• 마이크로전자및패키징학회지
• /
• 제8권1호
• /
• pp.45-51
• /
• 2001

UBM층과의 젖음 특성 및 표면 산화정도가 미세 피치를 갖는 저 융점 솔더 범프의 볼 형성에 미치는 영향을 연구하였다. Au/Cu/Cr 과 Au/Ni/Ti UBM 위에 공정 조성에 가까운 In-Ag와 공정 조성의 Bi-Sn 솔더를 솔더 층의 증착 순서를 달리하여 증발 증착한 후 lift-off 공정과 열처리 공정을 사용하여 솔더 범프를 형성하였다. In-Ag솔더의 경우 In이 UBM 층과 접한 범프가, 또한 Bi-Sn 솔더의 경우 Sn을 먼저 UBM층위에 먼저 증착시켜 리플로 한 범프가 솔더 볼 형성 경향이 다른 범프에 비해 높았다. 구형의 솔더 범프 형성 정도는 UBM 층과의 젖음 특성에 따라 크게 달라졌다.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2004년도 춘계 학술발표대회 개요집
• /
• pp.81-83
• /
• 2004

최근 대두되고 있는 환경오염문제로 인해 전자산업에서는 전 세계적으로 Pb 솔더에 관한 규제가 진행중에 있다. 이에 Pb free 솔더에 관한 연구가 활발히 진행 중에 있으며 그 중 Sn-Ag계 solder는 유력한 대체 solder로 대두되고 있다. (중략)

• 대한금속재료학회지
• /
• 제46권1호
• /
• pp.26-32
• /
• 2008

Examination of two bronze vessels supposedly from the Koryo dynasty revealed that they consist of bowls and stands that are fixed together using rivet joints made of Cu-Ag alloys. The bowls and stands were forged out of unleaded bronze alloys of approximately 22 weight % Sn before being quenched from the ${\alpha}+{\beta}$ region of the Cu-Sn phase diagram. This specific alloy and the thermo-mechanical treatment constitute two key elements of the unique technical tradition called Bangcha (방짜) that has long been established in Korea. The high Sn content ensures better casting and the thermal treatment causes the brittle ${\delta}$ phase to be avoided in forging as well as in services. The experiment on the laboratory Cu-Ag alloys of varying Ag contents suggested that the Cu-Ag system was the best choice of materials for the rivets at the time in view of their color, availability, ductility and low melting points.

• 한국재료학회지
• /
• 제25권3호
• /
• pp.125-131
• /
• 2015

Fluorine-doped $SnO_2$ (FTO) thin film/Ag nanowire (NW) double layers were fabricated by means of spin coating and ultrasonic spray pyrolysis. To investigate the optimum thickness of the FTO thin films when used as protection layer for Ag NWs, the deposition time of the ultrasonic spray pyrolysis process was varied at 0, 1, 3, 5, or 10 min. The structural, chemical, morphological, electrical, and optical properties of the double layers were examined using X-ray diffraction, X-ray photoelectron spectroscopy, field-emission scanning electron microscopy, transmission electron microscopy, the Hall effect measurement system, and UV-Vis spectrophotometry. Although pure Ag NWs formed isolated droplet-shaped Ag particles at an annealing temperature of $300^{\circ}C$, Ag NWs covered by FTO thin films maintained their high-aspect-ratio morphology. As the deposition time of the FTO thin films increased, the electrical and optical properties of the double layers degraded gradually. Therefore, the double layer fabricated with FTO thin films deposited for 1 min exhibited superb sheet resistance (${\sim}14.9{\Omega}/{\Box}$), high optical transmittance (~88.6 %), the best FOM (${\sim}19.9{\times}10^{-3}{\Omega}^{-1}$), and excellent thermal stability at an annealing temperature of $300^{\circ}C$ owing to the good morphology maintenance of the Ag NWs covered by FTO thin films.

• Journal of Welding and Joining
• /
• 제35권3호
• /
• pp.7-14
• /
• 2017

The effect of high temperature-moisture on corrosion and mechanical properties for Sn-0.7Cu, Sn-3.0Ag-0.5Cu (SAC305) solders on flexible substrate was studied using Highly Accelerated Temperature/Humidity Stress Test (HAST) followed by three-point bending test. Both Sn-0.7Cu and SAC305 solders produced the internal $SnO_2$ oxides. Corrosion occurred between the solder and water film near flexible circuit board/copper component. For the SAC305 solder with Ag content, furthermore, octahedral corrosion products were formed near Ag3Sn. For the SAC305 and Sn-0.7Cu solders, the amount of internal oxide increased with the HAST time and the amount of internal oxides was mostly constant regardless of Ag content. The size of the internal oxide was larger for the Sn-0.7Cu solder. Despite of different size of the internal oxide, the fracture time during three-point bending test was not significantly changed. It was because the bending crack was always initiated from the three-point corner of the chip. However, the crack propagation depended on the oxides between the flexible circuit board and the Cu chip. The fracture time of the three-point bending test was dependent more on the crack initiation than on the crack propagation.

• 대한치과기공학회지
• /
• 제24권1호
• /
• pp.65-71
• /
• 2002

This study was performed to observe the microhardness change of the surface and the bonding strength between the porcelain and alloy specimens in order to investigate the effects of appended indium, tin and copper on interfacial properties of Au-Pd-Ag alloys. The hardness of castings was measured with a micro-Vicker's hardness tester. The interfacial shear bonding strength between alloy specimen and fused porcelain was measured with a mechanical testing system(MTS 858.20). The microhardness of Au-Pd-Ag alloy was increased by adding indium and tin, but not increased by adding copper. The shear bonding strength of Au-Pd-Ag-Sn alloy and Au-Pd-Ag-Cu alloy showed 87MPa, 57MPa. The higher concentration of adding elements showed the higher shear bonding strength.

• 한국기후변화학회지
• /
• 제7권3호
• /
• pp.231-236
• /
• 2016

Electrocatalytic reduction can produce useful chemicals and fuels such as carbon monoxide, methane, formate, aldehydes, and alcohols using carbon dioxide, the green house gas, as a reactant through the supply of electrical energy. In this study, tin-lead (Sn-Pb) alloy electrodes are fabricated by electrodeposition on a carbon paper with different alloy composition and used as cathode for electrocatalytic reduction of carbon dioxide into formate in an aqueous system. The prepared electrodes are measured by Faradaic efficiency and partial current density for formate production. Electrocatalytic reduction experiments are carried out at -1.8 V (vs. Ag/AgCl) using H-type cell under ambient temperature and pressure and the gas and liquid products are analyzed by gas chromatograph and liquid chromatograph, respectively. As results, the Sn-Pb electrodes show higher Faradaic efficiency and partial current density than the single metal electrode. The Sn-Pb alloy electrode which have Sn:Pb molar ratio=2:1, shows the highest Faradaic efficiency of 88.7%.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2006년 추계학술발표대회 개요집
• /
• pp.181-183
• /
• 2006

This paper studies the mechanical behaviors of Sn-3.5Ag solder joint against substrate(such as Au/Ni/Cu, Au/cu, Ni/Cu and Cu pad) after induction heating, a new soldering method. It was found that the solder bump formation depends on the time and current of the induction heating system. Also the heating value of the solder bump were found to vary with respect to the thermal conductivity of the pads on the substrate. In case of Au/Ni/Cu pad and Au/Cu pad, solder bump's shear strength were high for the heating time of $1.5{\sim}2sec$. For Ni/Cu pad, solder bump's shear strength were found to increase with time increment.

• 한국자동차공학회논문집
• /
• 제22권3호
• /
• pp.90-96
• /
• 2014

The conventional SnPb solders were widely used for several decades in the electronic packing system due to the superior mechanical properties such as low melting point, better wettavility and good mechanical fatigue. However, in recent years, owing to adverse effect on the human health and environment, conventional SnPb solders have been replaced by Lead-free solders. In this research, the shear punch(SP) test of Sn-4Ag-(Cu)/Ni pad was performed. Pb-free solder alloys which are the environmentally friendly of the electronic components were performed at $150^{\circ}C$ for 100hr~1000hr to artificial aging processing. In order to evaluate the mechanical properties of solder joints, the SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of almost the whole specimens was decreased with the increase in aging time and temperature of SP test. The mechanical properties of Sn-4Ag-0.5Cu solder were most excellent in all Pb-free solder which were produced by the SP test at $30^{\circ}C$.

• 대한치과재료학회지
• /
• 제43권4호
• /
• pp.343-349
• /
• 2016

This experiment was carried out to examine whether the post-firing heat treatment is effective in increasing the hardness of metal-ceramic alloy of the Pd-Au-Ag-Sn system. Precipitation hardening by holding at $600^{\circ}C$ after simulated complete porcelain firing in a metal-ceramic alloy of the Pd-Au-Ag-Sn system was examined by observing the change in hardness, crystal structure, and microstructure using a hardness test, X-ray diffraction (XRD), and field emission scanning electron microscopy (FE-SEM). The hardness of the alloy increased apparently by holding the specimen at $600^{\circ}C$ for 30 min after simulated complete porcelain firing. The formation of fine grain interior precipitates during holding at $600^{\circ}C$ caused the formation of lattice strain in the grain interior, resulting in apparent hardening. The faster cooling rate (stage 0) during simulated complete porcelain firing resulted in more effective precipitation hardening during holding at $600^{\circ}C$. From the above results, an appropriate post-firing heat treatment, such as holding at $600^{\circ}C$ for 30 min after complete porcelain firing may increase the durability of metal-ceramic prostheses composed of Pd-Au-Ag-Sn alloy.