• Title/Summary/Keyword: Slicing-Process Simulation

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Printing Time/Material Usage Estimation of 3-D Printer Using Digital Printing Method (디지털 프린팅 방식 3차원 프린터의 출력 시간 및 재료 사용량 예측 방법)

  • Park, Jaeil;Cho, Sungwook;Lee, Gyeorye;Kim, Dusu
    • Korean Journal of Computational Design and Engineering
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    • v.22 no.2
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    • pp.215-221
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    • 2017
  • This paper describes a method of precise estimation for printing time and material consumption which are directly related to the 3D printing cost. Printing process and head motion of 3D printers using digital printing head, which is analyzed by its digitized steps, is rapidly simulated without slicing to calculate estimated printing results. Using this method, printing time and material usage of 3D printer were estimated quickly and precisely and compared to the real printing result. Applying compensation using the printing parameters, transferred from the 3D printer to the printing estimation system, even more accurate estimation is achieved. This method is used in the 3D Sprint software.

Design and Analysis of Technical Management System of Personal Information Security using Web Crawer (웹 크롤러를 이용한 개인정보보호의 기술적 관리 체계 설계와 해석)

  • Park, In-pyo;Jeon, Sang-june;Kim, Jeong-ho
    • Journal of Platform Technology
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    • v.6 no.4
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    • pp.69-77
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    • 2018
  • In the case of personal information files containing personal information, there is insufficient awareness of personal information protection in end-point areas such as personal computers, smart terminals, and personal storage devices. In this study, we use Diffie-Hellman method to securely retrieve personal information files generated by web crawler. We designed SEED and ARIA using hybrid slicing to protect against attack on personal information file. The encryption performance of the personal information file collected by the Web crawling method is compared with the encryption decryption rate according to the key generation and the encryption decryption sharing according to the user key level. The simulation was performed on the personal information file delivered to the external agency transmission process. As a result, we compared the performance of existing methods and found that the detection rate is improved by 4.64 times and the information protection rate is improved by 18.3%.

Improvement of the Adaptive Modulation System with Optimal Turbo Coded V-BLAST Technique using STD Scheme (선택적 전송 다이버시티 기법을 적용한 최적의 터보 부호화된 V-BLAST 적응변조 시스템의 성능 개선)

  • Ryoo, Sang-Jin;Choi, Kwang-Wook;Lee, Kyung-Hwan;You, Cheol- Woo;Hong, Dae-Ki;Hwang, In-Tae;Kim, Cheol-Sung
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.44 no.2
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    • pp.6-14
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    • 2007
  • In this paper, we propose and observe the Adaptive Modulation system with optimal Turbo Coded V-BLAST (Vertical-Bell-lab Layered Space-Time) technique that is applied the extrinsic information from MAP (Maximum A Posteriori) Decoder in decoding Algorithm of V-BLAST: ordering and slicing. The extrinsic information is used by a priori probability and the system decoding process is composed of the Main Iteration and the Sub Iteration. And comparing the proposed system with the Adaptive Modulation system using conventional Turbo Coded V-BLAST technique that is simply combined V-BLAST with Turbo Coding scheme, we observe how much throughput performance has been improved. In addition, we observe the proposed system using STD (Selection Transmit Diversity) scheme. As a result of simulation, Comparing with the conventional Turbo Coded V-BLAST technique with the Adaptive Modulation systems, the optimal Turbo Coded V-BLAST technique with the Adaptive Modulation systems has better throughput gain that is about 350 Kbps in 11 dB SNR range. Especially, comparing with the conventional Turbo Coded V-BLAST technique using 2 transmit and 2 receive antennas, the proposed system with STD (Selection Transmit Diversity) scheme show that the improvement of maximum throughput is about 1.77 Mbps in the same SNR range.

Simulated Optimum Substrate Thicknesses for the BC-BJ Si and GaAs Solar Cells

  • Choe, Kwang-Su
    • Korean Journal of Materials Research
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    • v.22 no.9
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    • pp.450-453
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    • 2012
  • In crystalline solar cells, the substrate itself constitutes a large portion of the fabrication cost as it is derived from semiconductor ingots grown in costly high temperature processes. Thinner wafer substrates allow some cost saving as more wafers can be sliced from a given ingot, although technological limitations in slicing or sawing of wafers off an ingot, as well as the physical strength of the sliced wafers, put a lower limit on the substrate thickness. Complementary to these economical and techno-physical points of view, a device operation point of view of the substrate thickness would be useful. With this in mind, BC-BJ Si and GaAs solar cells are compared one to one by means of the Medici device simulation, with a particular emphasis on the substrate thickness. Under ideal conditions of 0.6 ${\mu}m$ photons entering the 10 ${\mu}m$-wide BC-BJ solar cells at the normal incident angle (${\theta}=90^{\circ}$), GaAs is about 2.3 times more efficient than Si in terms of peak cell power output: 42.3 $mW{\cdot}cm^{-2}$ vs. 18.2 $mW{\cdot}cm^{-2}$. This strong performance of GaAs, though only under ideal conditions, gives a strong indication that this material could stand competitively against Si, despite its known high material and process costs. Within the limitation of the minority carrier recombination lifetime value of $5{\times}10^{-5}$ sec used in the device simulation, the solar cell power is known to be only weakly dependent on the substrate thickness, particularly under about 100 ${\mu}m$, for both Si and GaAs. Though the optimum substrate thickness is about 100 ${\mu}m$ or less, the reduction in the power output is less than 10% from the peak values even when the substrate thickness is increased to 190 ${\mu}m$. Thus, for crystalline Si and GaAs with a relatively long recombination lifetime, extra efforts to be spent on thinning the substrate should be weighed against the expected actual gain in the solar cell output power.

Design Alterations of a Grinder of Semiconductor Wafer for the Improved Stability (반도체 Wafer용 Grinder의 안정화 설계)

  • Kil, Sa Geun;Ro, Seung Hoon;Shin, Yun Ho;Kim, Young Jo;Kim, Geon Hyeong
    • Journal of the Semiconductor & Display Technology
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    • v.16 no.1
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    • pp.91-96
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    • 2017
  • One of the most critical aspects of the modern semiconductor industry is the quality of wafer surface, the roughness of which is mostly caused by the ingot slicing. And the grinding is supposed to be the main process to reduce the surface roughness. The vibrations of the disc surface grinder are the major problem to effectively achieve the required surface quality. In this study, the structure of a disc surface grinder was analyzed through the experiment and the computer simulation to investigate the dynamic characteristics of the machine, and further to alter the design for the improved stability. The result of the study shows that simple design alterations without alternating main body can effectively suppress the vibrations of the machine.

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