• The Korean Journal of Ceramics
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• 제6권1호
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• pp.15-20
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• 2000

Thick inorganic-organic hybrid films were prepared on ITO-coated glass substrates by the electrophoretic sol-gel deposition of polyphenylsilsesquioxane particles. The morphology of the deposited films changed from the aggregate of the spherical particles to monolith by heat treatment at temperatures higher than $200^{\circ}C$. Transparency of the films was significantly improved accompanied by the morphological change of the particles. The degree of the morphological change was governed by two factors; maximum heat treatment temperature and heating rate. Transparent thick films of ca. 3$\mu\textrm{m}$ in thickness were obtained only by heat treatment at $400^{\circ}C$ for 2h with rapid heating from room temperature to $400^{\circ}C$. These films obtained were strongly adhered to the ITO-coated glass substrates and has a very smooth surface.

• Animal cells and systems
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• 제3권4호
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• pp.407-412
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• 1999

The influence of eating habits and food type on the ultrastructural characteristics of the digestive tracts was studied under the scanning and transmission electron microscopes in two crustacean decapods (Hemigrapsus penicillatus De Haan; mud crab, Pinnotheres cyclinus Shen; symbiotic crab). The relative ratio of the length of midgut versus hindgut was 1:1 in the mud crab, but 4:1 in the symbiotic crab. Observation through the scanning electron microscope revealed that the midguts of both species have densely-arranged longitudinal mucosal folds with a smooth surface. In the hindgut of the mud crab, mucosal folds were longitudinally oriented, clusters of two to five spines were observed on the cuticular surface, and the length of the spine in the distal hindgut was longer than that in the proximal portion. In the symbiotic crab, the mucosal folds were irregulary arranged, and numerous rudimentary spinal structures were noted on the cuticular surface. Through observation of a transmission electron microscope, the epithelial cells of the midgut in both species had numerous microvilli, but the length of the microvilli was slightly longer in the mud crab than in the symbiotic crab. The central layer of the basement membrane and the muscular layer of the midgut were more developed in the mud crab than in the symbiotic crab. The thickness of the cuticular layer over the hindgut surface in the mud crab was about 4 times than that of the symbiotic crab.

• 한국생활과학회지
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• 제24권2호
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• pp.285-295
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• 2015

To identify optimized thermal properties of mold brassiere cup for improved thermal comfort during summer, we compared the thermal resistance and the water vapor permeability of Polyurethane (PU) foam, 3D spacer fabric and the two combined materials of the PU foam and the 3D spacer fabric. Four experimental mold brassieres were made of the materials for wearing test. Six women in their twenties evaluated the wearing sensation in the hot and humid environment. The changes in microclimate temperature and humidity while wearing test brassiere cups were measured. Results indicate that thermal resistance increased as more PU foam were combined, while the water vapor permeability was higher as the content of the 3D spacer fabric increased at thickness of 18mm and over. However, in the wear test, the PU foam brassiere was the most preferred in all ambient conditions due to its soft, flexible and smooth texture, despite its high thermal resistance and low water vapor permeability. This indicates that the textures of mold foams are more dominant properties than thermal properties for mold foams in determining the wear comfort of mold brassieres.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.242.2-242.2
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• 2014

Plasma-polymer thin films (PPTF) have been deposited on a Si(100) wafer and glass under several conditions such as different RF power by using plasma-enhanced chemical vapor deposition (PECVD) system. Ethylcyclohexane, ammonia gas, hydrogen and argon were utilized as organic precursor, doping gas, bubbler gas and carrier gases, respectively. PPTFs were grown up with RF (ratio frequency using 13.56 MHz) powers in the range of 20~60 watt. PPTFs were characterized by FT-IR (Fourier Transform Infrared), FE-SEM (Scanning Electron Microscope), AFM (Atomic Force Microscope), Contact angle and Probe station. The result of FT-IR measurement showed that the PPTFs have high cross-link density nitrogen doping ratio was also changed with a RF power increasing. AFM and FE-SEM also showed that the PPTFs have smooth surface and thickness. Impedance analyzer was utilized for the measurements of C-V curves having different dielectric constant as RF power.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.292-292
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• 2014

Wide band gap semiconductors, such as III-nitrides (GaN, AlN, InN, and their alloys), SiC, and diamond are expected to play an important role in the next-generation electronic devices. Specifically, GaN-based high electron mobility transistors (HEMTs) have been targeted for high power, high frequency, and high temperature operation electronic devices for mobile communication systems, radars, and power electronics because of their high critical breakdown fields, high saturation velocities, and high thermal conductivities. For the stable operation, high power, high frequency and high breakdown voltage and high current density, the fabrication methods have to be optimized with considerable attention. In this study, low ohmic contact resistance and smooth surface morphology to AlGaN/GaN on 2 inch c-plane sapphire substrate has been obtained with stepwise annealing at three different temperatures. The metallization was performed under deposition of a composite metal layer of Ti/Al/Ni/Au with thickness. After multi-layer metal stacking, rapid thermal annealing (RTA) process was applied with stepwise annealing temperature program profile. As results, we obtained a minimum specific contact resistance of $1.6{\times}10^{-7}{\Omega}cm2$.

• Journal of Welding and Joining
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• 제17권4호
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• pp.26-31
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• 1999

An attempt was made in this study to investigate the brazing characteristics of Zr-Be binary amorphous alloys for the development of a new brazing filler metal for joining Zircaloy-4 nuclear fuel cladding tubes. This study was also aimed at the feasibility study of rapidly solidified amorphous alloys to substitute the conventional physical vapor-deposited(PVD) metallic beryllium. The $Zr_{1-x}Be_{x}$($0.3\leq$x$\leq0.5$) binary amorphous alloys were produced in the ribbon form by the melt-spinning method. It was confirmed by x-ray diffraction that the ribbons were amorphous. The amorphous. the amorphous alloys were used to join bearing pads on Zircaloy-4 nuclear fuel cladding tubes. Using Zr-Be amorphous alloys as filler metals, it was found that the reduction in the tube wall thickness caused by erosion was prevented. Especially, in the case of using $Zr_{0.65}Be_{0.35}$ and $Zr_{0.7}Be_{0.3}$ amorphousalloys, the smooth and spherical primary $\alpha$-Zr particles appeared in the brazed layer, which was the most desirable microstructure from the corrosion-resistance standpoint.

• 신재생에너지
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• 제6권4호
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• pp.50-60
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• 2010

With the development of wind industry, rated power of the wind turbine also increases gradually. Accordingly, size of the wind turbine tower is becoming larger. Tower base diameter of the 2MW wind turbine is about 4m. Larger tower is expected for 4MW or 5MW turbines. Due to limitation of transportation, new type of tower with smooth transportation and effective cost is needed. In this work, a hybrid tower consisting of steel and concrete is designed and analyzed. The optimum ratio of steel and concrete of the hybrid tower is calculated as well as the thickness of the concrete part. Different FE analysis including modal analysis, buckling analysis and static analysis are performed to check the design of hybrid tower comparing with the steel tower. Redesign is also expected after various analyses.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.188-188
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Meta Oxide Semiconductor) based electronic devices, the electronic devices, become much faster and smaller size that are promising property of semiconductor market. However, very narrow interconnect line width has some disadvantages. Deposition of conformal and thin barrier is not easy. And metallization process needs deposition of diffusion barrier and glue layer for EP/ELP deposition. Thus, there is not enough space for copper filling process. In order to get over these negative effects, simple process of copper metallization is important. In this study, Cu-V alloy layer was deposited using of DC/RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane SiO2/Si bi-layer substrate with smooth surface. Cu-V film's thickness was about 50 nm. Cu-V alloy film deposited at $150^{\circ}C$. XRD, AFM, Hall measurement system, and AES were used to analyze this work. For the barrier formation, annealing temperature was 300, 400, $500^{\circ}C$ (1 hour). Barrier thermal stability was tested by I-V(leakage current) and XRD analysis after 300, 500, $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However vanadium-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Therefore thermal stability of vanadium-based diffusion barrier is desirable for copper interconnection.

• Nuclear Engineering and Technology
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• 제33권2호
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• pp.241-253
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• 2001

Under severe accidents, the pressure and temperature response has an important role for the integrity of a nuclear power plant containment. The history of the pressure and temperature is characterized by the amount and state of steam/air mixture in a containment. Recently, the heat transfer rate to the structure surface is supposed to be increased by the wavy interface formed on condensate film. However, in the calculation by using CONTAIN code, the condensation heat transfer on a containment wall is calculated by assuming the smooth interface and has a tendency to be underestimated for safety. In order to obtain the best- estimate heat transfer calculation, we investigated the condensation heat transfer model in CONTAIN 1.2 code and adopted the new forced convection correlation which is considering wavy interface. By using the film tracking model in CONTAIN 1.2 code, the condensate film is treated to consider the effect of wavy interface. And also, it was carried out to investigate the effect of the different cell modelings - 5-cell and 10-cell modeling - for KNGR(Korean Next Generation Reactor) containment phenomena during a severe accident. The effect of wavy interface on condensate film appears to cause the decrease of peak temperature and pressure response . In order to obtain more adequate results, the proper cell modeling was required to consider the proper flow of steam/air mixture.

• 한국재료학회지
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• 제11권9호
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• pp.802-809
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• 2001

Electroplating is an attractive alternative deposition method for copper with the need for a conformal and conductive seed layer In addition, the Cu seed layer should be highly pure so as not to compromise the effective resistivity of the filled copper interconnect structure. This seed layer requires low electrical resistivity, low levels of impurities, smooth interface, good adhesion to the barrier metal and low thickness concurrent with coherence for ensuring void-free fill. The electrical conductivity of the surface plays an important role in formation of initial Cu nuclei, Cu nucleation is much easier on the substrate with higher electrical conductivities. It is also known that the nucleation processes of Cu are very sensitive to surface condition. In this study, copper seed layers deposited by magnetron sputtering onto a tantalum nitride barrier layer were used for electroplating copper in the forward pulsed mode. Prior to electroplating a copper film, the Cu seed layer was cleaned by plasma H$_2$ and $N_2$. In the plasma treatment exposure tome was varied from 1 to 20 min and plasma power from 20 to 140W. Effects of plasma pretreatment to Cu seed/Tantalum nitride (TaN)/borophosphosilicate glass (BPSG) samples on electroplating of copper (Cu) films were investigated.