• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.4
• /
• pp.11-17
• /
• 2010

The electromigration phenomenon in lead-free flip-chip solder joint has been one of the serious problems. To understand the mechanism of this phenomenon, the crystallographic orientation of Sn grain in the Sn-Ag-Cu solder bump has been analyzed. Different time to failure and different microstructural changes were observed in the all test vehicle and bumps, respectively. Fast failure and serious dissolution of Cu electrode was observed when the c-axis of Sn grain parallel to electron flow. On the contrary of this, slight microstructural changes were observed when the c-axis of Sn perpendicular to electron flow. In addition, underfill could enhance the electromigration reliability to prevent the deformation of solder bump during EM test.

• Journal of Welding and Joining
• /
• v.30 no.2
• /
• pp.65-69
• /
• 2012

Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000Hz frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound ($Cu_6Sn_5$) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.

• Journal of Korea Multimedia Society
• /
• v.13 no.11
• /
• pp.1687-1697
• /
• 2010

The USIM-based AKA authentication process is essential to a mobile payment system on smart phone environment. In this paper a payment protocol and an AKA module are designed for mobile payment system which is suitable for openness smart phone environment. The payment protocol designs the cross authentication among components of the mobile payment system to improve the reliability of the components. The AKA module of mobile payment system based on 3GPP-AKA protocol prevents the exposure of IMSI by creating the SSK(Shared Secure Key) through advance registration and solves the SQN(SeQuence Number) synchronization problem by using timestamp. Also, by using the SSK instead of authentication vector between SN and authentication center, the existing bandwidth $(688{\times}N){\times}R$ bit between them is reduced to $320{\times}R$ bit or $368{\times}R$ bit. It creates CK and IK which are message encryption key by using OT-SSK(One-Time SSK) between MS and SN. In addition, creating the new OT-SSK whenever MS is connected to SN, it prevents the data replay attack.

• Journal of the Microelectronics and Packaging Society
• /
• v.27 no.3
• /
• pp.29-34
• /
• 2020

The behavior of brittle fracture of electroless nickel immersion gold (ENIG) /Sn-3.0wt.%Ag-0.5wt.%Cu (SAC305) solder joints was evaluated. The pH of the electroless nickel plating solution for ENIG surface treatment was changed from 4.0 to 5.5. As the pH of the Ni plating solution increased, pin hole in the Ni-P layer increased. The thickness of the interfacial intermetallic compound (IMC) of the solder joint increased with pH of Ni plating solution. The high speed shear strength of the SAC305 solder joint on ENIG surface finish decreased with the pH of the Ni plating solution. In addition, the brittle fracture rate of the solder joint was the highest when the pH of the Ni plating solution was 5.

• Journal of the Korean institute of surface engineering
• /
• v.50 no.6
• /
• pp.510-515
• /
• 2017

In this study, a transient liquid phase sintering (TLPS) process of Ag pastes mixed with a fusible metal alloy of Bi58Sn42 with the melting temperature of $138^{\circ}C$, was examined. After screen printing of the Ag pastes with and without Bi58Sn42 powders on polyimide (PI) substrates, the electrodes were heat-treated at different temperatures in the range between 150 and $300^{\circ}C$ for 60 min in air. Comparing the electrical conductivity of the Ag pastes with and without Bi58Sn42 alloy powder after the heat treatment, it was manifested that the low melting temperature alloy definitely played a major role in an increased conductivity when it is added into the Ag pastes by providing more electrical conduction paths between Ag particles. This can be explained by the fact that capillary force of the melts of Bi58Sn42 can contribute to the rearrangement of the Ag particles during the heat-treatment inducing better connectivity between the Ag particles.

• The Bulletin of The Korean Astronomical Society
• /
• v.44 no.1
• /
• pp.40.3-40.3
• /
• 2019

There is growing evidence for the dependence of Type Ia supernova (SN Ia) luminosities on the environments. The origin of this correlation, however, is under debate. In order to explore the physical origin of the trend in detail, we analyze SN Ia light-curves by combining a sample of 1231 SNe Ia over a wide redshift range (0.01 < z < 1.37) in various SN surveys and employing two independent light-curve fitters of SALT2 and MLCS2k2. Although SALT2 is the most widely used fitter in the SN community, MLCS2k2 has a novelty in the context of an investigation of the luminosity evolution of SNe Ia. For this reason we use both fitters and analyze them separately. We also determine a stellar mass and a star formation rate (SFR) for a sample of ~600 host galaxies. In addition, because recent low-redshift studies suggest that this dependence manifests itself most strongly when using the local SFR at the SN location, we introduce a new method to infer the local environments by restricting the SN Ia sample in globally star-forming host galaxies to a low-mass host galaxy subset (${\leq}10^{10}M_{\odot}$). We find that SNe Ia in low-mass and star-forming host galaxies are fainter than those in high-mass and passive hosts, after light-curve corrections. Especially, for the first time in host studies, we show that SNe Ia in locally star-forming environments are $0.081{\pm}0.018$ mag fainter ($4.5{\sigma}$) than those in locally passive environments from the sample including SNe at the high-redshift range. Considering the significant difference in the mean stellar population age between these environments, the result would suggest that the origin of the environmental dependence is the luminosity evolution of SNe Ia.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.39 no.5
• /
• pp.467-471
• /
• 2015

Thus far, solders used in electronics remain lead-based. Pb-free solutions in electronic components and systems are receiving increased attention in the semiconductor and electronics industries. Pb-free materials currently in used are Sn-37Pb, Sn-4Ag and Sn-4Ag-0.5Cu/Ni plate joints. In this study, solder alloys were used at high temperatures for artificial aging processing that was performed at $150^{\circ}C$ for 0hr, 100hr, 200hr, 400hr, 600hr and 1000hr. The SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of all the specimens decreased with the increase in artificial aging time and temperature of the SP test. In addition, Pb-free solders showed higher total fracture energy compared with Sn-37Pb at high temperatures. The mechanical properties of Sn-4Ag-0.5Cu solder/Ni plate joints remained in excellent conditions in electronic parking systems at high temperatures.

• Korean Journal of Radiology
• /
• v.22 no.11
• /
• pp.1777-1785
• /
• 2021

Objective: To investigate the accuracy of the Agatston score obtained with the ultra-high-pitch (UHP) acquisition mode using tin-filter spectral shaping (Sn150 kVp) and a kVp-independent reconstruction algorithm to reduce the radiation dose. Materials and Methods: This prospective study included 114 patients (mean ± standard deviation, 60.3 ± 9.8 years; 74 male) who underwent a standard 120 kVp scan and an additional UHP Sn150 kVp scan for coronary artery calcification scoring (CACS). These two datasets were reconstructed using a standard reconstruction algorithm (120 kVp + Qr36d, protocol A; Sn150 kVp + Qr36d, protocol B). In addition, the Sn150 kVp dataset was reconstructed using a kVp-independent reconstruction algorithm (Sn150 kVp + Sa36d, protocol C). The Agatston scores for protocols A and B, as well as protocols A and C, were compared. The agreement between the scores was assessed using the intraclass correlation coefficient (ICC) and the Bland-Altman plot. The radiation doses for the 120 kVp and UHP Sn150 kVp acquisition modes were also compared. Results: No significant difference was observed in the Agatston score for protocols A (median, 63.05; interquartile range [IQR], 0-232.28) and C (median, 60.25; IQR, 0-195.20) (p = 0.060). The mean difference in the Agatston score for protocols A and C was relatively small (-7.82) and with the limits of agreement from -65.20 to 49.56 (ICC = 0.997). The Agatston score for protocol B (median, 34.85; IQR, 0-120.73) was significantly underestimated compared with that for protocol A (p < 0.001). The UHP Sn150 kVp mode facilitated an effective radiation dose reduction by approximately 30% (0.58 vs. 0.82 mSv, p < 0.001) from that associated with the standard 120 kVp mode. Conclusion: The Agatston scores for CACS with the UHP Sn150 kVp mode with a kVp-independent reconstruction algorithm and the standard 120 kVp demonstrated excellent agreement with a small mean difference and narrow agreement limits. The UHP Sn150 kVp mode allowed a significant reduction in the radiation dose.

• Proceedings of the Korean Nuclear Society Conference
• /
• 1999.05a
• /
• pp.240-240
• /
• 1999

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2002.11a
• /
• pp.167-167
• /
• 2002