• Title/Summary/Keyword: Slurry density

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Reclamation and Soil Improvement on Ultra Soft Soil (I) - Reclamation (초연약지반의 매립 및 지반개량 사례 연구 (I) - 매립)

  • Na, Yung-Mook;Hong, Eui;Han, Jung-Soo
    • Journal of the Korean GEO-environmental Society
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    • v.6 no.1
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    • pp.23-31
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    • 2005
  • The "Silt Pond" is 180 hectares in size and contained ultra soft slurry-like soil varying between 3 to 20 meters in thickness. Reclamation works in the Silt Pond commenced in the mid of 1990s. A considerable amount of subsurface investigation inclusive of sampling, field vane and density logging tests were carried out prior to the reclamation of the Silt Pond. Since material in the Silt Pond is extremely soft, filling was done by spreading sand with high water content in thin and equal thickness lifts, allowing the stability of the slurry-like foundation. Despite the extreme care taken, failures occurred during the sand spreading phase. A large piece of high strength geotextile measuring $900m{\times}700m$ was placed to strengthen the slurry like soil foundation at locations where the ultra-soft soil was found to be exposed. Following the remedial works, the Silt Pond was again reclaimed by sand spreading up to +4.0m CD. The success of the reclamation was confirmed by marine CPT profiling.

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Current Status of $SiC_{f}/SiC$ Composites Material in Fusion Reactor

  • Yoon, Han-Ki;Lee, Sang-Pill
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.166-171
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    • 2007
  • The characterization of monolithic SiC and SiCf/SiC composite materials fabricated by NITE and RS processes was investigated in conjunction with the detailed analysis of their microstructure and density. The NITE-SiC based materials were fabricated, using a SiC powder with average size of 30 nm. RS- SiCf/SiC composites were fabricated with a complex slurry of C and SiC powder. In the RS process, the average size of starting SiC particle and the blending ratio of C/SiC powder were $0.4\;{\mu}m$ and 0.4, respectively. The reinforcing materials for /SiC composites were BN-SiC coated Hi-Nicalon SiC fiber, unidirectional or plain woven Tyranno SA SiC fiber. The characterization of all materials was examined by the means of SEM, EDS and three point bending test. The density of NITE-SiCf/SiC composite increased with increasing the pressure holding time. RS-SiCf/SiC composites represented a great decrease of flexural strength at the temperature of $1000\;^{\circ}C.$

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The Manufacturing and Analysis of Planar Dielectric materials for Integrated LC Resonant Module (집적 LC공진 모듈용 평판 유전체의 제조와 물성)

  • Park, Woo-Young;Kim, Jong-Ryung;An, Yong-Woon;Oh, Young-Woo;Kim, Hyun-Sik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07a
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    • pp.497-501
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    • 2003
  • In order to manufacture ceramic capacitors for the industrial electronic parts application using Tape casting method, the dielectric properties as a functions of sintering temperatures and the fabrication conditions of green sheet were investigated to consider the possibility of applications. When the mixing ratio of powder and solvent in slurry was 65:35, the uniform and dense green sheets was obtained. The dielectric constant was increased as the sintering temperature Over 94% of relative density and high were obtained to the specimens sintered at $1000^{\circ}C$. We can find that the device sintered at higher temperature than $1000^{\circ}C$ showed the relative density over 94% and the dielectric constant over 2000.

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Ti/Cu CMP process for wafer level 3D integration (웨이퍼 레벨 3D Integration을 위한 Ti/Cu CMP 공정 연구)

  • Kim, Eunsol;Lee, Minjae;Kim, Sungdong;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.3
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    • pp.37-41
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    • 2012
  • The wafer level stacking with Cu-to-Cu bonding becomes an important technology for high density DRAM stacking, high performance logic stacking, or heterogeneous chip stacking. Cu CMP becomes one of key processes to be developed for optimized Cu bonding process. For the ultra low-k dielectrics used in the advanced logic applications, Ti barrier has been preferred due to its good compatibility with porous ultra low-K dielectrics. But since Ti is electrochemically reactive to Cu CMP slurries, it leads to a new challenge to Cu CMP. In this study Ti barrier/Cu interconnection structure has been investigated for the wafer level 3D integration. Cu CMP wafers have been fabricated by a damascene process and two types of slurry were compared. The slurry selectivity to $SiO_2$ and Ti and removal rate were measured. The effect of metal line width and metal density were evaluated.

Optimum Application Amount, Timing, and Frequency of Slurry Composted and Biofiltered Liquid Fertilizer for Zoysia japonica 'Millock'

  • Park, Suejin;Lee, Seung Youn;Ryu, Ju Hyun;Jung, Hyun Hwan;Kim, Ki Sun
    • Horticultural Science & Technology
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    • v.30 no.6
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    • pp.635-641
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    • 2012
  • In Korea, slurry composted and biofiltered (SCB) liquid fertilizer is produced through the composting and biofiltering of animal waste. An appropriate guidelines involving proper treatment of SCB liquid fertilizer on turfgrass should be considered. An experiment was conducted to determine the optimum application amount, timing, and frequency of SCB liquid fertilizer for Zoysia japonica 'Millock'. The SCB liquid fertilizer was applied in low, medium, and high amount (N at 15, 25, and 40 $g{\cdot}m^{-2}$ per year in 2010, and 10, 20, and 40 $g{\cdot}m^{-2}$ per year in 2011, respectively) and treated during the growing season or dormancy period. During the growing season, SCB liquid fertilizer was applied twice or four times. The greatest improvement in turf quality for both years was in SCB plots applied four times with N at 40 $g{\cdot}m^{-2}$ per year during the growing season (SH4). This treatment exhibited turf color retention in the fall, and enhanced clipping yield during the growing and fall seasons. SCB plots with four times during the growing season (SL4, SM4, and SH4) exhibited higher shoot density relative to the same amount of other SCB treatments. Plots treated during the dormancy period also showed a high turf color index during the next growing season in 2011. The results indicate that SCB with high amount up to N at 40 $g{\cdot}m^{-2}$ per year applied four times during the growing season and dormant application produced high turf quality and growth, and could be recommended as an optimum application guide.

Enrichment of valuable elements from vanadium slag using superconducting HGMS technology

  • He, Sai;Yang, Chang-qiao;Li, Su-qin;Zhang, Chang-quan
    • Progress in Superconductivity and Cryogenics
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    • v.19 no.1
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    • pp.17-21
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    • 2017
  • Vanadium slags is a kind of vanadiferous solid waste from steelmaking process. It not only occupies land, pollutes environment, but also leads to waste of resources. Based on the difference of magnetic susceptibility of different particles caused by their chemical and physical properties from vanadium slag, a new technology, superconducting high gradient magnetic separation was investigated for separation and extraction of valuable substances from vanadium slag. The magnetic concentrate was obtained under optimal parameters, i.e., a particle size -200 mesh, a magnetic flux density of 0.8 T, a slurry concentration of 5 g/L, an amount of steel wools of 25 g and a slurry flow velocity of 2 L/min. The content of $Fe_2O_3$ in concentrate could be increased from 39.6% to 55.0% and $V_2O_5$ from 2.5% to 4.0%, respectively. The recovery rate is up to 42.9%, and the vanadium slag has been effectively reused.

Development of Dry Films of Lead-free Transparent Dielectrics for PDP (PDP용 무연 투명유전체의 Dry Film 개발)

  • Lee Ji-Hun;Bang Jae-Cheol
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.6 no.6
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    • pp.497-501
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    • 2005
  • Dry film method was applied to fabricate lead-free transparent dielectric fur PDP(Plasma Display Panel). From various slurry compositions, it was able to find out the. best composition for producing high density green sheet. The slurry exhibited shear thinning characteristics which are known to be suitable fur producing a high quality green sheet. The thermal expansion coefficient of the fabricated transparent dielectric was measured to be $97{\times}10^{-7}/^{\circ}C$ which is close to the value of the glass substrate(PD-200). Cross sectional SEM of the transparent dielectric layer on PD-200 showed that the two layers were well attached each other with no observable gaps between them.

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Electrochemical Corrosion and Chemical Mechanical Polishing(CMP) Characteristics of Tungsten Film using Mixed Oxidizer (혼합 산화제를 사용한 텅스텐 막의 전기화학적 부식 및 CMP 특성)

  • Na, Eun-Young;Seo, Yong-Jin;Lee, Woo-Sun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.4
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    • pp.303-308
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    • 2005
  • In this paper, the effects of oxidants on tungsten chemical mechanical polishing (CMP) process were investigated using three different oxidizers such as Fe(NO₃)₃, KIO₃ and H₂O₂. Moreover, the interaction between the tungsten film and the oxidizer was discussed by potentiodynamic polarization measurement with three different oxidizers, in order to compare the effects of W-CMP and electrochemical characteristics on the tungsten film as a function of oxidizer. As an experimental result, the tungsten removal rate reached a maximum at 5 wt% Fe(NO₃)₃concentration, and when 5 wt% H₂O₂was added in the slurry, the removal rate of W increased. Also, the microstructures of surface layer by atomic force microscopy(AFM) image were greatly influenced by the slurry chemical composition of oxidizers. It was shown that the surface roughness and removal rate of the polished surface were improved in Fe(NO₃)₃than KIO₃. The electrochemical results indicate that the corrosion current density of the 5 wt% H₂O₂ and 5 wt% H₂O/sub 2+/+ 5 wt% Fe(NO₃)₃was higher than the other oxidizers. Therefore, we conclude that the W-CMP characteristics are strongly dependent on the kinds of oxidizers and the amounts of oxidizer additive.

Preparation of Ce0.8Gd0.2O1.9 Powder by Milling of CeO2 Slurry and Oxalate Precipitation (CeO2 슬러리 분쇄와 옥살산 침전을 이용한 Ce0.8Gd0.2O1.9 분말의 합성)

  • Sim, Soo-Man
    • Journal of the Korean Ceramic Society
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    • v.47 no.2
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    • pp.183-188
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    • 2010
  • $Ce_{0.8}Gd_{0.2}O_{1.9}$(GDC20) powder was synthesized by milling of $CeO_2$ slurry and Gd oxalate precipitation. The mixture of $CeO_2$ powder and Gd precipitates calcined at $600^{\circ}C$ for 2 h showed the particle size distribution similar to that of $CeO_2$ powder, which had been milled during the synthesis process. Attrition milling of the calcined powder with an average particle size of $0.36\;{\mu}m$ for 2 h resulted in a decrease in the particle size to $0.24\;{\mu}m$. Although the milled powder consisted of small particles(<$1\;{\mu}m$), a small amount of fine platy $Gd_2O_3$ particles, which had been survived in the milling process, was observed. Sintering of the powder compacts for 4 h showed relative densities of 80.7% at $1300^{\circ}C$ and 97% at $1400^{\circ}C$, respectively. Densification was found to almost complete at $1500^{\circ}C$, resulting in a dense and homogeneous microstructure with a relative density of 99.5%.

Fabrication of Anode-Supported SOFC Single Cells via Tape-Casting of Thin Tapes and Co-Firing (박막 테이프캐스팅과 동시소성에 의한 연료극 지지형 SOFC 단전지 제조)

  • Moon, Hwan;Kim, Sun-Dong;Hyun, Sang-Hoon;Kim, Ho-Sung
    • Journal of the Korean Ceramic Society
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    • v.43 no.12 s.295
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    • pp.788-797
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    • 2006
  • An anode-supported SOFC single cell having $5{\mu}m$ thin electrolyte was fabricated cost-effectively by tape casting, laminating, and co-filing of anode (NiO-YSZ), cathode (LSM-YSZ), and electrolyte (YSZ) components. The optimal slurry compositions of the green tapes for SOFC components were determined by an analysis of the mean diameter, the slurry viscosity, the tensile strength/strain of the green tapes, and their green microstructures. The single cells with a dense electrolyte and porous electrodes could be co-fired successfully at $1325\sim1350^{\circ}C$ by controlling the contents of pore former and the ratio of coarse YSZ and fine YSZ in the anode and the cathode. The single cell co-fired at $1350^{\circ}C$ showed $100.2mWcm^{-2}$ of maximum power density at $800^{\circ}C$ but it was impossible to apply it to operate at low temperature because of low performance and high ASR, which were attributed to formation of the secondary phases in the cathode and the interface between the electrolyte and the cathode.