• Journal of the Korean Ceramic Society
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• v.46 no.5
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• pp.447-451
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• 2009

Continuous SiC fiber-reinforced SiC composites ($SiC_f$/SiC) were fabricated by electrophoretic deposition (EPD). Nine types of slurries with different powder contents, binder resin amounts and slurry pH were deposited on Tyranno$^{TM}$-SA fabrics by EPD at 135 V for ten minutes to determine the optimal conditions. Further EPD using the optimum slurry conditions was performed on fabrics with four different pyrolitic carbon (PyC) thicknesses. The density of the hot-pressed composites decreased with increasing PyC thickness due to the difficulty of infiltrating the slurry into the narrow gaps between the fibers. On the other hand, the mechanical strength increased with increasing PyC thickness despite the decrease in density, which was explained by the enhanced crack deflection with increasing PyC thickness. The $SiC_f$/SiC composites showed the highest density and flexural strength of 94% and 342 MPa, respectively, showing EPD as a feasible method for dense $SiC_f$/SiC fabrication.

• Journal of the Korean Ceramic Society
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• v.44 no.7
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• pp.349-353
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• 2007

2D SiC fiber-SiC (SiC/SiC) composites were fabricated via slurry infiltration and a stacking process. The effects of the additive composition and content in SiC slurries and the effect of the sintering time on the sintered density and strength of SiC/SiC composites were investigated. A slurry containing $Al_2O_3-Y_2O_3-MgO$ (AYM) additives led to a higher strength compared to a slurry containing $Al_2O_3-Y_2O_3-CaO$ (AYC) additives. The sintered density increased as the sintering time increased and showed a maximum (>98%) at 4 h. In contrast, the flexural strength increased as the sintering time increased and showed a maximum (615 MPa) at 6 h. The relative density and flexural strength increased as the additive content increased.

• Journal of Animal Environmental Science
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• v.7 no.2
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• pp.103-110
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• 2001

This study conducted to monitor decomposition process of the charomatophore pollution solution of an animal slurry by using a CCD camera. After the solution was put into test tube, the images(R, G, B, H, L, S) values of the solution were measured by the imgae processing system, and those of it\`s optical density were measured for three hours to be decomposed by microscopic organism. The values of measured for three hours to be decomposed by microscopic organism. The values of measured images(R, G, B, H, L, S) were analysed and compared with those of the optical density. Some of the results are as follows. 1. High correlation coefficients, which analyzed by using data on linear equations, were 0.9557 and 0.9672. They were decreased regularly in this R-value experiment of RGB level. The microscopic organism in this experiment was effective for decomposition of the red charomatophore pollution solution. 2. The values of all correlation coefficients from relationship between RGB-value and optical density were more than 0.95 except H-values. RGB-values, which were average values of summed R, G, B values, had correlation coefficients of 0.9863, 0.9937. These results showed so good relationship that decomposition process of charomatophore pollution solution could be monitored by a image processing system.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.08a
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• pp.12-14
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP). process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. It is well known that the presence of hard and larger size particles in the CMP slurries increases the defect density and surface roughness of the polished wafers. In this paper, we have studied. aging effect the of CMP slurry as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.37-40
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. It is well known that the presence of hard and larger size particles in the CMP slurries increases the defect density and surface roughness of the polished wafers. In this paper, we have studied aging effect the of CMP slurry as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.389-392
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and non-uniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between particle size and CMP with particle size analysis of used slurry.

• Journal of the Korean Geotechnical Society
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• v.18 no.4
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• pp.249-256
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• 2002

The stability of slurry trench system is closely associated with the characteristics of the filter cake (assumed impervious membrane) transferring the hydrostatic force of slurry to the trench walls. The effectiveness of this assumption in a wide range of trench systems has been examined with the aid of a Finite Element program. Build up of excess porewater pressure in the soil mass behind the filter cake is a function of the slurry density, the properties of filter cake, the ground conditions, time, the geometry of trench and the original ground water level. These factors were all investigated by the Finite Element Method. The most significant factors were found to be the ground conditions and the properties of filter cake.

• The Korean Journal of Ceramics
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• v.5 no.1
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• pp.25-29
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• 1999

Complex viscosities of dense alumina slurries over 45% volume density measured with the oscillating method were correlated well with Casson model. Among several monosaccharides and disaccharides studied here, fructose and sucrose showed good rheological properties in making dense alumina slurry plastic compared to other monosaccharides and disaccharides like glucose, galactose, arabinose, xylose and maltose. Sucrose content or additional water content in dense alumina slurry with sucrose contributed to the plasticity of the slurries.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.182-182
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• 2010

The behavior of properties of ion exchanged substrate glasses was investigated in this study. In order to study the effects of ion exchange, ion exchange behavior with ion penetration depth, amount of ion exchange, density and thermal expansion was measured according to the time and temperature. The mechanical properties were evaluated by the three point bending test and curvature change, and then fracture patterns were investigated by optical microscope.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.12
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• pp.979-986
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• 2001

This paper was researched the effect of slurry stability on the mechanical and electrical property of the porcelain insulator with various raw materials such as feldspar, quartz, clay and l7wt% alumina. The slurry was fabricated after ball milling the mixed raw materials. Green compacts were made by the extrusion and were sintered at 1300$\^{C}$ for 60min in the tunnel kiln. All of the specimens were densified 96% of the theoretical density. The 3-point flexural strength($\sigma$$\_$B/) of the specimen stabilized slurry pH 7.8 was 1650 k9/㎠ and the vickers hardness(Hv) and the fracture toughness(K$\_$IC/) were 27.5 GPa and 2.2 MPa$.$m$\^$$\sfrac{1}{2}$/, respectively. The mechanical properties of the specimen stabilized slurry PH 9.3 were 1716 kg/㎠($\sigma$$\_$B/), 27.6 GPa(Hv) and 3.0 MPa$.$m$\^$$\sfrac{1}{2}$/(K$\_$IC/), respectively. The dielectric strength was increased from 8.3kV/mm to 13.2kV/mm as the increase of the slurry pH from 7.8 to 9.3. Therefore the physical properties of the specimen stabilized slurry pH 9.3 were improved.