• 대한치과기공학회지
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• 제30권2호
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• pp.31-37
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• 2008

A variety of the porcelain fused to gold(PFG) have been developed to which porcelain can be fused. PFG alloys developed for this purposed have a high melting point and do not discolor when combined with porcelain. The design of the compositions of PFG is very important to esthetic restorative materials applying to porcelain. The purpose of this study is on the change of physical and mechanical characteristics in PFG 18K alloy by the small additional elements. Principal results are as follows. The high Au alloy containing 18Karat gold contents is respectively Au(75%), Pd(10%), Pt(4%), Ag(4%), In(2%), Sn(2%), Cu(2%), Ti(1%). These alloys are composed mainly of gold, platinum, silver and palladium with a few percent of the additional elements. By the addition of small amounts of elements such as In, Sn, Ti, the fine grain castings are produced in gold alloy and the small addition of platinum is very effective in increasing of hardness and strength. These gold alloys are representative of the changes to be expected as a result of heat treatment. These changes in strength and hardness values are sufficient to demonstrate a significant difference in performance between a as-casted and a heat-treated. These alloys have mechanical properties characteristics of Type and Type gold alloys. These alloys are useful to porcelain-metal restorations and dental laboratory. Also the porcelain fused to metal(PFM) alloys containing gold are commonly use for dental purposes in dental laboratory.

• 한국재료학회지
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• 제20권8호
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• pp.401-407
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• 2010

We studied the influence of different types of metal electrodes on the performance of solution-processed zinc tin oxide (ZTO) thin-film transistors. The ZTO thin-film was obtained by spin-coating the sol-gel solution made from zinc acetate and tin acetate dissolved in 2-methoxyethanol. Various metals, Al, Au, Ag and Cu, were used to make contacts with the solution-deposited ZTO layers by selective deposition through a metal shadow mask. Contact resistance between the metal electrode and the semiconductor was obtained by a transmission line method (TLM). The device based on an Al electrode exhibited superior performance as compared to those based on other metals. Kelvin probe force microscopy (KPFM) allowed us to measure the work function of the oxide semiconductor to understand the variation of the device performance as a function of the types metal electrode. The solution-processed ZTO contained nanopores that resulted from the burnout of the organic species during the annealing. This different surface structure associated with the solution-processed ZTO gave a rise to a different work function value as compared to the vacuum-deposited counterpart. More oxygen could be adsorbed on the nanoporous solution-processed ZTO with large accessible surface areas, which increased its work function. This observation explained why the solution-processed ZTO makes an ohmic contact with the Al electrode.

• Restorative Dentistry and Endodontics
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• 제9권1호
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• pp.101-106
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• 1983

It was the purpose of this study to investigate the fracture mode of dental amalgam by observing the crack propagation, and to relate this to the microstructure of the amalgam. Caulk 20th Century Regular, Caulk Spherical, Dispersalloy, and Tytin amalgam alloys were used for this study. After each amalgam alloy and Hg measured exactly by the balance was triturated by the mechanical amalgamator (Capmaster, S.S. White), the triturated mass was inserted into the cylindrical metal mold which was 4 mm in diameter and 12 mm in height and was pressed by the Instron Universal Testing Machine at the speed of 1mm/min with 120Kg. The specimen removed from the mold was stored in the room temperature for a week. This specimen was polished with the emery papers from #100 to #200 and finally on the polishing cloth with 0.06${\mu}Al_2O_3$ powder suspended in water. The specimen was placed on the Instron testing machine in the method similar to the diametral tensile test and loaded at the crosshead speed of 0.05mm/min. The load was stopped short of fracture. The cracks on the polished surface of specimen was examined with scanning electron microscope (JSM-35) and analyzed by EPMA (Electron probe microanalyzer). The following results were obtained. 1. In low copper lathe-cut amalgam, the crack went through the voids and ${\gamma}_2$ phase, through the ${\gamma}_1$ phase around the ${\gamma}$ particles. 2. In low copper spherical amalgam, it was observed that the crack passed through the ${\gamma}_2$ and ${\gamma}_1$ phase, and through the boundary between the ${\gamma}_1$ and ${\gamma}$ phase. 3. In high copper dispersant (Dispersalloy) amalgam, the crack was found to propagate at the interface between the ${\gamma}_1$ matrix and reaction ring around the dispersant (Ag-Cu) particles, and to pass through the Ag-Sn particles. 4. In high copper single composition (Tytin) amalgam, the crack went through the ${\gamma}_1$ matrix between ${\eta}$ crystals, and through the unreacted alloy particle (core).

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.93-99
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• 2004

At present, LG Electronics pushes ahead to eliminate the Pb(Lead) -a hazardous material- from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C-+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• 한국의류학회지
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• 제37권6호
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• pp.764-771
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• 2013

The metal component of Chinese and Korean traditional gold thread was analyzed nondestructively using P-XRF and classified morphologically. In the nondestructive analysis of 22 Chinese and Korean artifacts, there were 10 gold threads made up of Au in China and 7 in Korea; in addition, there were 4 silver threads made up of Ag in Korea and 1 copper thread made up of Cu in China. In the morphological classification, 7 gilt paper strips were confirmed in China and Korea and 4 wrapped threads were identified in China and Korea. Zn, Sn and Fe (minor components of the threads) were detected. These components were assumed to be transferred from the metal found in burial goods.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.244-249
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• 2004

In this paper, shielding effectiveness(SE) of the shielding paint of electromagnetic(EM) waves was investigated with actual experiments. The shielding paint used in this study were made of powder of conductive materials - Ag, Cu, Al, Sn, Ni. Cr, Graphite and Charcoal etc. with a solubility in oil and water. Also, the paper was used as a base sheet. The experiment was carried out by using a shielding evaluator(Shielding box) TR17302 with an ADVANTEST spectrum analyzer, model R3361C. It was found from the experimental results that silver, copper, nickel were good candidates as a shielding material against the EM waves with increasing the SE as the composite was laminated. The characteristics of the SE against the EM waves depended on a mode of preparation of specimen. The effects of density of particles on the SE were studied about the EM shielding paint. The SE strongly depended on the electric resistance by density of painting particles. SE increased as the density of particles was increasing.

• 한국생산제조학회지
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• 제23권3호
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• pp.237-242
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• 2014

Recently much research are has been done into the compositions of lead-free solders. As a result, there has been a rapid increase in the number of new compositions. In the past, the properties of these new compositions were determined and verified through drop-impact tests. However, these drop tests were expensive and it took a long time to obtain a result. The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2010년도 춘계학술발표대회 초록집
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• pp.77-77
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• 2010

본 연구에서는 Sn-3.0Ag-0.5Cu (SAC305) 무연솔더의 최적 인쇄성을 위한 PCB 및 마스크설계, 스크린프린팅 공정변수의 최적값을 실험계획법을 통해 평가하였다. 사용된 칩은 가로 0.4mm 세로 0.2mm의 0402 MLCC칩이며, 사용된 시험보드는 OSP 표면처리된 PCB이었다. 인쇄성을 판단하기 위한 공정인자는 금속마스크 두께, 마스크홀 크기, 패드크기 및 모양, 인쇄각도, 인쇄속도, 판분리속도이었다. ANOVA분석을 통해 주인자를 파악하였으며, 인쇄성에 영향을 미치는 주인자는 마스크두께와 인쇄각도임이 확인되었다. 그 후 중심 합성법을 이용하여 인쇄성 최적 조건을 확인하였다. 결과로 나타난 등고선/표면도를 통해, 마스크두께가 작을 때에는 인쇄각도가 작아야 높은 인쇄성을 갖으며, 또한 마스크 두께가 클 경우에는 인쇄각도가 커야 높은 인쇄성을 가짐을 알 수 있었다. 추가실험을 통해서 인쇄성 표면도의 정확도를 확인하였으며, 실험값은 표면도에서 표시된 인쇄성값과 비슷함을 알 수 있었다. 또한, 인쇄성이 낮은 영역과 높은 영역에서 접합강도값을 측정하였으며, 인쇄성이 좋은 영역에서 접합강도도 높음을 알 수 있었다.

• Journal of Welding and Joining
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• 제27권1호
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• pp.85-89
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• 2009

Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengos were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under $5^{\circ}$ and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.

• 한국광물학회지
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• 제24권3호
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• pp.245-252
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• 2011

콜롬비아는 안데스 산맥의 북단에 위치하며 NS 방향의 단층대를 기준으로 지질 환경의 차이가 크다. 단층대를 기준으로 동부지역은 원생대 변성암류와 이를 피복하는 고생대 변성퇴적암류가 주로 분포하며, 서부 지역은 고생대 퇴적암류, 중생대 화성암류, 제 3 기 화산양류 및 퇴적암류가 주로 분포한다. 지화학이상대는 6개 그룹으로 분류되며, 철 (Fe), 귀금속(Au, Ag, Pt), 기초금속(Cu, Pb, Zn), 희유금속(Sn, Cr, Co, Mn, Mo, Ni, Nb, W, V, Mg, Ti, Be, REE, Ga, Zr, Hf, Se, Te, Ta, Cd, In, Li 등) 빛 핵원료자원인 U 이상대로 구성된다. 콜롬비아의 주요 부존자원은 석탄, 니켈, 금 및 에메랄드이다. 에메랄드, 석탄 및 니켈은 세계적인 매장규모와 생산량을 보인다. 콜롬비아는 탐사가 거의 수행되지 않은 지역이 전 국토의 49%에 달해 광물부존 잠재성은 현재보다 크게 높을 것으로 보인다. 따라서 최근 콜롬비아와의 광물자원 협력이 강화되고 있는 시점에서 미탐사 지역을 대상한 공동탐사를 지화학 이상대가 확인된 지역을 중심으로 수행하여 신규광체를 확보하고, 광물자원 협력을 강화함으로써 공동개발 여건을 마련할 필요가 있다고 판단된다.