5Ag0.5Cu solder and electrolytic Ni/Au UBM of component side were investigated with reflow times and thermal aging time. Also, to compare mechanical reliability of component level, shear energy was evaluated using the ball shear test conducted with variation of shear tip speed. Finally, to evaluate mechanical reliability of board level, we surface-mounted component fabricated with each condition on PCB side. After conducting of 3 point bending test and impact test, we confirmed solder joint crack mode using cross-sectioning and dye & pry penetration method.

• Korean Journal of Metals and Materials
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• v.46 no.2
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• pp.80-87
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• 2008

Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1035-1040
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• 2010

The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.72-72
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• 2009

전자부품의 내부접속 및 파워반도체의 다이본딩과 같은 1차실장에는 고온환경에서의 사용과 2차실장에서의 재용융방지를 위해 높은 액상선온도 및 고상선온도를 필요로 하여, Pb-5wt%Sn, Pb-2.5wt%Ag로 대표되는 납성분 85%이상의 고온솔더가 널리 사용되고 있다. 생태계와 인체에 대한 납의 유해성이 보고된 이래, 무연솔더에 대한 연구가 활발히 진행되어 왔으나, Sn-Ag-Cu계로 대표되는 Sn계 합금으로 대체 중인 중온용 솔더와는 달리, 고온용 솔더에 대해서는 대체합금에 대한 연구가 미흡한 실정이다. 대체재의 부재로 인해 기존의 납을 다량함유한 솔더로 1차실장이 지속됨으로서, 2차실장의 무연화에도 불구하고 전자부품 및 기기의 재활용에 큰 어려움을 겪고 있다. 지금까지 고온용 무연솔더로서는 융점에 근거해 Au-(Sn, Ge, Si)계, Bi-Ag계, Zn-(Al, Sn)계의 극히 제한된 합금계만이 보고되어 왔다. Au계 솔더는 현재 플럭스를 사용하지 않는 광학, 디스플레이 분야 등 고부가가치 공정에 사용되고 있으나, 합금가격이 매우 비싸며 가공성이 나빠 대체재료로서는 적합하지 않다. Bi-Ag계 솔더 또한 취성합금으로 와이어 및 박판으로 가공하는데 어려움이 크며, 솔더로서 중요한 특성중 하나인 전기전도도 및 열전도도가 나쁜 편이다. 이에 비해, Zn계 합금은 비교적 낮은 합금가격, 적절한 가공성과 뛰어난 인장강도, 우수한 전기전도도 및 열전도도를 지녀, 고온용솔더 대체재료의 유력한 후보로 생각된다.이전 연구에서, 필자의 연구그룹은 Zn-Sn계 합금을 고온용 무연솔더로서 제안한 바 있다. Zn-Sn계 합금은 충분히 높은 융점과 함께, 금속간화합물이 없는 미세조직, 우수한 기계적 특성, 높은 전기전도도 및 열전도도 등의 장점을 나타내었다. 본 연구에서는 기초합금특성상 고온솔더로서 다양한 장점을 지닌 Zn-30wt%Sn합금을 고온용 솔더의 대표적인 적용의 하나인 다이본딩에 적용하여, 접합부의 강도 및 미세조직, 열피로 신뢰성에 대해 분석을 함으로서 실제 공정에의 적용가능성에 대해 검토하였다. Zn-30wt%Sn을 이용해 Au/TiN(Titanium nitride) 코팅한 Si다이를 AlN-DBC(aluminum nitride-direct bonded copper)기판에 접합한 결과, 양측에 완전히 젖은 기공이 없는 양호한 다이접합부를 얻었으며, 솔더내부에는 금속간화합물을 형성하지 않았다. Si다이와의 계면에는 TiN만이 존재하였으며, Cu와의 계면에는 Cu로부터 $Cu_5Zn_8,\;CuZn_5$의 반응층을 형성하였다. 온도사이클시험을 통한 열피로특성평가에서, Zn-30wt%Sn를 이용한 다이접합부는 1500사이클 지점에서 Cu와 Cu-Zn금속간화합물의 사이에서 피로균열이 형성되며, 접합강도가 크게 감소하였다. 열피로특성 향상을 위해 Cu표면에 TiN코팅을 하여 Zn-30wt%Sn 솔더로 다이접합한 결과, Si다이와 기판 양측에 TiN만으로 구성된 계면을 형성하였으며, TEM관찰을 통해 Zn-30wt%Sn과 극히 미세한 접합계면이 형성하고 있음을 확인하였다. Zn-wt%30Sn솔더와 TiN층의 병용으로 2000사이클까지 미세조직의 변화 및 강도저하가 없는 극히 안정된 고신뢰성의 다이접합부를 얻을 수가 있었다.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.63-72
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• 2006

Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear finite element model was used to simulate the mechanical bending deformation of solder joint in BGA packages. The fatigue life of lead-free (95.5Sn4.0Ag0.5Cu) solder joints was compared with that of lead-contained (63Sn37Pb). When the applied load to the specimen is small, the lead-free solder has longer fatigue life than lead-contained solder. The fatigue crack is initialized at the exterior solder joints and is propagated into the inner solder joints.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.1-8
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• 2018

In the soldering industry, a variety of lead-free solders have been developed as a part of restricting lead in electronic packaging. Sn-Ag-Cu (SAC) lead-free solder is regarded as one of the most superior candidates, owing to its low melting point and high solderability as well as the mechanical property. On the other hand, the mechanical property of SAC solder is directly influenced by intermetallic compounds (IMCs) in the solder joint. Although IMCs in SAC solder play an important role in bonding solder joints and impart strength to the surrounding solder matrix, a large amount of IMCs may cause poor strength, due to their brittle nature. In other words, the mechanical properties of SAC solder are of some concern because of the formation of large and brittle IMCs. As the IMCs grow, they may cause poor device performance, resulting in the failure of the electronic device. Therefore, new solder technologies which can control the IMC growth are necessary to address these issues satisfactorily. There are an advanced nanotechnology for microstructural refinement that lead to improve mechanical properties of solder alloys with nanoparticle additions, which are defined as nano-reinforced solders. These nano-reinforced solders increase the mechanical strength of the solder due to the dispersion hardening as well as solderability of the solder. This paper introduces the nano-reinforced solders, including its principles, types, and various properties.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.77-77
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• 2009

ELV(; End of Life Vehicles)를 비롯한 최근 환경 동향은 자동차 전장 모듈에 대하여 다양한 무연 솔더 적용을 요구하고 있다. 특히 자동차 엔진룸과 트랜스미션은 가동 중 고온 및 진동의 지속적인 영향을 받기 때문에 이와 유사한 환경에서의 신뢰성 연구가 필요한 시점이다. 이에 본 연구에서는 Sn3.5Ag, Sn0.7Cu, Sn5.0Sb 솔더 조성에 대하여 복합환경 조건하에서 접합부 신뢰성을 평가하였다. 복합환경을 구현하기 위하여 $-40{\sim}150^{\circ}C$ 범위의 온도 사이클과 랜덤 진동을 동시에 인가하였으며, 진동 가속도 3G, 진동주파수는 10~1000Hz 로 설정하여 자동차 환경을 충족하였다. 복합시험의 1 cycle 은 20 시간이며, 총 120 시간의 시험 동안 진동의 영향 및 진동과 고온이 동시에 작용하였을 경우의 영향에 대해 비교하였다. 테스트 모듈 제작을 위해 450 um 의 솔더볼이 적용되었으며, 각 조성의 솔더볼을 이용하여 BGA test chip 제작하였고, 제작된 BGA test chip 은 다시 daisy chain PCB 위에 실장 및 리플로우 공정을 통해 접합되었다. 테스트 동안 In-situ 로 저항의 변화를 관찰하여 파단의 유무를 판단하였고 전자주사현미경을 통해 파괴 기전을 평가하였다. 복합시험 시간에 따른 전단강도를 측정하였으며, 각 조성에 대하여 상이한 전단강도 변화를 관찰하였다. 계면 IMC 형상은 전단강도 변화에 영향을 주었으며, 특히 높은 온도가 IMC 성장을 촉진시켜 전단강도 감소에 영향을 주었다. 본 복합환경 시험 조건에서는 Sn0.7Cu 가 가장 안정적이었으며, 파단면을 관찰한 결과 연성파괴 모드가 관찰되었다.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.11-17
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• 2009

The drop impact reliability comes to be important for evaluation of the life time of mobile electronic products such as cellular phone. The drop impact reliability of solder joint is generally affected by the kinds of pad and reflow number, therefore, the reliability evaluation is needed. Drop impact test proposed by JEDEC has been used as a standard method, however, which requires high cost and long time. The drop impact reliability can be indirectly evaluated by using high speed shear test of solder joints. Solder joints formed on 3 kinds of surface finishes OSP (Organic Solderability Preservation), ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) was investigated. The shear strength was analysed with the morphology change of intermetallic compound (IMC) layer according to reflow number. The layer thickness of IMC was increased with the increase of reflow number, which resulted in the decrease of the high speed shear strength and impact energy. The order of the high speed shear strength and impact energy was ENEPIG > ENIG > OSP after the 1st reflow, and ENEPIG > OSP > ENIG after 8th reflow.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.93-99
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• 2004

At present, LG Electronics pushes ahead to eliminate the Pb(Lead) -a hazardous material- from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C-+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.