• Journal of the Korean Electrochemical Society
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• v.10 no.2
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• pp.88-93
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• 2007

Nano-sized Sn particles were coated with Ni-P layer using an electroless deposition method and their anodic performance was tested for lithium secondary batteries. Uniform coating layers were obtained, of which the thickness was controlled by varying the $Ni^{2+}$ concentration in the plating bath. It was found that the Ni-P layer plays two important roles in improving the anodic performance of Sn powder electrode. First, it prevents the inter-particle aggregation between Sn particles during the charge/discharge process. Second, it provides an electrical conduction pathway to the Sn particles, which allows an electrode fabrication without an addition of conductive carbon. A pseudo-optimized sample showed a good cyclability and high capacity ($>400mAh\;g^{-1}$) even without conductive carbon loading.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.94-98
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• 2003

The microstructure of Sn1.8Bi0.8Cu0.6In alloys was evaluated at various aging time. The bumps of Sn1.8Bi0.8Cu0.6In alloys after reflowed at $250^{\circ}C$ were well-formed and had 260um height. The craters on the bumps, however, were observed. Intermetallic compounds formed on the interface between so]der and Cu/Ni UBM were consist of $(Cu,Ni)_6Sn_5$. As aging goes on up to 1000hours, the composition of Ni changed from $6.63\%$ at initial stage(as-reflowed) to $13.47\%$ at final stage(1000hours aging ). In addition, after 500hours aging, the floating of IMC to the solder was observed.

• Journal of Korea Foundry Society
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• v.23 no.5
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• pp.286-290
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• 2003

본 연구에서는 Ni-Zr-Ti의 3원계 합금을 기본으로 하여, Si 및 Sn 등의 원소를 첨가하여 Ni-rich 영역에서 벌크 비정질 합금을 제조하였다. $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ 조성의 합금에서 injection casting에 의하여 약 58 K의 과냉각액상영역을 가지고 있는 직경 3 mm의 벌크 비정질 시편을 제조하였다. 이러한 우수한 비정질 형성능은 액상온도의 저하로 인해 낮은 온도까지 액상이 쉽게 과냉되기 때문인 것으로 사료된다. $Ni_{59}Zr_{20}Ti_{16}Si_5$ 합금은 두 단계에 걸쳐 결정화가 일어나는 반면, $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ 합금은 단일 단계에 의해 orthorhombic $Ni_{10}{(Zr,Ti)}_7$ 결정상과 cubic NiTi 결정상으로 결정화가 일어난다. 벌크 비정질 $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ 합금의 경우 압충강도는 2.7 GPa, 연신율은 약 2% 정도의 값을 가진다.

• Journal of Technologic Dentistry
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• v.21 no.1
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• pp.43-53
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• 1999

The mechannical properties and corrosion resistance of alloy added commercially pure titanium for dental implants have been investigated. Ti, To-65Zr, Ti-10.1Ta and Ti-17Sn alloys were melthed in arc furnace and the corrosion resistance of Ti alloys was evaluated by anodic polarization test. The microstructure and mechanical properties of Ti alloy were analysed by optical micrograph. hardness tester and instron. In isothermal test, Ti-10.1Ta and Ti-17Sn alloys exhibited the best oxidation resistance below $1100^{\circ}C$. Ti65Zr, Ti-10.1Ta and Ti-17Sn alloys showed better rockwell hardness compared with commercially pure. Ti As the result of the anodic polarization test in 5%HCl, it 5%HCl, it was known knows that Ti-65Zr, alloy showed a rapid decrease in current density at higher potenial in comparision with other Ti alloys.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.81-88
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• 2019

In this study, the effects of graphene oxide (GO) addition on electromigration (EM) lifetime of Sn-3.0Ag-0.5Cu Pb-free solder joint between a ball grid array (BGA) package and printed circuit board (PCB) were investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of package side finished with electroplated Ni/Au, while $Cu_6Sn_5$ IMC was formed at the interface of OSP-treated PCB side. Mean time to failure of solder joint without GO solder joint under $130^{\circ}C$ with a current density of $1.0{\times}10^3A/cm^2$ was 189.9 hrs and that with GO was 367.1 hrs. EM open failure was occurred at the interface of PCB side with smaller pad diameter than that of package side due to Cu consumption by electrons flow. Meanwhile, we observed that the added GO was distributed at the interface between $Cu_6Sn_5$ IMC and solder. Therefore, we assumed that EM reliability of solder joint with GO was superior to that of without GO by suppressing the Cu diffusion at current crowding regions.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.105-105
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• 2005

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.05a
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• pp.158-158
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• 1996

• Korean Journal of Materials Research
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• v.8 no.9
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• pp.813-818
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• 1998

Ultrafine powders of $\textrm{In}_{2}\textrm{O}_{3}$-doped $\textrm{SnO}_{2}$ were synthesized by a coprecipitation method and the effects of pH value and the amount of In2Q addition on particle size were investigated. The influence of pH value on particle size could be negligible, whereas the amount of $\textrm{In}_{2}\textrm{O}_{3}$ has influenced on particle size and specific surface area. The gas sensitivity to hydrocarbOn($\textrm{C}_{3}\textrm{H}_{8}$, $\textrm{C}_{4}\textrm{H}_{10}$) increased with $\textrm{In}_{2}\textrm{O}_{3}$ addition and reached a maximum at 3wt.% addition. From the results of impedance analysis and I-V characteristics. it was showed that the agglomeration structure of particles and the boundaries between agglomerates were the important factors to determine the gas sensing mechanism.

• Journal of Welding and Joining
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• v.32 no.1
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• pp.66-70
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• 2014

In Ti active brazing of YSZ to STS 430 using Ag-Cu Filler Metal, the effect of Ti contents on the shear bonding strength were investigated together with the effect of brazing temperature and holding time. The addition of Ti in Ag-Cu Filler Metal increased the bonding strength up to 4.68% Ti, followed by the decrease with further addition. This seems to be caused by formation of TixOy at the reaction layer. Brazing temperature was optimized at $960^{\circ}C$ among a given temperature ranges. The addion of Sn to Ag-Cu filler metal brought the decrease of its melting temperature its melting temperature without a significant decrease of bonging strength.

• Journal of the Korean institute of surface engineering
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• v.36 no.1
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• pp.34-41
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• 2003

Effects of additives and plating conditions of high speed electroplating were investigated. The Sn content in electrodeposit was highly decreased with increasing current density from $10A/dm^2$ to $50A/dm^2$, and the current efficiency on the cathode was decreased. The carbon content in the electrodeposit was decreased with increasing current density from $10A/dm^2$ to $30A/dm^2$, however the carbon content was highly increased in the range of $40A/dm^2$$∼50A/dm^2$. The formation of tetravalent tin and stannic oxide sludge was prevented by the addition of gallic acid in the bath. The changing of Sn content in the electrodeposit is caused by the addition of gallic acid.